Patents by Inventor Chun-Yuan Li
Chun-Yuan Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240105744Abstract: An image sensor includes a photoelectric conversion layer, a plurality of deep trench isolations, a first color filter, a first deflector, and a covering layer. The photoelectric conversion layer includes a first photodiode and a second photodiode. The deep trench isolations separate the first photodiode and the second photodiode, in which a pixel dimension is determined by a distance between two adjacent deep trench isolations. The first color filter is disposed on the first photodiode and the second photodiode. The first deflector is disposed on the first color filter. The covering layer covers and surrounds the first deflector. A refractive index of the covering layer is greater than a refractive index of the first deflector, and a difference value between the refractive index of the covering layer and the refractive index of the first deflector is in a range from 0.15 to 0.6.Type: ApplicationFiled: September 28, 2022Publication date: March 28, 2024Inventors: Ching-Hua LI, Chun-Yuan WANG, Zong-Ru TU, Po-Hsiang WANG
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Patent number: 11923205Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.Type: GrantFiled: December 17, 2021Date of Patent: March 5, 2024Assignee: UNITED MICROELECTRONICS CORPORATIONInventors: Kun-Ju Li, Ang Chan, Hsin-Jung Liu, Wei-Xin Gao, Jhih-Yuan Chen, Chun-Han Chen, Zong-Sian Wu, Chau-Chung Hou, I-Ming Lai, Fu-Shou Tsai
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Patent number: 11922058Abstract: Embodiments of a three-dimensional (3D) memory device and a method of operating the 3D memory device are provided. The 3D memory device includes an array of 3D NAND memory cells, an array of static random-access memory (SRAM) cells, and a peripheral circuit. The array of SRAM cells and the peripheral circuit arranged at one side are bonded with the array of 3D NAND memory cells at another side to form a chip. Data is received from a host through the peripheral circuit, buffered in the array of SRAM cells, and transmitted from the array of SRAM cells to the array of 3D NAND memory cells. The data is programmed into the array of 3D NAND memory cells.Type: GrantFiled: December 1, 2021Date of Patent: March 5, 2024Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Yue Ping Li, Wei Jun Wan, Chun Yuan Hou
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Patent number: 9362217Abstract: A method for fabricating a POP structure is disclosed. First, a first package is provided, which has: a dielectric layer; a stacked circuit layer embedded in the dielectric layer and exposed from upper and lower surfaces of the dielectric layer; a plurality of conductive posts and a semiconductor chip disposed on the upper surface of the dielectric layer and electrically connected to the stacked circuit layer; and an encapsulant formed on upper surface of the dielectric layer for encapsulating the semiconductor chip and the conductive posts and having a plurality of openings for exposing top ends of the conductive posts. Then, a second package is disposed on the encapsulant and electrically connected to the conductive posts. The formation of the conductive posts facilitates to reduce the depth of the openings of the encapsulant, thereby reducing the fabrication time and increasing the production efficiency and yield.Type: GrantFiled: May 29, 2014Date of Patent: June 7, 2016Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Pang-Chun Lin, Wei-Ping Wang, Chun-Yuan Li, Shao-tzu Tang, Ying-Chou Tsai
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Patent number: 9177837Abstract: A semiconductor package having electrical connecting structures includes: a conductive layer having a die pad and traces surrounding the die pad; a chip; bonding wires; an encapsulant with a plurality of cavities having a depth greater than the thickness of the die pad and traces for embedding the die pad and the traces therein, and the cavities exposing the die pad and the traces; a solder mask layer formed in the cavities and having a plurality of openings for exposing the trace ends and a portion of the die pad; and solder balls formed in the openings and electrically connected to the trace ends. Engaging the solder mask layer with the encapsulant enhances adhesion strength of the solder mask layer so as to prolong the moisture permeation path and enhance package reliability.Type: GrantFiled: March 21, 2014Date of Patent: November 3, 2015Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Pang-Chun Lin, Chun-Yuan Li, Fu-Di Tang, Chien-Ping Huang, Chun-Chi Ke
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Patent number: 9130064Abstract: A semiconductor package and a method for fabricating the same are provided. A leadframe including a die pad and a plurality of peripheral leads is provided. A carrier, having a plurality of connecting pads formed thereon, is attached to the die pad, wherein a planar size of the carrier s greater than that of the die pad, allowing the connecting pads on the carrier to be exposed from the die pad. At least a semiconductor chip is attached to a side of an assembly including the die pad and the carrier, and is electrically connected to the connecting pads of the carrier and the leads via bonding wires. A package encapsulant encapsulates the semiconductor chip, the bonding wires, a part of the carrier and a part of the leadframe, allowing a bottom surface of the carrier and a part of the leads to be exposed from the package encapsulant.Type: GrantFiled: November 21, 2013Date of Patent: September 8, 2015Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chang-Yueh Chan, Chih-Ming Huang, Chun-Yuan Li, Chih-Hsin Lai
