Patents by Inventor Chung C. Key

Chung C. Key has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for solder crack deflection
    Patent number: 7923125
    Abstract: An apparatus that includes a first component defining an interior of the apparatus; a first solder composition exterior to the first component; a second solder composition exterior to the first solder composition and the first component; and a second component exterior to the second solder composition, the first solder composition, and the first component.
    Type: Grant
    Filed: March 13, 2007
    Date of Patent: April 12, 2011
    Assignee: Intel Corporation
    Inventors: Chung C. Key, Mustapha Mohd. Faizul, Tan Siew Sang
  • Copper ring solder mask defined ball grid array pad
    Patent number: 7230339
    Abstract: A ball grid array device includes a substrate, further including a first major surface and a second major surface. An array of pads is positioned on one of the first major surface or the second major surface. At least some of the pads include a raised ring. The raised ring circumscribes the pad or surrounds an interior pad or land on the substrate.
    Type: Grant
    Filed: March 28, 2003
    Date of Patent: June 12, 2007
    Assignee: Intel Corporation
    Inventors: Chung C. Key, Leong Kum Foo, PangToh Tien
  • Method for solder crack deflection
    Patent number: 7223633
    Abstract: An apparatus that includes a first component defining an interior of the apparatus; a first solder composition exterior to the first component; a second solder composition exterior to the first solder composition and the first component; and a second component exterior to the second solder composition, the first solder composition, and the first component.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: May 29, 2007
    Assignee: Intel Corporation
    Inventors: Chung C. Key, Mustapha Mohd. Faizul, Tan Siew Sang
  • Copper ring solder mask defined ball grid array pad
    Publication number: 20040188836
    Abstract: A ball grid array device includes a substrate, further including a first major surface and a second major surface. An array of pads is positioned on one of the first major surface or the second major surface. At least some of the pads include a raised ring. The raised ring circumscribes the pad or surrounds an interior pad or land on the substrate.
    Type: Application
    Filed: March 28, 2003
    Publication date: September 30, 2004
    Applicant: Intel Corporation
    Inventors: Chung C. Key, Leong Kum Foo, Pang Toh Tien
  • Method for solder crack deflection
    Publication number: 20040102029
    Abstract: An apparatus that includes a first component defining an interior of the apparatus; a first solder composition exterior to the first component; a second solder composition exterior to the first solder composition and the first component; and a second component exterior to the second solder composition, the first solder composition, and the first component.
    Type: Application
    Filed: November 27, 2002
    Publication date: May 27, 2004
    Inventors: Chung C. Key, Mustapha Mohd. Faizul, Tan Siew Sang