Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate including a base and a fin structure over the base. The fin structure includes a nanostructure. The semiconductor device structure includes a gate stack over the base and wrapped around the nanostructure. The gate stack has an upper portion and a sidewall portion, the upper portion is over the nanostructure, and the sidewall portion is over a first sidewall of the nanostructure. The semiconductor device structure includes a first inner spacer and a second inner spacer over opposite sides of the sidewall portion. A sum of a first width of the first inner spacer and a second width of the second inner spacer is greater than a third width of the sidewall portion as measured along a longitudinal axis of the fin structure.

Abstract: An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.

Abstract: A contacting member of a contact probe for a probe system for performing a functionality test to a DUT includes a body, a contact tip, and a tip transition section between the body and the contact tip. A bottom side of the contacting member, which faces toward the DUT when testing the DUT, includes a lower surface at the body, a tip bottom surface at the contact tip, and a tip transition surface at the tip transition section. A contact end of the contact tip for contacting the DUT is located on a front side of the tip bottom surface. A rear side of the tip bottom surface and the lower surface have a height difference therebetween. The tip transition surface gradually changes in height from the lower surface to the rear side of the tip bottom surface. The contacting member has high precision and structural strength.

Abstract: A method of removing a step height on a gate structure includes providing a substrate. A gate structure is disposed on the substrate. A dielectric layer covers the gate structure and the substrate. Then, a composite material layer is formed to cover the dielectric layer. Later, part of the composite material layer is removed to form a step height disposed directly on the gate structure. Subsequently, a wet etching is performed to remove the step height. After the step height is removed, the dielectric layer is etched to form a first contact hole to expose the gate structure.

Abstract: An unmanned flying spray system includes a flying device, an air valve, and a spraying device. The flying device is provided with a controller including a control module and a power supply module electrically connected to the control module for supplying power to the flying device. The air valve is disposed on the flying device and connected with a gas cylinder for outputting a gas power. The spraying device includes a pesticide container, an electromagnetic control valve electrically connected with the control module, and a nozzle. The pesticide container has a diverting member connected with the air valve, the pesticide container, and the nozzle. The electromagnetic valve is disposed between the diverting member and the nozzle. The unmanned flying spray system sprays a liquid by use of gas power, so as to significantly reduce the overall weight and improve the stability of flying.

Abstract: A coaxial probe card device includes a substrate, a plurality of probe holders, and a plurality of probes. The substrate has a through hole. The plurality of probe holders is disposed on the substrate and is configured in a radial manner surrounding the through hole by using the through hole of the substrate as a center. Each probe holder has a probe slot, and the probe slot is inclined with respect to a surface of the substrate and extends towards the through hole of the substrate. The probes are individually disposed in the probe slots of the probe holders.

Abstract: An encryption method adopts an encryption principle based on sequential logic and involves performing three dimensional computation on a plaintext data unit having undergone non-linear transition through a dynamic child transition box, system keys, and dynamic feedback keys together to generate dynamic keys. After undergoing non-linear transition through different dynamic child transition boxes respectively, the dynamic keys undergo the three dimensional computation together with the system keys to generate a ciphertext data unit. Content values of the dynamic feedback keys and dynamic child transition box operating under a feedback control mechanism vary with each instance of feedback, and thus the dynamic keys and the ciphertext data are difficult to crack but effective in resisting violent attacks.

Abstract: An independently controllable transmission mechanism with an identity-ratio series type includes a first planetary gear train and a second planetary gear train mechanically connected therewith. The transmission mechanism has a power output end, a transmission control end, a power input end and a free transmission end. The power output end and the transmission control end are provided on the first planetary gear train and the second planetary gear train, respectively. The power input end is provided on the first planetary gear train or the second planetary gear train while the free transmission end is provided on the second planetary gear train or the first planetary gear train. The transmission control end is operated to freely shift the free transmission end as a power input end or a power output end.

Abstract: An independently controllable transmission mechanism with an identity-ratio series type includes a first planetary gear train and a second planetary gear train mechanically connected therewith. The transmission mechanism has a power output end, a transmission control end, a power input end and a free transmission end. The power output end and the transmission control end are provided on the first planetary gear train and the second planetary gear train, respectively. The power input end is provided on the first planetary gear train or the second planetary gear train while the free transmission end is provided on the second planetary gear train or the first planetary gear train. The transmission control end is operated to freely shift the free transmission end as a power input end or a power output end.

Abstract: A display device includes a display panel having a back cover, a body, a supporting plate and an adjusting mechanism. The adjusting mechanism includes a sliding rail support, a sliding block, a gear and a rotating member. The sliding rail support is fixedly connected to the back cover, and has a guiding structure disposed along the sliding rail support. The sliding block is slidably provided at the sliding rail support to move along thereof. The gear is connected to the sliding block. The gear and the guiding structure are clenched to position the sliding block at the sliding rail support. The rotating member has a first connecting portion and a second connecting portion. The first connecting portion is fixedly connected to the supporting plate, and the second connecting portion is pivotally connected to the sliding block, thereby adjusting the relative angle between the supporting plate and the sliding block.

Abstract: A chip carrier with a dam bar structure is proposed. The chip carrier is defined with at least a chip attach area and a wire bonding area surrounding the chip attach area, allowing a chip to be mounted on the chip attach area and electrically connected to the wire bonding area by bonding wires bonded to the wire bonding area. A molding gate and a dam bar are formed on the substrate outside the chip attach area and wire bonding area. An molding compound is injected through the molding gate for encapsulating the chip and bonding wires. The dam bar is provided with a first gate directed toward the molding gate, a second gate and a third gate opposed to the second gate, wherein the second and third gates are each vertically arranged with respect to the molding gate, allowing the molding compound to divert its flow direction by the dam bar.

Abstract: A chip carrier with a dam bar structure is proposed. The chip carrier is defined with at least a chip attach area and a wire bonding area surrounding the chip attach area, allowing a chip to be mounted on the chip attach area and electrically connected to the wire bonding area by bonding wires bonded to the wire bonding area. A molding gate and a dam bar are formed on the substrate outside the chip attach area and wire bonding area. An molding compound is injected through the molding gate for encapsulating the chip and bonding wires. The dam bar is provided with a first gate directed toward the molding gate, a second gate and a third gate opposed to the second gate, wherein the second and third gates are each vertically arranged with respect to the molding gate, allowing the molding compound to divert its flow direction by the dam bar.

Abstract: A scatterometer orbiting around the earth globe comprises a single fanbeam radar antenna which is rotated around a vertical axis, at a slow rotation rate. The antenna foot-print sweeps a circular disc. The slow conical sweep combined with the motion of the satellite on which the scatterometer is mounted results in highly overlapping successive sweeps such that an image pixel is revisited many times during an overpass. The pixels in the radial direction are resolved by range-gating the radar echo. The radar operates in the C-band. The scatterometer is intended, in particular, to determine wind speed and direction over the ocean.

Abstract: A microstrip antenna has an electrically conductive base plate carrying an electrically insulating substrate on top of which are a plurality of radiating patches, the improvement comprises establishing a relatively large spacing between the electrically insulating substrate and the base plate at lateral dimensions larger than lateral dimensions of the patches and in the vicinity of the patches and either through local elevations of the insulating substrate or by local indents in the base plate being vertically aligned with the patches.