Patents by Inventor Chun-Yueh Lin

Chun-Yueh Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240087902
    Abstract: The present disclosure is directed to methods and devices for devices including multiple die. A wafer is received having a plurality of die and a plurality of scribe lines. A dicing process is performed on the wafer. The dicing process includes identifying a first scribe line of the plurality of scribe lines, the first scribe line interposing a first die and a second die of the plurality of die; and performing a partial cut on the first scribe line. In embodiments, other scribe lines of the wafer are, during the dicing process, fully cut. After the dicing, the first die and the second die are mounted on a substrate such as an interposer. The first die and the second die are connected by a portion of the first scribe line, e.g., remaining from the partial cut, during the mounting.
    Type: Application
    Filed: January 19, 2023
    Publication date: March 14, 2024
    Inventors: Chieh-Lung LAI, Meng-Liang LIN, Chun-Yueh YANG, Hsien-Wei CHEN
  • Publication number: 20240079356
    Abstract: An integrated circuit package includes an interposer, the interposer including: a first redistribution layer, a second redistribution layer over the first redistribution layer in a central region of the interposer, a dielectric layer over the first redistribution layer in a periphery of the interposer, the dielectric layer surrounding the second redistribution layer in a top-down view, a third redistribution layer over the second redistribution layer and the dielectric layer, and a first direct via extending through the dielectric layer. A conductive feature of the third redistribution layer is coupled to a conductive feature of the first redistribution layer through the first direct via.
    Type: Application
    Filed: January 9, 2023
    Publication date: March 7, 2024
    Inventors: Hsien-Wei Chen, Chieh-Lung Lai, Meng-Liang Lin, Chun-Yueh Yang, Shin-Puu Jeng
  • Patent number: 11309159
    Abstract: The present invention discloses a structure of an emitter electrode for enhancing ion currents, including a tip end part and a shank part. The tip end part has a pinpoint, a first diameter, and a radius of curvature. A length of the tip end part with the shank part is from the pinpoint to a first position of the shank part and a distance between the first position and the pinpoint is 300 times the first diameter. The radius of curvature of the tip end part ranges from 50 nanometers to 5 micrometers. The first diameter is 2 times the radius of curvature.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: April 19, 2022
    Assignee: ALES TECH INC.
    Inventors: Wei-Chaio Lai, Chun-Yueh Lin, Ing-Shouh Hwang, Wei-Tse Chang, Ching-Yu Hsiao, Yu-Fong Yu, Zong-Yu Yang
  • Publication number: 20220068583
    Abstract: The present invention discloses a structure of an emitter electrode for enhancing ion currents, including a tip end part and a shank part. The tip end part has a pinpoint, a first diameter, and a radius of curvature. A length of the tip end part with the shank part is from the pinpoint to a first position of the shank part and a distance between the first position and the pinpoint is 300 times the first diameter. The radius of curvature of the tip end part ranges from 50 nanometers to 5 micrometers. The first diameter is 2 times the radius of curvature.
    Type: Application
    Filed: August 23, 2021
    Publication date: March 3, 2022
    Inventors: Wei-Chaio Lai, Chun-Yueh Lin, Ing-Shouh Hwang, Wei-Tse Chang, Ching-Yu Hsiao, Yu-Fong Yu, Zong-Yu Yang