Patents by Inventor Chung Cheng Chen
Chung Cheng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12217960Abstract: Semiconductor devices and methods of manufacture are provided whereby fences are formed over a substrate and III-V materials are grown over the substrate, wherein the fences block growth of the III-V materials. As such, smaller areas of the III-V materials are grown, thereby preventing stresses that occur with the growth of larger sheets.Type: GrantFiled: August 31, 2021Date of Patent: February 4, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Min-Sung Kuo, I-Kai Hung, Po-Wei Chen, Chung-Cheng Chen
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Publication number: 20240395545Abstract: Semiconductor devices and methods of manufacture are provided whereby fences are formed over a substrate and III-V materials are grown over the substrate, wherein the fences block growth of the III-V materials. As such, smaller areas of the III-V materials are grown, thereby preventing stresses that occur with the growth of larger sheets.Type: ApplicationFiled: July 30, 2024Publication date: November 28, 2024Inventors: Min-Sung Kuo, I-Kai Hung, Po-Wei Chen, Chung-Cheng Chen
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Publication number: 20240347396Abstract: A measurement pattern for monitoring overlay shift of bonded wafers includes a top wafer pattern and a bottom wafer pattern. The top wafer pattern includes a first portion with a width Wx1 measured along a first axis. The bottom wafer pattern includes a first part with a width Wx2 measured along the first axis, wherein the first portion of the top wafer pattern and the first part of the bottom wafer pattern are separated by a target distance Dx, and wherein the measurement pattern satisfies the following measurement formulas: Tx > Dx - Sx ; ? Tx < Dx - Sx + Wx ? 2 ; ? Tx > Sx ; ? Tx < Dx - Sx + Wx ? 1 ; wherein, Tx represents a searching distance for finding an end-point of the first portion or an end-point of the first part; and Sx represents an actual shifting amount of the first portion.Type: ApplicationFiled: June 28, 2024Publication date: October 17, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Sung Kuo, Hsun-Kuo Hsiao, Chung-Cheng Chen, Po-Wei Chen
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Patent number: 12057353Abstract: A measurement pattern for monitoring overlay shift of bonded wafers includes a top wafer pattern and a bottom wafer pattern. The top wafer pattern includes a first portion with a width Wx1 measured along a first axis. The bottom wafer pattern includes a first part with a width Wx2 measured along the first axis, wherein the first portion of the top wafer pattern and the first part of the bottom wafer pattern are separated by a target distance Dx, and wherein the measurement pattern satisfies the following measurement formulas: Tx>Dx?Sx; Tx<Dx?Sx+Wx2; Tx>Sx; Tx<Dx?Sx+Wx1; wherein, Tx represents a searching distance for finding an end-point of the first portion or an end-point of the first part; and Sx represents an actual shifting amount of the first portion.Type: GrantFiled: August 5, 2021Date of Patent: August 6, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Sung Kuo, Hsun-Kuo Hsiao, Chung-Cheng Chen, Po-Wei Chen
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Publication number: 20230065555Abstract: Semiconductor devices and methods of manufacture are provided whereby fences are formed over a substrate and III-V materials are grown over the substrate, wherein the fences block growth of the III-V materials. As such, smaller areas of the III-V materials are grown, thereby preventing stresses that occur with the growth of larger sheets.Type: ApplicationFiled: August 31, 2021Publication date: March 2, 2023Inventors: Min-Sung Kuo, I-Kai Hung, Po-Wei Chen, Chung-Cheng Chen
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Publication number: 20230045223Abstract: A measurement pattern for monitoring overlay shift of bonded wafers includes a top wafer pattern and a bottom wafer pattern. The top wafer pattern includes a first portion with a width Wx1 measured along a first axis. The bottom wafer pattern includes a first part with a width Wx2 measured along the first axis, wherein the first portion of the top wafer pattern and the first part of the bottom wafer pattern are separated by a target distance Dx, and wherein the measurement pattern satisfies the following measurement formulas: Tx>Dx?Sx; Tx<Dx?Sx+Wx2; Tx>Sx; Tx<Dx?Sx+Wx1; wherein, Tx represents a searching distance for finding an end-point of the first portion or an end-point of the first part; and Sx represents an actual shifting amount of the first portion.Type: ApplicationFiled: August 5, 2021Publication date: February 9, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Sung Kuo, Hsun-Kuo Hsiao, Chung-Cheng Chen, Po-Wei Chen
