Abstract: A flip-chip light-emitting module includes a thermal dissipation substrate, a package assembly, and a light-emitting chip. The package assembly includes a frame surrounding the thermal dissipation substrate, and a lens unit disposed on the frame. The frame includes a conductive path. The light-emitting chip is disposed on the thermal dissipation substrate, and includes a top conductive contact and a light-emitting surface at the same side. The top conductive contact is electrically connected with the conductive path by a conductor.

Abstract: An optical module includes an electronic assembly and an optical assembly. The electronic assembly includes a circuit board and a chip component. The optical assembly disposed on the electronic assembly includes a bracket and an optical component. The bracket surrounds the chip component and has at least two conductive layers separated from each other. The conductive layers are electrically connected to the electronic assembly. The optical assembly is disposed on the bracket and has at least one light-transmissive conductive layer which is electrically connected to the conductive layers.

Abstract: A flip-chip light-emitting module includes a thermal dissipation substrate, a package assembly, and a light-emitting chip. The package assembly includes a frame surrounding the thermal dissipation substrate, and a lens unit disposed on the frame. The frame includes a conductive path. The light-emitting chip is disposed on the thermal dissipation substrate, and includes a top conductive contact and a light-emitting surface at the same side. The top conductive contact is electrically connected with the conductive path by a conductor.

Abstract: An optical module includes an electronic assembly and an optical component. The electronic assembly includes a chip component and a circuit board. The optical assembly disposed on the electronic assembly includes a bracket and an optical component. The bracket surrounds the chip component and has at least two conductive layers separated from each other. The conductive layers extend to the bottom of the bracket and are electrically connected to the electronic assembly. The optical assembly is disposed on the bracket and has at least one light-transmissive conductive layer which is electrically connected to the conductive layers.

Abstract: An optical module includes an electronic assembly and an optical assembly. The electronic assembly includes a circuit board and a chip component. The optical assembly disposed on the electronic assembly includes a bracket and an optical component. The bracket surrounds the chip component and has at least two conductive layers separated from each other. The conductive layers are electrically connected to the electronic assembly. The optical assembly is disposed on the bracket and has at least one light-transmissive conductive layer which is electrically connected to the conductive layers.

Abstract: A flip-chip light-emitting module includes a thermal dissipation substrate, a package assembly, and a light-emitting chip. The package assembly includes a frame surrounding the thermal dissipation substrate, and a lens unit disposed on the frame. The frame includes a conductive path. The light-emitting chip is disposed on the thermal dissipation substrate, and includes a top conductive contact and a light-emitting surface at the same side. The top conductive contact is electrically connected with the conductive path by a conductor.

Abstract: An optical module includes an electronic assembly and an optical component. The electronic assembly includes a chip component and a circuit board. The optical assembly disposed on the electronic assembly includes a bracket and an optical component. The bracket surrounds the chip component and has at least two conductive layers separated from each other. The conductive layers extend to the bottom of the bracket and are electrically connected to the electronic assembly. The optical assembly is disposed on the bracket and has at least one light-transmissive conductive layer which is electrically connected to the conductive layers.

Abstract: An antenna structure includes a radiation module and a metal board. The radiation module has a first coil unit and a second coil unit. The first coil unit is coupled to the second coil unit. The first coil unit and the second coil unit have opposite direction of current. The metal board is disposed at one side of the radiation module. The metal board has an enclosed slot which has a first slot portion and a second slot portion.

Abstract: An antenna structure includes a radiation module and a metal board. The radiation module has a first coil unit and a second coil unit. The first coil unit is coupled to the second coil unit. The first coil unit and the second coil unit have opposite direction of current. The metal board is disposed at one side of the radiation module. The metal board has an enclosed slot which has a first slot portion and a second slot portion.