Patents by Inventor Chung-Bi LEE

Chung-Bi LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation system of portable electronic device
    Patent number: 11416047
    Abstract: A heat dissipation system of a portable electronic device including a first processing element, a second processing element, a heat dissipation module located between the first processing element and the second processing element, a first heat transferring member, and a second heat transferring member, is provided. The first processing element has a first region and a second region. The first heat transferring member is in thermal contact with the first region, the second processing element, and the heat dissipation module. The second heat transferring member is in thermal contact with the second region and the heat dissipation module.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: August 16, 2022
    Assignees: Micro-Star International Co., Ltd., MSI Computer (Shenzhen) Co., Ltd
    Inventors: Yu An Wang, Chun Mo Wu, Chih-Shiang Hsu, Wei En Kao, Shuan-Cheng Su, Kung Ming Shen, Chia Chun Lin, Chung-Bi Lee, Huan-Jung Lee, Cheng-Lung Chen, Chia Hao Yeh
  • Electronic apparatus shell cover
    Patent number: 10838465
    Abstract: An electronic apparatus shell cover includes a body, a dust blocking screen, and a plurality of structural ribs. The body includes an opening and a plurality of assembling grooves. The opening penetrates through the body. The assembling grooves are on a second surface of the body and adjacent to the opening. The dust blocking screen includes a screen surface and a plurality of assembling parts. The screen surface is mounted in the opening and coplanar with a first surface of the body. The assembling parts are disposed in the assembling grooves. The structural ribs are connected to the first surface of the body and on the dust blocking screen. The dust blocking screen is coplanar with the first surface, and the internal accommodating space of the electronic apparatus shell cover is increased. Furthermore, the structural ribs can increase mechanical strength of the shell cover, can enhance heat exchange efficiency.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: November 17, 2020
    Assignees: MICRO-STAR INT'L CO., LIMITED., MSI ELECTRONIC (KUN SHAN) CO., LTD.
    Inventors: Chung-Bi Lee, Ming-Kan Chang, Guo-Chen Hsieh, Jia-Jun Hong
  • ELECTRONIC APPARATUS SHELL COVER
    Publication number: 20200285283
    Abstract: An electronic apparatus shell cover includes a body, a dust blocking screen, and a plurality of structural ribs. The body includes an opening and a plurality of assembling grooves. The opening penetrates through the body. The assembling grooves are on a second surface of the body and adjacent to the opening. The dust blocking screen includes a screen surface and a plurality of assembling parts. The screen surface is mounted in the opening and coplanar with a first surface of the body. The assembling parts are disposed in the assembling grooves. The structural ribs are connected to the first surface of the body and on the dust blocking screen. The dust blocking screen is coplanar with the first surface, and the internal accommodating space of the electronic apparatus shell cover is increased. Furthermore, the structural ribs can increase mechanical strength of the shell cover, can enhance heat exchange efficiency.
    Type: Application
    Filed: May 23, 2019
    Publication date: September 10, 2020
    Inventors: Chung-Bi LEE, Ming-Kan CHANG, Guo-Chen HSIEH, Jia-Jun HONG