Patents by Inventor Chungchi Huang

Chungchi Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for modeling interactions between massively coupled multiple vias in multilayered electronic packaging structures
    Patent number: 7149666
    Abstract: Analyzing interactions between vias in multilayered electronic packages that include at least two spaced-apart conducting planes, and multiple vias that connect signal traces on different layers. Voltages at active via ports are represented as magnetic ring current sources, which generate electromagnetic modes inside the plane structure. Substantial electromagnetic coupling between vias occurs. A full-wave solution of multiple scattering among cylindrical vias in planar waveguides is derived using Foldy-Lax equations. By using the equivalence principle, the coupling is decomposed into interior and exterior problems. For the interior problem, the dyadic Green's function is expressed in terms of vector cylindrical waves and waveguide modes. The Foldy-Lax equations for multiple scattering among the cylindrical vias are applied, and waveguide modes are decoupled in the Foldy-Lax equations.
    Type: Grant
    Filed: May 30, 2002
    Date of Patent: December 12, 2006
    Assignee: University of Washington
    Inventors: Leung Tsang, Houfei Chen, Chungchi Huang, Vikram Jandhyala
  • Methods for modeling interactions between massively coupled multiple vias in multilayered electronic packaging structures
    Publication number: 20030072130
    Abstract: Analyzing interactions between vias in multilayered electronic packages that include at least two spaced-apart conducting planes, and multiple vias that connect signal traces on different layers. Voltages at active via ports are represented as magnetic ring current sources, which generate electromagnetic modes inside the plane structure. Substantial electromagnetic coupling between vias occurs. A full-wave solution of multiple scattering among cylindrical vias in planar waveguides is derived using Foldy-Lax equations. By using the equivalence principle, the coupling is decomposed into interior and exterior problems. For the interior problem, the dyadic Green's function is expressed in terms of vector cylindrical waves and waveguide modes. The Foldy-Lax equations for multiple scattering among the cylindrical vias are applied, and waveguide modes are decoupled in the Foldy-Lax equations.
    Type: Application
    Filed: May 30, 2002
    Publication date: April 17, 2003
    Applicant: University of Washington
    Inventors: Leung Tsang, Houfei Chen, Chungchi Huang, Vikram Jandhyala