Abstract: A package structure is provided. The package structure includes a substrate, a first electronic component, a first electrical connector, and a protective layer. The first electronic component is over the substrate. The first electrical connector is between the substrate and the first electronic component. The protective layer encapsulates the first electrical connector. The protective layer has a first curved lateral surface concave toward the first electrical connector and recessed with respect to a lateral surface of the first electronic component.

Abstract: A medical image analysis system comprises: a database for storing a first medical image data indicating a target medical image; and a server for accessing the database. The server includes: a first analysis module for generating a first determination data according to the first medical image data; a second analysis module for generating a second determination data according to the first medical image data; and an ensemble module communicatively connected with the first and second analysis modules and generating a third determination data according to the first and second determination data. The first and second determination data each indicate whether the target medical image includes a cancerous tissue image or indicate a chance of the target medical image including a cancerous tissue image. The third determination data indicates whether the target medical image includes a cancerous tissue image.

Abstract: Methods and systems for joining multiple workpieces are provided. In one example, the method includes dispensing adhesive on a first workpiece. A second workpiece is contacted with the adhesive such that the adhesive is disposed between the first and second workpieces. Resistance heating is produced in the first and second workpieces at first processing conditions to partially cure the adhesive and affix the first and second workpieces together to form a partially cured, adhesive-joined workpiece assembly. The partially cured, adhesive-joined workpiece assembly is exposed to heat at second processing conditions to substantially fully cure the adhesive.

Abstract: A semiconductor device includes a channel structure, source region, a drain region, metal gate structure, and a self-assembled layer. The source region and the drain region are on opposite sides of the channel structure. A bottom surface of the source region is lower than a bottom surface of the channel structure, and a top surface of the source region is higher than a top surface of the channel structure. The metal gate structure covers the channel structure and between the source region and the drain region. The self-assembled layer is between the source region and the metal gate structure. The self-assembled layer is in contact with the bottom surface of the channel structure but spaced apart from the top surface of the channel structure.

Abstract: A semiconductor packaging substrate comprises a crack-inhibiting dielectric frame and a plurality of interconnect units each including electrically conductive posts and an interfacial dielectric layer. These interconnect units are formed within separate compartments defined by the crack-inhibiting dielectric frame. The interfacial dielectric layer laterally covers and surrounds sidewalls of the electrically conductive posts. By using a crack-inhibiting dielectric frame instead of a conventional metal frame, structural warpage can be suppressed during the application of the interfacial dielectric layer.

Abstract: A target detection method for blind areas of a vehicle includes acquiring a real-time image of one of the blind areas of a vehicle; determining a region of interest (ROI) image based on the real-time image; determine a image to be detected based on the ROI image and the real-time image; inputting the image to be detected to a target detection model to generate a first detection box in the first scaled image corresponding to a detection target in the real-time image and a second detection box in the second scaled image corresponding to the detection target in the ROI image; and determining a detection result for the blind area of the vehicle based on the first detection box and the second detection box.

Abstract: An inflatable product includes an external wall. The external wall includes a plurality of parts. The parts include a plurality of edges. The plurality of edges are connected to each other. At least one of the edges is not straight wherein the edge includes a concave portion, a convex portion and/or a flat portion.

Abstract: A foldable supporting device includes first and second supporting frames, first and second movable elements, a first foldable structure, and first and second rotatable elements. The first supporting frame includes a first upper part and a first lower part. The second supporting frame includes a second upper part and a second lower part. The first movable element and the second movable elements are respectively movable along the first lower part and the second lower part. The first foldable structure connects to the first movable element and the second movable element. The first rotatable element is connected to the first supporting frame and the first foldable structure. The second rotatable element is connected to the second supporting frame and the first foldable structure. The first rotatable element and the second rotatable element are respectively rotatable with respect to the first supporting frame and the second supporting frame.

Abstract: A method for early warning a blind area of a vehicle. In the method, the electronic device obtains at least one target image acquired by at least one camera of the vehicle. The electronic device further determines parameters of at least one target object in each of the at least one target image and a three-dimensional detection frame for each of the at least one target object based on the parameters. The electronic device further obtains a target detection frame of each of the at least one target object in a top view image of a plane where the vehicle is located by projecting the three-dimensional detection frame into the top view image and outputs alert information in response that an overlapped area exists between the target detection frame and a preset blind area of the top view image.

Abstract: A display may include an array of pixels such as light-emitting diode pixels. The pixels may include multiple circuitry decks that each include one or more circuit components such as transistors, capacitors, and/or resistors. The circuitry decks may be vertically stacked. Each circuitry deck may include a planarization layer formed from a siloxane material that conforms to underlying components and provides a planar upper surface. In this way, circuitry components may be vertically stacked to mitigate the size of each pixel footprint. The circuitry components may include capacitors that include both a high-k dielectric layer and a low-k dielectric layer. The display pixel may include a via with a width of less than 1 micron.

Abstract: In a method of manufacturing a semiconductor device, a mask pattern is formed over a target layer to be etched, and the target layer is etched by using the mask pattern as an etching mask. The etching is performed by using an electron cyclotron resonance (ECR) plasma etching apparatus, the ECR plasma etching apparatus includes one or more coils, and a plasma condition of the ECR plasma etching is changed during the etching the target layer by changing an input current to the one or more coils.

