Abstract: A heat dissipator having a circuit formed by screen printing or spraying includes a circuit layer and an isolation layer. The circuit layer, which is on a surface of a heat dissipation part of the heat dissipator having the circuit formed by screen printing or spraying, is formed by screen printing or spraying a uniformly distributed plastic material and low electrical resistance conductive powder. The isolation layer is disposed on the circuit layer and the heat dissipation part.

Abstract: A curable thermal interface material and a cooling device, and a cooling device manufacturing method thereof are provided. The curable thermal interface material includes thermal conductive material and polymeric material, which is formed from the mixture of thermal conductive material and polymeric material. The curable thermal interface material is disposed on the heat sink, so as to properly conduct heat from the heat source to the heat sink to achieve heat dissipation.

Abstract: A wire structure improvement comprises a first ground layer on which a first insulation layer is placed and plural transmission conductors and plural ground conductors are orderly arranged in the first insulator next to the first ground layer. A second insulation layer is disposed on the transmission conductors and the ground conductors opposite to the first insulation layer, and a second ground layer is disposed on the second insulator. The first ground layer and the second ground layer are interconnected through the ground conductors. In general, the structure improvement of the wire features cost down, boosting production pace and transmission rate and diminishing electromagnetic interference, radio interference and common mode impedance.