Abstract: An embodiment of the disclosure provides an electronic assembly including a stacked structure, a first integrated circuit, a first passive component, and a first electrode. The stacked structure comprises a plurality of insulating layers and a plurality of conductive layers. The first passive component is disposed between the stacked structure and the first integrated circuit. The first electrode is disposed between the stacked structure and the first passive component. The first passive component is electrically connected to the stacked structure through the first electrode.

Abstract: A backlight module includes a light source, a first prism sheet disposed on the light source, and a light type adjustment sheet disposed on a side of the first prism sheet away from the light source and including a base and multiple light type adjustment structures. The multiple light type adjustment structures are disposed on the first surface of the base. Each light type adjustment structure has a first structure surface and a second structure surface connected to each other. The first structure surface of each light type adjustment structure and the first surface of the base form a first base angle therebetween, and the second structure surface of each light type adjustment structure and the first surface of the base form a second base angle therebetween. The angle of the first base angle is different from the angle of the second base angle.

Abstract: A semiconductor device is disclosed herein. The semiconductor device includes a routing structure. The routing structure has an intermediate conductive routing layer. The intermediate conductive routing layer includes a first mesh conductive layer formed in a predetermined second region of the semiconductor device and a second mesh conductive layer formed in a predetermined first region of the semiconductor device. The first mesh conductive layer and the second mesh conductive layer are electrically isolated from each other. The intermediate conductive routing layer further includes multiple first conductive islands formed in the predetermined first region and multiple second conductive islands formed in the predetermined second region.

Abstract: A method of making a semiconductor device includes forming a circuit layer over a substrate. The method further includes depositing an insulator over the substrate. The method further includes patterning the insulator to define a test line trench, a first trench, and a second trench, wherein the first trench is on a portion of the substrate exposed by the circuit layer. The method further includes filling the test line trench to define a test line electrically connected to the circuit layer. The method further includes filling the first trench and the second trench to define a capacitor.

Abstract: An integrated circuit device includes a device layer having devices spaced in accordance with a predetermined device pitch, a first metal interconnection layer disposed above the device layer and coupled to the device layer, and a second metal interconnection layer disposed above the first metal interconnection layer and coupled to the first metal interconnection layer through a first via layer. The second metal interconnection layer has metal lines spaced in accordance with a predetermined metal line pitch, and a ratio of the predetermined metal line pitch to predetermined device pitch is less than 1.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: A plasma-assisted annealing system includes a high temperature furnace, a plasma-induced dissociator and a connecting duct. The plasma-induced dissociator is provided to dissociate a working gas and exhaust the dissociated working gas from its working gas outlet. Both ends of the connecting duct are connected to the working gas outlet of the plasma-induced dissociator and a gas inlet of the high temperature furnace, respectively. The working gas dissociated in the plasma-induced dissociator is introduced into the high temperature furnace via the connecting duct.

Abstract: An electrostatic sensing system configured to sense an electrostatic information of a fluid inside a fluid distribution component and including an electrostatic sensing assembly, a signal amplifier and an analog-to-digital converter. The electrostatic sensing assembly includes a sensing component, and a shield. The sensing component is configured to be disposed at the fluid distribution component. The sensing component is disposed through the fluid distribution component so as to be partially located in the fluid distribution component. The shield surrounds a part of the sensing component that is located in the fluid distribution component. At least part of the shield is located on an upstream side of the sensing component. The signal amplifier is electrically connected to the sensing component. The analog-to-digital converter is electrically connected to the signal amplifier. The shield has an opening spaced apart from the sensing component.

Abstract: An embodiment of the disclosure provides a package device including a redistribution layer, an integrated passive device layer, a first port, and a second port. The integrated passive device layer contacts the redistribution layer. The integrated passive device layer has at least one capacitor. The at least one capacitor includes a first capacitor and a second capacitor. The first port is electrically connected to the first capacitor and the second capacitor. The second port is provided opposite to the first port. The second port is electrically connected to the first capacitor and the second capacitor. The first port and the second port have the same resistance.

Abstract: A lamp assembly includes a lamp, a medium and an assembling piece. The medium is configured to connect the lamp to a carrier. The assembling piece is disposed between the lamp and the medium, and is configured to connect the lamp to the medium, wherein the assembling piece includes a first part and a second part. The first part is configured to non-threadedly connect the lamp with the medium. The second part is configured to release the lamp from the medium.

