Patents by Inventor Chung-Che Reed

Chung-Che Reed has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7571415
    Abstract: A layout of a power device is provided. The layout includes a substrate, a unit array, a plurality of first, second, third and fourth signal paths, and a first, second, third and fourth port. The unit array with a plurality of rows is disposed on the substrate. Each row of the unit array includes a plurality of units. The first and second signal paths on the substrate are disposed on a first side and a second side of corresponding odd-numbered rows of the unit array. The third and the fourth signal paths on the substrate are disposed above a corresponding row of the unit array. The first to fourth ports on the substrate are electrically connected to the first to fourth signal paths respectively.
    Type: Grant
    Filed: January 23, 2007
    Date of Patent: August 4, 2009
    Assignee: United Microelectronics Corp.
    Inventors: Houshang Aghahassan, Albert Kuo Huei Yen, Chung-Che Reed, Tsung-Chien Wu
  • Publication number: 20080174371
    Abstract: A layout of a power device is provided. The layout includes a substrate, a unit array, a plurality of first, second, third and fourth signal paths, and a first, second, third and fourth port. The unit array with a plurality of rows is disposed on the substrate. Each row of the unit array includes a plurality of units. The first and second signal paths on the substrate are disposed on a first side and a second side of corresponding odd-numbered rows of the unit array. The third and the fourth signal paths on the substrate are disposed above a corresponding row of the unit array. The first to fourth ports on the substrate are electrically connected to the first to fourth signal paths respectively.
    Type: Application
    Filed: January 23, 2007
    Publication date: July 24, 2008
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Houshang Aghahassan, Albert Kuo Huei Yen, Chung-Che Reed, Tsung-Chien Wu