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Patent number: 11466852Abstract: An end fitting for an exhaust pipe includes a cylindrical body having an upper opening and a lower opening. An inclined upper board is mounted in the cylindrical body. An upper passage is defined between a side of the upper board and an inner periphery of the cylindrical body. A first set of drain holes is defined in the lowest portion of the upper board. An inclined lower board is mounted in the cylindrical body and is located below the upper board. A lower passage is defined between a side of the lower board and the inner periphery of the cylindrical body. The lowest portion of the lower board is connected to the cylindrical body. The cylindrical body includes a cylindrical wall having a second set of drain holes. A ledge extends from the inner periphery of the cylindrical body and is located below the lower board.Type: GrantFiled: November 27, 2018Date of Patent: October 11, 2022Inventor: Chung-Cheng Chen
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Patent number: 11195737Abstract: An apparatus for storing and transporting semiconductor elements includes a first portion and a second portion. The first portion includes a first front side wall, a first rear side wall, a top wall, and at least one pin holder integrally extending from the first rear side wall. The second portion includes a second front side wall, a second rear side wall, a bottom wall, and at least one pivotal pin structure integrally coupled with and extending from the second rear side wall. The at least one pivotal pin structure comprises a shaft, and a head connected with the shaft. The at least one pin holder defines a cavity sized and shaped to accept the head of the at least one pivotal pin structure. The first portion and the second portion are pivotally movable between an open configuration and a closed container configuration.Type: GrantFiled: September 20, 2019Date of Patent: December 7, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ming-Sung Kuo, Jhih-Yuan Yang, Po-Wei Chen, Fang-yu Liu, Ping-Cheng Ko, Chung-Cheng Chen
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Patent number: 11114543Abstract: A group III-V device structure is provided. The group III-V device structure includes a channel layer formed over a substrate and an active layer formed over the channel layer. The group III-V device structure also includes a gate structure formed over the active layer and a source electrode and a drain electrode formed over the active layer. The source electrode and the drain electrode are formed on opposite sides of the gate structure. The group III-V device structure further includes a through via structure formed through the channel layer, the active layer and a portion of the substrate, and the through via structure is electrically connected to the source electrode or the drain electrode.Type: GrantFiled: March 16, 2017Date of Patent: September 7, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Ming-Hong Chang, Chih-Yuan Chan, Shen-Ping Wang, Chung-Cheng Chen, Chien-Li Kuo, Po-Tao Chu
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Patent number: 10954137Abstract: An IoT water purification system includes a water purification device and a cloud management device. The water purification device includes a filter element, a water tank, a water quantity sensing circuit, a filter element sensing circuit, and a water purification side wireless transmission circuit. The water quantity sensing circuit measures a current storage quantity of the drinking water to generate respective water quantity information. The filter element sensing circuit measures a water quality of the tap water to generate water quality information. The cloud management device includes a cloud wireless transmission circuit and a cloud processing circuit.Type: GrantFiled: October 4, 2019Date of Patent: March 23, 2021Assignee: EONPLUS CO. LTD.Inventors: Chin-Yee Ho, Chung-Cheng Chen, Yi-Chen Yu
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Publication number: 20200166210Abstract: An end fitting for an exhaust pipe includes a cylindrical body having an upper opening and a lower opening. An inclined upper board is mounted in the cylindrical body. An upper passage is defined between a side of the upper board and an inner periphery of the cylindrical body. A first set of drain holes is defined in the lowest portion of the upper board. An inclined lower board is mounted in the cylindrical body and is located below the upper board. A lower passage is defined between a side of the lower board and the inner periphery of the cylindrical body. The lowest portion of the lower board is connected to the cylindrical body. The cylindrical body includes a cylindrical wall having a second set of drain holes. A ledge extends from the inner periphery of the cylindrical body and is located below the lower board.Type: ApplicationFiled: November 27, 2018Publication date: May 28, 2020Inventor: CHUNG-CHENG CHEN
