Patents by Inventor Chung-Chen Wu

Chung-Chen Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing nylon 66 hollow fiber
    Patent number: 10344401
    Abstract: A method for manufacturing a nylon 66 hollow fiber includes steps as follows. A plurality of nylon 66 particles are provided. A melting step is provided, wherein the nylon 66 particles are melted so as to form a spun liquid. A fiber spitting step is provided, wherein the spun liquid goes through a hollow spinneret plate so as to form hollow nascent fibers. An evacuating step is provided, wherein the hollow nascent fibers are preliminarily solidified so as to form hollow half-solidified fibers. A cooling step is provided, wherein the hollow half-solidified fibers are cooled and solidified so as to form solidified fibers. A collecting and oiling step is provided. A drawing step is provided. A winding step is provided so as to obtain the nylon 66 hollow fiber.
    Type: Grant
    Filed: January 10, 2016
    Date of Patent: July 9, 2019
    Assignee: CHAIN YARN CO., LTD.
    Inventors: Yen-Hsiao Chen, Chung-Chen Wu, Chi-Lu Huang, Chuan-Shing Lin
  • NYLON 66 HOLLOW FIBER, METHOD AND EQUIPMENT FOR MANUFACTURING THE SAME
    Publication number: 20170037542
    Abstract: A method for manufacturing a nylon 66 hollow fiber includes steps as follows. A plurality of nylon 66 particles are provided. A melting step is provided, wherein the nylon 66 particles are melted so as to form a spun liquid. A fiber spitting step is provided, wherein the spun liquid goes through a hollow spinneret plate so as to form hollow nascent fibers. An evacuating step is provided, wherein the hollow nascent fibers are preliminarily solidified so as to form hollow half-solidified fibers. A cooling step is provided, wherein the hollow half-solidified fibers are cooled and solidified so as to form solidified fibers. A collecting and oiling step is provided. A drawing step is provided. A winding step is provided so as to obtain the nylon 66 hollow fiber.
    Type: Application
    Filed: January 10, 2016
    Publication date: February 9, 2017
    Inventors: Yen-Hsiao CHEN, Chung-Chen WU, Chi-Lu HUANG, Chuan-Shing LIN
  • Method for packing electronic device by interconnecting frame body and frame leads with insulating block and its packing structure
    Patent number: 6928725
    Abstract: A packing structure of an electronic device by interconnecting a frame and frame leads with an insulating block is provided. The packing structure has the advantage of measuring the electrical characteristics of the semi-product before being subject to a plastic molding. The packing structure includes a frame having a package area where an electronic device is disposed, an insulating block disposed on one side of the package area and connected to the frame, and a plurality of frame leads aligned in parallel and connected to the insulating block and the electronic device.
    Type: Grant
    Filed: November 17, 2003
    Date of Patent: August 16, 2005
    Assignee: Delta Electronics, Inc.
    Inventors: Chung-Chen Wu, Ming-Tzu Chen
  • Method for packing electronic device by interconnecting frame body and frame leads with insulating block and its packing structure
    Publication number: 20040095737
    Abstract: A packing structure of an electronic device by interconnecting a frame and frame leads with an insulating block is provided. The packing structure has the advantage of measuring the electrical characteristics of the semi-product before being subject to a plastic molding. The packing structure includes a frame having a package area where an electronic device is disposed, an insulating block disposed on one side of the package area and connected to the frame, and a plurality of frame leads aligned in parallel and connected to the insulating block and the electronic device.
    Type: Application
    Filed: November 17, 2003
    Publication date: May 20, 2004
    Applicant: DELTA ELECTRONICS, INC
    Inventors: Chung-Chen Wu, Ming-Tzu Chen
  • Method for packing electronic device by interconnecting frame body and frame leads with insulating block and its packing structure
    Publication number: 20020011909
    Abstract: A packing structure of an electronic device by interconnecting a frame and frame leads with an insulating block is provided. The packing structure has the advantage of measuring the electrical characteristics of the semi-product before being subject to a plastic molding. The packing structure includes a frame having a package area where an electronic device is disposed, an insulating block disposed on one side of the package area and connected to the frame, and a plurality of frame leads aligned in parallel and connected to the insulating block and the electronic device.
    Type: Application
    Filed: December 19, 2000
    Publication date: January 31, 2002
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Chung-Chen Wu, Ming-Tzu Chen