Abstract: A semiconductor device includes a first fin and a second fin in a first direction and aligned in the first direction over a substrate, an isolation insulating layer disposed around lower portions of the first and second fins, a first gate electrode extending in a second direction crossing the first direction and a spacer dummy gate layer, and a source/drain epitaxial layer in a source/drain space in the first fin. The source/drain epitaxial layer is adjacent to the first gate electrode and the spacer dummy gate layer with gate sidewall spacers disposed therebetween, and the spacer dummy gate layer includes one selected from the group consisting of silicon nitride, silicon oxynitride, silicon carbon nitride, and silicon carbon oxynitride.

Abstract: The present application provides a detaching and installing device for a gas distribution plate of an etching machine, and the etching machine, and relates to the field of semiconductor manufacturing technologies, aiming at addressing the problems that it is quite difficult to detach and install the gas distribution plate of the etching machine and that the gas distribution plate is highly likely to be polluted. The detaching and installing device for the gas distribution plate of the etching machine includes a gripping member, a connecting member and a fixing member, the fixing member is detachably connected to the gas distribution plate of the etching machine, and the gripping member and the fixing member are connected through the connecting member; the gripping member is provided thereon with a gripping portion for grip by a user hand.

Abstract: A semiconductor device includes a plurality of semiconductor layers arranged one above another, and source/drain epitaxial regions on opposite sides of the plurality of semiconductor layers. The semiconductor device further includes a gate structure surrounding each of the plurality of semiconductor layers. The gate structure includes interfacial layers respectively over the plurality of semiconductor layers, a high-k dielectric layer over the interfacial layers, and a gate metal over the high-k dielectric layer. The gate structure further includes gate spacers spacing apart the gate structure from the source/drain epitaxial regions. A top position of the high-k dielectric layer is lower than top positions of the gate spacers.

Abstract: A replaceable electronic device protecting casing includes a front covering pressure plate having an outer frame; a plurality of first screwing holes arranged around the outer frame; a transparent protective film installed in an inner side of a hollow portion of the outer frame; a plurality of second screwing holes arranged around an outer side of the transparent protective film; a waterproof strip attached on an inner side of the transparent protective film; a back seat including a seat body forming a frame body; a plurality of third screwing holes arranged around the frame body; a plurality of screwing units installed in the first screwing holes; and wherein each of the screwing units passes through a respective one first screwing hole, a respective one second screwing hole and a respective one third screwing hole to assemble the front covering pressure plate, the transparent protective film and the back seat.

Abstract: Provided are semiconductor devices and methods for fabricating such devices. An exemplary method includes forming a fin structure over a semiconductor material; forming a sacrificial layer over the semiconductor material; removing a portion of the fin structure and an overlying portion of the sacrificial layer located over the portion of the fin structure to form a trench; forming an insulation structure in the trench, wherein an adjacent portion of the sacrificial layer is adjacent an end wall of the insulation structure; removing the adjacent portion to form a cavity partially defined by the end wall; lining the cavity with a liner, wherein an end portion of the liner is located on the end wall of the insulation structure; filling the cavity with a fill material; removing the end portion of the liner to form an opening; and forming an end isolation structure in the opening.

Abstract: Provided are a system and a method for cardiovascular risk prediction, where artificial intelligence is utilized to perform segmentation on non-contrast or contrast medical images to identify precise regions of the heart, pericardium, and aorta of a subject, such that the adipose tissue volume and calcium score can be derived from the medical images to assist in cardiovascular risk prediction. Also provided is a computer readable medium for storing a computer executable code to implement the method.

Abstract: A capacitor structure includes a contact layer having first, second, third, fourth and fifth portions arranged from periphery to center, an insulating layer over the contact layer and having an opening exposing the contact layer, a bottom conductive plate in the opening, a dielectric layer conformally on the bottom conductive plate and contacting the second and fourth portions of the contact layer, and a top conductive plate on the dielectric layer. The bottom conductive plate includes first, second and third portions extending along a depth direction of the opening, separated from each other, and contacting the first, third and fifth portions of the contact layer, respectively. The first portion of the bottom conductive plate surrounds the second portion of the bottom conductive plate, and the second portion of the bottom conductive plate surrounds the third portion of the bottom conductive plate.

Abstract: A software architecture where the software architecture processes a method, wherein the method includes defining initial conditions for a set of Büttiker probes. The set of Büttiker probes include various interaction equations between one or several many-body systems. The method includes computing properties of particles with quantum transport methods. A quantum transport method of the quantum transport methods include a set of Büttiker probes. The particles include the particles of one or several many-body systems. Further, the method includes calculating a current for each Büttiker probe of the set of Büttiker probes. The current includes at least one of momentum current, particle current, energy current, spin current, color charge or chirality current. The method includes setting up a set of continuity equations such that for each continuity equation a calculated current of a Büttiker probe is in a particular relation with an another calculated current of an another Büttiker probe.

Abstract: An air couch bed includes a first inflatable body. The first inflatable body includes a first wall, a second wall disposed opposite to the first wall, and a third wall connecting the first wall and the second wall. The second wall defines a concave space, by virtue of which the first inflatable body is bendable. The concave space is extended to the third wall. The first inflatable body is an air bed when the first inflatable body is flattened, and is an air couch when the first inflatable body is bent.