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Publication number: 20200109062Abstract: An IoT water purification system includes a water purification device and a cloud management device. The water purification device includes a filter element, a water tank, a water quantity sensing circuit, a filter element sensing circuit, and a water purification side wireless transmission circuit. The water quantity sensing circuit measures a current storage quantity of the drinking water to generate respective water quantity information. The filter element sensing circuit measures a water quality of the tap water to generate water quality information. The cloud management device includes a cloud wireless transmission circuit and a cloud processing circuit.Type: ApplicationFiled: October 4, 2019Publication date: April 9, 2020Inventors: CHIN-YEE HO, CHUNG-CHENG CHEN, YI-CHEN YU
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Patent number: 10260568Abstract: A connecting device for a chainring of a bicycle is disclosed, including a connecting disc, a shaft, and a crank. The connecting disc is adapted to be engaged with a chainring, and has an axial bore, a bulging portion bulging from a central portion of the connecting disc, and a surrounding portion, which is flat, and surrounds an outer periphery of the bulging portion. The shaft passes through the axial bore to be fixedly engaged with the connecting disc. The shaft has a connecting end. The crank has a connecting end engaged with the connecting end of the shaft, and a bearing end adapted to bear an external force to make the crank rotate around the shaft. Whereby, the amount of materials used to make the connecting device is decreased. At the same time, the manufacturing cost, the size, and the weight of the connecting device are all reduced.Type: GrantFiled: December 13, 2016Date of Patent: April 16, 2019Assignee: GLORY PRECISION INDUSTRY CO., LTD.Inventors: Chung-Cheng Chen, Chung-Yi Chen, Sheng-Cian Li, Yu-Syong Chen, Yuan-Cheng Chiang
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BUILDING HEAT DISSIPATION HOOD STRUCTURE RECEIVING A FAN THEREIN AND A METHOD FOR PRODUCING THE SAME
Publication number: 20190017715Abstract: A building heat dissipation hood structure includes a ventilation through-hole (11) disposed in a top portion (1) of a building. A heat dissipation hood (2) is mounted on the top portion (1) of the building and is located corresponding to the ventilation through-hole (11). A fan (3) is mounted in the heat dissipation hood (2). In a method for producing the building heat dissipation hood structure, a periphery of the fan (3) is firstly superimposed on a top side of a hole edge of the ventilation through-hole (11) from the top portion (1) of the building. A leakage preventing mechanism (4) is disposed in an intersection area between the fan (3) and the hole edge of the ventilation through-hole (11). The heat dissipation hood (2) is then installed in the top portion (1) of the building.Type: ApplicationFiled: January 12, 2018Publication date: January 17, 2019Inventor: CHUNG-CHENG CHEN -
Patent number: 10163707Abstract: Methods for forming a group III-V device structure are provided. A method includes forming a first through via structure penetrating through group III-V compound layers over a front surface of a semiconductor substrate. The method also includes thinning the semiconductor substrate from a back surface of the semiconductor substrate. The method further includes etching the semiconductor substrate from the back surface to form a via hole substantially aligned with the first through via structure. In addition, the method includes etching the semiconductor substrate from the back surface to form a recess extending from a bottom surface of the recess towards the first through via structure. The first through via structure is exposed by the via hole and the recess. The method also includes forming a conductive layer in the via hole and the recess to form a second through via structure connected to the first through via structure.Type: GrantFiled: May 19, 2017Date of Patent: December 25, 2018Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ming-Hong Chang, Hsin-Chih Lin, Shen-Ping Wang, Chung-Cheng Chen, Chien-Li Kuo, Po-Tao Chu
