Patents by Inventor CHUN-YUAN HSUEH

CHUN-YUAN HSUEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9346196
    Abstract: Disclosed herein are a flexible substrate with surface structure and a method for manufacturing the flexible substrate. The disclosure relates to a low-cost process to manufacturing the flexible substrate that is adapted to the large-area mass production. According to one of the embodiments in the disclosure, the method introduces a mold with surface structure. An isolation material is formed on the mold surface in an earlier stage. Upon the isolation layer, a flexible substrate material is coated. After that, a baking step is employed to cure the flexible substrate material. The flexible substrate with surface structure is therefore formed after de-molding the cured substrate. Another aspect to the disclosure adopts the above-formed substrate to be a base substrate. A second flexible substrate with the surface structure identical to the mold is then formed by performing the above steps.
    Type: Grant
    Filed: May 27, 2012
    Date of Patent: May 24, 2016
    Assignee: NATIONAL TAIWAN UNIVERSITY
    Inventors: Si-Chen Lee, Chieh-Hung Yang, Chun-Yuan Hsueh
  • Publication number: 20130034698
    Abstract: Disclosed herein are a flexible substrate with surface structure and a method for manufacturing the flexible substrate. The disclosure relates to a low-cost process to manufacturing the flexible substrate that is adapted to the large-area mass production. According to one of the embodiments in the disclosure, the method introduces a mold with surface structure. An isolation material is formed on the mold surface in an earlier stage. Upon the isolation layer, a flexible substrate material is coated. After that, a baking step is employed to cure the flexible substrate material. The flexible substrate with surface structure is therefore formed after de-molding the cured substrate. Another aspect to the disclosure adopts the above-formed substrate to be a base substrate. A second flexible substrate with the surface structure identical to the mold is then formed by performing the above steps.
    Type: Application
    Filed: May 27, 2012
    Publication date: February 7, 2013
    Applicant: NATIONAL TAIWAN UNIVERSITY
    Inventors: SI-CHEN LEE, CHIEH-HUNG YANG, CHUN-YUAN HSUEH