Abstract: Provided are semiconductor devices that include a first gate structure having a first end cap portion, a second gate structure having a second end cap portion coaxial with the first gate structure, a first dielectric region separating the first end cap portion and the second end cap portion, a first conductive element extending over the first gate structure, a second conductive element extending over the second gate structure, and a gate via electrically connecting the second gate structure and the second conductive element, with the first dielectric region having a first width and being positioned at least partially under the first conductive element and defines a spacing between the gate via and an end of the second end cap portion that exceeds a predetermined distance.

Abstract: A plasma-assisted annealing system includes a high temperature furnace, a plasma-induced dissociator and a connecting duct. The plasma-induced dissociator is provided to dissociate a working gas and exhaust the dissociated working gas from its working gas outlet. Both ends of the connecting duct are connected to the working gas outlet of the plasma-induced dissociator and a gas inlet of the high temperature furnace, respectively. The working gas dissociated in the plasma-induced dissociator is introduced into the high temperature furnace via the connecting duct.

Abstract: A fixing device includes a clamping portion and a plurality of suction cups mounted on a bottom surface of the clamping portion. The clamping portion defines a through hole extending through a top surface and the bottom surface of the clamping portion. A plurality of clamping pieces extends from an inner surface bounding the through hole toward the axis of the through hole to clamp the probe extending through the through hole. The suction cups are arranged around the through hole.

Abstract: A buck converter configured for converting a voltage output from a power supply to a load includes a first switch, a second switch, an inductor, three compensators and a control microchip. The first switch and the second switch are connected in series between two ends of the power supply. A first end of the inductor is connected to a node between the first switch and the second switch; a second end of the inductor serves as an output terminal connected to the load. The compensators are correspondingly connected to the first switch, the second switch and the inductor. The control microchip is electrically connected to the first and second switches and the node. The control microchip controls the first and second switches to turn on or off, and executes a current protective process when output current of the output terminal exceeds a current protective threshold of the load.

Abstract: A solid capacitor includes a body, a strip-shaped positive connection terminal and a strip-shaped negative connection terminal extending from the body comprising. Length directions of the positive connection terminal and the negative connection terminal are substantially parallel with each other while width directions of the positive connection terminal and the negative connection terminal are substantially perpendicular to each other.

Abstract: An exemplary heat dissipation structure includes a circuit board, at least one electronic element, and a heat sink. The electronic element is mounted on the circuit board to form a circuit. The heat sink is mounted on the circuit board corresponding to the electronic element to dissipate heat generated by the electronic element. The heat sink is mounted by surface mount technology.

Abstract: A printed circuit board includes a power supply, a plurality of loads, a copper sheet, and a plurality of metal sheets mounted onto the copper sheet. The copper sheet is electronically connected between the power supply and the loads. The power supply outputs a plurality of currents to the loads via a plurality of current traces passing through the copper sheet, the plurality of metal sheets are located along the plurality of current traces.

Abstract: A printed circuit board (PCB) includes a bank or matrix of multi-layer ceramic capacitors (MLCCs). Each MLCC includes positive and negative electrodes respectively connected to a power layer and a ground layer of the PCB through two positive and two negative vias. A portion of the positive vias and a portion of the negative vias utilized by the same column of MLCCs are arranged in two separated lines along the flowing direction of current streams in the power layer.

Abstract: An oscilloscope includes a number of probe assemblies. Each probe assembly includes a probe and a connecting member. The connecting member includes a first connecting portion that may be coiled around the probe and a second connecting portion. The probes are connected together by the connecting members, and can be grounded by soldering one of the second connecting portions to a ground plane.

Abstract: A buck converter configured for converting a voltage output from a power supply to a load includes a first switch, a second switch, an inductor, three compensators and a control microchip. The first switch and the second switch are connected in series between two ends of the power supply. A first end of the inductor is connected to a node between the first switch and the second switch; a second end of the inductor serves as an output terminal connected to the load. The compensators are correspondingly connected to the first switch, the second switch and the inductor. The control microchip is electrically connected to the first and second switches and the node. The control microchip controls the first and second switches to turn on or off, and executes a current protective process when output current of the output terminal exceeds a current protective threshold of the load.

Abstract: A printed circuit board (PCB) includes a bank or matrix of multi-layer ceramic capacitors (MLCCs). Each MLCC includes positive and negative electrodes respectively connected to a power layer and a ground layer of the PCB through two positive and two negative vias. A portion of the positive vias and a portion of the negative vias utilized by the same column of MLCCs are arranged in two separated lines along the flowing direction of current streams in the power layer.

Abstract: An oscilloscope includes a number of probe assemblies. Each probe assembly includes a probe and a connecting member. The connecting member includes a first connecting portion that may be coiled around the probe and a second connecting portion. The probes are connected together by the connecting members, and can be grounded by soldering one of the second connecting portions to a ground plane.