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Publication number: 20150091150Abstract: A method for fabricating a POP structure is disclosed. First, a first package is provided, which has: a dielectric layer; a stacked circuit layer embedded in the dielectric layer and exposed from upper and lower surfaces of the dielectric layer; a plurality of conductive posts and a semiconductor chip disposed on the upper surface of the dielectric layer and electrically connected to the stacked circuit layer; and an encapsulant formed on upper surface of the dielectric layer for encapsulating the semiconductor chip and the conductive posts and having a plurality of openings for exposing top ends of the conductive posts. Then, a second package is disposed on the encapsulant and electrically connected to the conductive posts. The formation of the conductive posts facilitates to reduce the depth of the openings of the encapsulant, thereby reducing the fabrication time and increasing the production efficiency and yield.Type: ApplicationFiled: May 29, 2014Publication date: April 2, 2015Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Pang-Chun Lin, Wei-Ping Wang, Chun-Yuan Li, Shao-tzu Tang, Ying-Chou Tsai
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Patent number: 8981575Abstract: A semiconductor package structure includes: a dielectric layer; a metal layer disposed on the dielectric layer and having a die pad and traces, the traces each including a trace body, a bond pad extending to the periphery of the die pad, and an opposite trace end; metal pillars penetrating the dielectric layer with one ends thereof connecting to the die pad and the trace ends while the other ends thereof protruding from the dielectric layer; a semiconductor chip mounted on the die pad and electrically connected to the bond pads through bonding wires; and an encapsulant covering the semiconductor chip, the bonding wires, the metal layer, and the dielectric layer. The invention is characterized by disposing traces with bond pads close to the die pad to shorten bonding wires and forming metal pillars protruding from the dielectric layer to avoid solder bridging encountered in prior techniques.Type: GrantFiled: March 15, 2013Date of Patent: March 17, 2015Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Pang-Chun Lin, Chun-Yuan Li, Chien-Ping Huang, Chun-Chi Ke
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Patent number: 8873244Abstract: A package structure includes a base body having a first encapsulant and a wiring layer embedded in and exposed from the first encapsulant. The wiring layer has a plurality of conductive traces and a plurality of first electrical contact pads. The first encapsulant has openings for exposing the first electrical contact pads, a chip electrically connected to the wiring layer, and a second encapsulant formed on the base body for covering the chip and the wiring layer, thereby providing an even surface for preventing the encapsulant from cracking when the chip is mounted.Type: GrantFiled: April 13, 2010Date of Patent: October 28, 2014Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Pang-Chun Lin, Hsiao-Jen Hung, Chun-Yuan Li, Chien-Ping Huang, Chun-Chi Ke
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Publication number: 20140206146Abstract: A semiconductor package having electrical connecting structures includes: a conductive layer having a die pad and traces surrounding the die pad; a chip; bonding wires; an encapsulant with a plurality of cavities having a depth greater than the thickness of the die pad and traces for embedding the die pad and the traces therein, and the cavities exposing the die pad and the traces; a solder mask layer formed in the cavities and having a plurality of openings for exposing the trace ends and a portion of the die pad; and solder balls formed in the openings and electrically connected to the trace ends. Engaging the solder mask layer with the encapsulant enhances adhesion strength of the solder mask layer so as to prolong the moisture permeation path and enhance package reliability.Type: ApplicationFiled: March 21, 2014Publication date: July 24, 2014Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Pang-Chun Lin, Chun-Yuan Li, Fu-Di Tang, Chien-Ping Huang, Chun-Chi Ke
