Patents by Inventor Chuncheng GONG

Chuncheng GONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stiffener ring and surface packaging assembly
    Patent number: 12232250
    Abstract: This application provides a stiffener ring and a surface packaging assembly. The stiffener ring is configured to correct warpage of a substrate of the surface packaging assembly. The stiffener ring includes an annular stiffener ring body and an adjustment block that is disposed at a same layer as the stiffener ring body and that is fastened to at least one corner of the stiffener ring body. A coefficient of thermal expansion of the adjustment block is less than a coefficient of thermal expansion of the stiffener ring body. Coordination between the adjustment block and the stiffener ring body alleviates an “M-shape” overpressure phenomenon of a warpage deformation caused by the stiffener ring to the substrate at a high temperature, reduces warpage of the substrate, and improves flatness of the surface packaging assembly.
    Type: Grant
    Filed: October 27, 2022
    Date of Patent: February 18, 2025
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chuncheng Gong, Li Fan, Weijin Pan, Junwei Mu, Ge Zhang
  • STIFFENER RING AND SURFACE PACKAGING ASSEMBLY
    Publication number: 20230066053
    Abstract: This application provides a stiffener ring and a surface packaging assembly. The stiffener ring is configured to correct warpage of a substrate of the surface packaging assembly. The stiffener ring includes an annular stiffener ring body and an adjustment block that is disposed at a same layer as the stiffener ring body and that is fastened to at least one corner of the stiffener ring body. A coefficient of thermal expansion of the adjustment block is less than a coefficient of thermal expansion of the stiffener ring body. Coordination between the adjustment block and the stiffener ring body alleviates an “M-shape” overpressure phenomenon of a warpage deformation caused by the stiffener ring to the substrate at a high temperature, reduces warpage of the substrate, and improves flatness of the surface packaging assembly.
    Type: Application
    Filed: October 27, 2022
    Publication date: March 2, 2023
    Inventors: Chuncheng GONG, Li FAN, Weijin PAN, Junwei MU, Ge ZHANG