Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.

Abstract: A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.

Abstract: A semiconductor device including a substrate, a low-k dielectric layer, a cap layer, and a conductive layer is provided. The low-k dielectric layer is disposed over the substrate. The cap layer is disposed on the low-k dielectric layer, wherein a carbon atom content of the cap layer is greater than a carbon atom content of the low-k dielectric layer. The conductive layer is disposed in the cap layer and the low-k dielectric layer.

Abstract: A structure includes a first conductive feature, a first etch stop layer over the first conductive feature, a dielectric layer over the first etch stop layer, and a second conductive feature in the dielectric layer and the first etch stop layer. The second conductive feature is over and contacting the first conductive feature. An air spacer encircles the second conductive feature, and sidewalls of the second conductive feature are exposed to the air spacer. A protection ring further encircles the second conductive feature, and the protection ring fully separates the second conductive feature from the air spacer.

Abstract: An interconnect structure includes an etching stop layer, a dielectric layer and an insert layer and a conductive line. The insert layer is located between the etching stop layer and the dielectric layer. The conductive line extends through the dielectric layer, the insert layer, and the etching stop layer. A material of the insert layer is different from the dielectric layer and the etching stop layer.

Abstract: A method of making a sealing article that includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.

Abstract: A device includes a semiconductor fin, and a gate stack on sidewalls and a top surface of the semiconductor fin. The gate stack includes a high-k dielectric layer, a work-function layer overlapping a bottom portion of the high-k dielectric layer, and a blocking layer overlapping a second bottom portion of the work-function layer. A low-resistance metal layer overlaps and contacts the work-function layer and the blocking layer. The low-resistance metal layer has a resistivity value lower than second resistivity values of both of the work-function layer and the blocking layer. A gate spacer contacts a sidewall of the gate stack.

Abstract: The method, executed by at least one processor of a computer, of an encrypting or a decrypting method for an IC layout is proposed. The encrypting method comprises getting a record of an IC layout object from a database. Data of the IC layout object is appended into a byte array. The byte array is encrypted into a second byte array. Each byte of the second byte array is defined as an encryption value to create multiple encryption values. Finally, an encryption object with multiple encryption values is created on a specified layer.

Abstract: The method, executed by at least one processor of a computer, of an encrypting or a decrypting method for an IC layout is proposed. The encrypting method comprises getting a record of an IC layout object from a database. Data of the IC layout object is appended into a byte array. The byte array is encrypted into a second byte array. Each byte of the second byte array is defined as an encryption value to create multiple encryption values. Finally, an encryption object with multiple encryption values is created on a specified layer.

Abstract: New microfluidic devices, useful for carrying out chemical reactions, are provided. The devices are adapted for on-chip solvent exchange, chemical processes requiring multiple chemical reactions, and rapid concentration of reagents.

Abstract: An electrical socket includes at least one socket receptacle adapted to connect electrically an electrical appliance to a line power source, and a monitoring unit connected electrically across the socket receptacle for monitoring operating conditions, such as the ambient temperature, the line voltage, the line current and the line power supplied by the line power source, of the electrical socket.

Abstract: A test lead socket indicating device is used for a volt-ohm-milliammeter (VOM) having a select input which is operable to set the VOM in a voltage, current or resistance measuring mode, a common input socket, a voltage socket, a resistance socket and a current socket. The test lead socket indicating device includes an indicator unit provided on the VOM and having a voltage indicator lamp disposed adjacent to the voltage socket, a current indicator lamp disposed adjacent to the current socket and a resistance indicator lamp disposed adjacent to the resistance socket. A counter unit has an input terminal connected to the select input. The counter unit has a digital signal output which is incremented each time the select input is operated. A decoder unit receives the digital signal output from the counter unit. The decoder unit activates one of the voltage, current and resistance indicator lamps according to the digital signal output.

Abstract: A toy having an upright toy body standing on a pair of skis to resemble a skier. Each ski is provided with a driving wheel operable by an electric motor in cooperation with a driving mechanism built within the toy body to rotate so as to enable the toy to roll on a ground surface. The toy has two hands each holding a ski pole, the two hands being operable by the same electric motor in cooperation with an alternating pivot lever to move alternatingly up-and-down while the driving wheels are caused to rotate. The up-and-down movement of the two hands causes the ski poles to alternatingly push the ground to cause the toy body to alternatingly tilt sidewardly, thus causing the driving wheels to lift alternatingly from the ground; as a result the toy turns alternatingly along a zig-zag course while it rolls, as if a skier were skiing along a zig-zag course.