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Patent number: 8716861Abstract: A semiconductor package having electrical connecting structures includes: a conductive layer having a die pad and traces surrounding the die pad; a chip; bonding wires; an encapsulant with a plurality of cavities having a depth greater than the thickness of the die pad and traces for embedding the die pad and the traces therein, and the cavities exposing the die pad and the traces; a solder mask layer formed in the cavities and having a plurality of openings for exposing the trace ends and a portion of the die pad; and solder balls formed in the openings and electrically connected to the trace ends. Engaging the solder mask layer with the encapsulant enhances adhesion strength of the solder mask layer so as to prolong the moisture permeation path and enhance package reliability.Type: GrantFiled: February 27, 2013Date of Patent: May 6, 2014Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Pang-Chun Lin, Chun-Yuan Li, Fu-Di Tang, Chien-Ping Huang, Chun-Chi Ke
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Publication number: 20140080264Abstract: A semiconductor package and a method for fabricating the same are provided. A leadframe including a die pad and a plurality of peripheral leads is provided. A carrier, having a plurality of connecting pads formed thereon, is attached to the die pad, wherein a planar size of the carrier s greater than that of the die pad, allowing the connecting pads on the carrier to be exposed from the die pad. At least a semiconductor chip is attached to a side of an assembly including the die pad and the carrier, and is electrically connected to the connecting pads of the carrier and the leads via bonding wires. A package encapsulant encapsulates the semiconductor chip, the bonding wires, a part of the carrier and a part of the leadframe, allowing a bottom surface of the carrier and a part of the leads to be exposed from the package encapsulant.Type: ApplicationFiled: November 21, 2013Publication date: March 20, 2014Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTDInventors: Chang-Yueh Chan, Chih-Ming Huang, Chun-Yuan Li, Chih-Hsin Lai
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Patent number: 8618641Abstract: A semiconductor package and a method for fabricating the same are provided. A leadframe including a die pad and a plurality of peripheral leads is provided. A carrier, having a plurality of connecting pads formed thereon, is attached to the die pad, wherein a planar size of the carrier is greater than that of the die pad, allowing the connecting pads on the carrier to be exposed from the die pad. At least a semiconductor chip is attached to a side of an assembly including the die pad and the carrier, and is electrically connected to the connecting pads of the carrier and the leads via bonding wires. A package encapsulant encapsulates the semiconductor chip, the bonding wires, a part of the carrier and a part of the leadframe, allowing a bottom surface of the carrier and a part of the leads to be exposed from the package encapsulant.Type: GrantFiled: August 11, 2008Date of Patent: December 31, 2013Assignee: Siliconware Precision Industries Co., LtdInventors: Chang-Yueh Chan, Chih-Ming Huang, Chun-Yuan Li, Chih-Hsin Lai
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Patent number: 8421199Abstract: A semiconductor package structure includes: a dielectric layer; a metal layer disposed on the dielectric layer and having a die pad and traces, the traces each including a trace body, a bond pad extending to the periphery of the die pad, and an opposite trace end; metal pillars penetrating the dielectric layer with one ends thereof connecting to the die pad and the trace ends while the other ends thereof protruding from the dielectric layer; a semiconductor chip mounted on the die pad and electrically connected to the bond pads through bonding wires; and an encapsulant covering the semiconductor chip, the bonding wires, the metal layer, and the dielectric layer. The invention is characterized by disposing traces with bond pads close to the die pad to shorten bonding wires and forming metal pillars protruding from the dielectric layer to avoid solder bridging encountered in prior techniques.Type: GrantFiled: April 29, 2010Date of Patent: April 16, 2013Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Pang-Chun Lin, Chun-Yuan Li, Chien-Ping Huang, Chun-Chi Ke
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Patent number: 8390118Abstract: A semiconductor package having electrical connecting structures includes: a conductive layer having a die pad and traces surrounding the die pad; a chip; bonding wires; an encapsulant with a plurality of cavities having a depth greater than the thickness of the die pad and traces for embedding the die pad and the traces therein, and the cavities exposing the die pad and the traces; a solder mask layer formed in the cavities and having a plurality of openings for exposing the trace ends and a portion of the die pad; and solder balls formed in the openings and electrically connected to the trace ends. Engaging the solder mask layer with the encapsulant enhances adhesion strength of the solder mask layer so as to prolong the moisture permeation path and enhance package reliability.Type: GrantFiled: August 19, 2010Date of Patent: March 5, 2013Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Pang-Chun Lin, Chun-Yuan Li, Fu-Di Tang, Chien-Ping Huang, Chun-Chi Ke
