Patents by Inventor Chung-Chen Chen

Chung-Chen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation system and electronic device utilizing the same
    Patent number: 8052282
    Abstract: An electronic device includes a heat dissipation system and an operating system. The heat dissipation system includes a housing, a first heat dissipation module received in the housing, heat pipes extending from the first heat dissipation module through the housing. The operating system includes a dust-proof housing, a heat source and a heat dissipation device. The heat source is received in the dust-proof housing and generates heat. The cooling module is adhered to an outer surface of the dust-proof housing to be cooled and attaches the heat pipes to the first heat dissipation module. The outer surface of the dust-proof housing is adjacent to the housing. The heat pipes transfer heat from the operating system into the first heat dissipation module.
    Type: Grant
    Filed: March 18, 2009
    Date of Patent: November 8, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chien-Fu Chen, Yi-Ping Hsieh, Chung-Chen Chen
  • HEAT DISSIPATION SYSTEM AND ELECTRONIC DEVICE UTILIZING THE SAME
    Publication number: 20100053896
    Abstract: An electronic device includes a heat dissipation system and an operating system. The heat dissipation system includes a housing, a first heat dissipation module received in the housing, heat pipes extending from the first heat dissipation module through the housing. The operating system includes a dust-proof housing, a heat source and a heat dissipation device. The heat source is received in the dust-proof housing and generates heat. The cooling module is adhered to an outer surface of the dust-proof housing to be cooled and attaches the heat pipes to the first heat dissipation module. The outer surface of the dust-proof housing is adjacent to the housing. The heat pipes transfer heat from the operating system into the first heat dissipation module.
    Type: Application
    Filed: March 18, 2009
    Publication date: March 4, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chien-Fu Chen, Yi-Ping Hsieh, Chung-Chen Chen