Abstract: A power supply circuit is configured to supply power to a display panel. The power supply circuit includes a receiver circuit and a transmitter circuit. The receiver circuit is configured to couple the display panel and output a hot plugging signal. The transmitter circuit is configured to receive the hot plugging signal and couple a power circuit. The transmitter circuit is further configured to communicate the receiver circuit to generate an enable signal. The hot plugging signal and the enable signal are configured to control whether a first voltage signal from the power circuit is transmitted to the receiver circuit and the display panel via the transmitter circuit.

Abstract: An embodiment of the disclosure provides a package device including a redistribution layer, an integrated passive device layer, a first port, and a second port. The integrated passive device layer contacts the redistribution layer. The integrated passive device layer has at least one capacitor. The at least one capacitor includes a first capacitor and a second capacitor. The first port is electrically connected to the first capacitor and the second capacitor. The second port is provided opposite to the first port. The second port is electrically connected to the first capacitor and the second capacitor. The first port and the second port have the same resistance.

Abstract: A non-transitory computer readable medium storing at least one program, wherein a wireless communication method is performed while the program is executed. The wireless communication method comprises: (a) receiving a plurality of data groups, wherein the data groups do not pass an error checking procedure; (b) selecting a portion of at least one of the data groups; and (c) reconstructing a reconstruction data group based on the portions selected in the step (b).

Abstract: A non-transitory computer readable medium storing at least one program, wherein a wireless communication method is performed while the program is executed. The wireless communication method comprises: (a) receiving a plurality of data groups, wherein the data groups do not pass an error checking procedure; (b) selecting a portion of at least one of the data groups; and (c) reconstructing a reconstruction data group based on the portions selected in the step (b).

Abstract: The wearable device for sensing a motion parameter of a user includes a first protection cover, a module connector, a wire connecting member, a circuit board and a plurality of spring connectors. The wire connecting member has a plurality of first electrical contacts. The first protection cover is connected to the module connector. The circuit board has a plurality of second electrical contacts corresponding to the plurality of first electrical contacts. The plurality of spring connectors are electrically connected to the plurality of first electrical contacts and the plurality of second electrical contacts correspondingly to form a plurality of first electrical connections and a plurality of second electrical connections respectively, and are configured between the module connector and the circuit board to form a plurality of first pre-deformations.

Abstract: A bonding device for a wearable device includes a first bonding structure and a second bonding structure. The first bonding structure includes a first wire connecting member, a first bonding member and an elastic member, and has a plurality of first mechanical structures configured to form a first mechanical bond and a plurality of first electrical contacts configured to form a first electrical bond, and the second bonding structure includes a first signal connecting line, wherein the first wire connecting member, the first bonding member, and the elastic member form the first mechanical bond through the plurality of first mechanical structures; the first wire connecting member, the first bonding member, and the elastic member form the first electrical bond through the plurality of first electrical contacts; and the elastic member is electrically connected to the first signal connecting line to combine the first bonding structure and the second bonding structure.

Abstract: A conductive ink is provided. The conductive ink includes a precursor, a reducing agent, and a protective agent, and the precursor includes copper isostearate (Cu(C18H36O2)2), wherein based on the total weight of the conductive ink, the content of the precursor is 40 wt % to 75 wt %, the content of the reducing agent is 20 wt % to 32 wt %, and the content of the protective agent is 5 wt % to 40 wt %.

Abstract: A motion recognition device includes a sensing unit and a processing unit. The sensing unit generates a sense signal in response to a body motion occurring at a specific position on a user's body, wherein the sense signal includes a first sense signal portion and a second sense signal portion different from the first sense signal portion, and the body motion belongs to a motion segment of a motion type. The processing unit processes the sense signal to generate a motion parameter signal structure including a fusion signal of the first and the second sense signal portions, and recognizes the specific position to determine an effective reference signal for recognition of the motion type based on the motion parameter signal structure.

Abstract: A motion recognition device includes a sensing unit and a processing unit. The sensing unit generates a sense signal in response to a body motion occurring at a specific position on a user's body, wherein the sense signal includes a first sense signal portion and a second sense signal portion different from the first sense signal portion, and the body motion belongs to a motion segment of a motion type. The processing unit processes the sense signal to generate a motion parameter signal structure including a fusion signal of the first and the second sense signal portions, and recognizes the specific position to determine an effective reference signal for recognition of the motion type based on the motion parameter signal structure.