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Publication number: 20180337228Abstract: A semiconductor device includes a substrate, overlaid by a III-V compound semiconductor layer. The substrate includes a circuit region and a seal ring region, wherein the seal ring region surrounds the circuit region. A seal ring structure is disposed in the seal ring region, wherein the seal ring structure includes a first via structure, extending through part of the substrate and the III-V compound semiconductor layer, that surrounds the circuit region.Type: ApplicationFiled: May 18, 2017Publication date: November 22, 2018Inventors: Ming-Hong CHANG, Po-Tao Chu, Shen-Ping Wang, Chien-Li Kuo, Chung-Cheng Chen
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Publication number: 20180337093Abstract: Methods for forming a group III-V device structure are provided. A method includes forming a first through via structure penetrating through group III-V compound layers over a front surface of a semiconductor substrate. The method also includes thinning the semiconductor substrate from a back surface of the semiconductor substrate. The method further includes etching the semiconductor substrate from the back surface to form a via hole substantially aligned with the first through via structure. In addition, the method includes etching the semiconductor substrate from the back surface to form a recess extending from a bottom surface of the recess towards the first through via structure. The first through via structure is exposed by the via hole and the recess. The method also includes forming a conductive layer in the via hole and the recess to form a second through via structure connected to the first through via structure.Type: ApplicationFiled: May 19, 2017Publication date: November 22, 2018Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ming-Hong CHANG, Hsin-Chih LIN, Shen-Ping WANG, Chung-Cheng CHEN, Chien-Li KUO, Po-Tao CHU
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Publication number: 20180212047Abstract: A group III-V device structure is provided. The group III-V device structure includes a channel layer formed over a substrate and an active layer formed over the channel layer. The group III-V device structure also includes a gate structure formed over the active layer and a source electrode and a drain electrode formed over the active layer. The source electrode and the drain electrode are formed on opposite sides of the gate structure. The group III-V device structure further includes a through via structure formed through the channel layer, the active layer and a portion of the substrate, and the through via structure is electrically connected to the source electrode or the drain electrode.Type: ApplicationFiled: March 16, 2017Publication date: July 26, 2018Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ming-Hong CHANG, Chih-Yuan CHAN, Shen-Ping WANG, Chung-Cheng CHEN, Chien-Li KUO, Po-Tao CHU
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Publication number: 20180135712Abstract: A hydraulic disc brake device to be mounted on a bicycle is disclosed, wherein the device includes a caliper main body, two brake linings, two membranes, and two rings. The caliper main body has a channel and two oil chambers respectively formed on two sides of the channel. Each of the oil chambers has an opening facing the channel. A part of a brake disc of the bicycle is located in the channel. The brake linings are provided in the channel, and are on two sides of the brake disc. The membranes are assembled to the caliper main body to seal the openings. By injecting hydraulic oil into the oil chambers, the membranes are pushed by the hydraulic oil to push against the brake linings, making the brake linings approach each other to clamp the brake disc, to thereby stop the bicycle.Type: ApplicationFiled: November 14, 2017Publication date: May 17, 2018Applicant: GLORY PRECISION INDUSTRY CO., LTD.Inventors: CHUNG-CHENG CHEN, CHUNG-YI CHEN, YU-SYONG CHEN, SHENG-CIAN LI, HE-CHIH HUNG
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Publication number: 20170343047Abstract: A connecting device for a chainring of a bicycle is disclosed, including a connecting disc, a shaft, and a crank. The connecting disc is adapted to be engaged with a chainring, and has an axial bore, a bulging portion bulging from a central portion of the connecting disc, and a surrounding portion, which is flat, and surrounds an outer periphery of the bulging portion. The shaft passes through the axial bore to be fixedly engaged with the connecting disc. The shaft has a connecting end. The crank has a connecting end engaged with the connecting end of the shaft, and a bearing end adapted to bear an external force to make the crank rotate around the shaft. Whereby, the amount of materials used to make the connecting device is decreased. At the same time, the manufacturing cost, the size, and the weight of the connecting device are all reduced.Type: ApplicationFiled: December 13, 2016Publication date: November 30, 2017Applicant: GLORY PRECISION INDUSTRY CO., LTD.Inventors: CHUNG-CHENG CHEN, CHUNG-YI CHEN, SHENG-CIAN LI, YU-SYONG CHEN, YUAN-CHENG CHIANG