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Patent number: 8304268Abstract: A fabrication method of a semiconductor package structure includes: patterning a metal plate having first and second surfaces; forming a dielectric layer on the metal plate; forming a metal layer on the first surface and the dielectric layer; forming metal pads on the second surface, the metal layer having a die pad and traces each having a bond pad; mounting a semiconductor chip on the die pad, followed by connecting electrically the semiconductor chip to the bond pads through bonding wires; forming an encapsulant to cover the semiconductor chip and the metal layer; removing portions of the metal plate not covered by the metal pads so as to form metal pillars; and performing a singulation process. The fabrication method is characterized by disposing traces with bond pads close to the die pad to shorten the bonding wires and forming metal pillars protruding from the dielectric layer to avoid solder bridging.Type: GrantFiled: April 29, 2010Date of Patent: November 6, 2012Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Pang-Chun Lin, Chun-Yuan Li, Chien-Ping Huang, Chun-Chi Ke
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Publication number: 20110157851Abstract: A package structure includes a base body having a first encapsulant and a wiring layer embedded in and exposed from the first encapsulant. The wiring layer has a plurality of conductive traces and a plurality of first electrical contact pads. The first encapsulant has openings for exposing the first electrical contact pads, a chip electrically connected to the wiring layer, and a second encapsulant formed on the base body for covering the chip and the wiring layer, thereby providing an even surface for preventing the encapsulant from cracking when the chip is mounted.Type: ApplicationFiled: April 13, 2010Publication date: June 30, 2011Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Pang-Chun Lin, Hsiao-Jen Hung, Chun-Yuan Li, Chien-Ping Huang, Chun-Chi Ke
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Publication number: 20110156227Abstract: A semiconductor package structure includes: a dielectric layer; a metal layer disposed on the dielectric layer and having a die pad and traces, the traces each including a trace body, a bond pad extending to the periphery of the die pad, and an opposite trace end; metal pillars penetrating the dielectric layer with one ends thereof connecting to the die pad and the trace ends while the other ends thereof protruding from the dielectric layer; a semiconductor chip mounted on the die pad and electrically connected to the bond pads through bonding wires; and an encapsulant covering the semiconductor chip, the bonding wires, the metal layer, and the dielectric layer. The invention is characterized by disposing traces with bond pads close to the die pad to shorten bonding wires and forming metal pillars protruding from the dielectric layer to avoid solder bridging encountered in prior techniques.Type: ApplicationFiled: April 29, 2010Publication date: June 30, 2011Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Pang-Chun Lin, Chun-Yuan Li, Chien-Ping Huang, Chun-Chi Ke
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Publication number: 20110159643Abstract: A fabrication method of a semiconductor package structure includes: patterning a metal plate having first and second surfaces; forming a dielectric layer on the metal plate; forming a metal layer on the first surface and the dielectric layer; forming metal pads on the second surface, the metal layer having a die pad and traces each having a bond pad; mounting a semiconductor chip on the die pad, followed by connecting electrically the semiconductor chip to the bond pads through bonding wires; forming an encapsulant to cover the semiconductor chip and the metal layer; removing portions of the metal plate not covered by the metal pads so as to form metal pillars; and performing a singulation process. The fabrication method is characterized by disposing traces with bond pads close to the die pad to shorten the bonding wires and forming metal pillars protruding from the dielectric layer to avoid solder bridging.Type: ApplicationFiled: April 29, 2010Publication date: June 30, 2011Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Pang-Chun Lin, Chun-Yuan Li, Chien-Ping Huang, Chun-Chi Ke
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Publication number: 20110156252Abstract: A semiconductor package having electrical connecting structures includes: a conductive layer having a die pad and traces surrounding the die pad; a chip; bonding wires; an encapsulant with a plurality of cavities having a depth greater than the thickness of the die pad and traces for embedding the die pad and the traces therein, and the cavities exposing the die pad and the traces; a solder mask layer formed in the cavities and having a plurality of openings for exposing the trace ends and a portion of the die pad; and solder balls formed in the openings and electrically connected to the trace ends. Engaging the solder mask layer with the encapsulant enhances adhesion strength of the solder mask layer so as to prolong the moisture permeation path and enhance package reliability.Type: ApplicationFiled: August 19, 2010Publication date: June 30, 2011Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Pang-Chun Lin, Chun-Yuan Li, Fu-Di Tang, Chien-Ping Huang, Chun-Chi Ke