Abstract: A method of forming an image sensor includes forming a photodiode within a semiconductor substrate. The method further includes disposing an interconnect structure over the semiconductor substrate. The interconnect structure includes a contact etch stop layer (CESL) over the photodiode; and a plurality of dielectric layers over the CESL, wherein at least one dielectric layer of the plurality of dielectric layers comprises a low dielectric constant (low-k) material. The method further includes patterning at least the plurality of dielectric layers, wherein patterning at least the plurality of dielectric layers comprises defining an opening above an active region of the photodiode. The method further includes depositing a cap layer on sidewalls of the opening, wherein the cap layer includes a dielectric material having a higher moisture resistance than the low-k dielectric material.

Abstract: The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a package structure, a circuit structure, a bonding structure and an external element. The circuit structure is disposed on the package structure and is electrically connected to the package structure. The circuit structure has a recess. The bonding structure includes a first bonding pad and a second bonding pad. The second bonding pad is disposed in the recess, and the second bonding pad is disposed on the first bonding pad. The bonding structure is disposed between the circuit structure and the external element. The external element is electrically connected to the circuit structure through the bonding structure. A width of the first bonding pad is smaller than a width of the second bonding pad.

Abstract: Methods and apparatus for on-package accelerator complex (AC) for integrating accelerator and IOs for scalable RAN and edge cloud solutions. The AC comprises one or more dies including an IO interface tile that is coupled to multiple intellectual property (IP) blocks that may be integrated on the same die as the IO interface tile or separate dies that are coupled to the IO interface tile via die-to-die or chiplet-to-chiplet interconnects. The IP blocks may include a network interface (e.g., Ethernet) and one or more accelerators. The package further includes a central processing unit (CPU) that is coupled to the AC via a die-to-die or chiplet-to-chiplet interconnect. The IO interface tile includes integrated shared scratchpad memory that is shared among the IP blocks and the CPU cores. The IO interface tile further includes an interface controller for scheduling IP blocks and configuring data transfers between the IP blocks, such as used by a RAN pipeline.

Abstract: In one embodiment, an apparatus includes: a plurality of cores to execute instructions; a firmware agent to execute a first firmware; a Peripheral Component Interconnect Express (PCIe) interface to communicate with a device via a PCIe link; and a boot agent coupled to the PCIe interface to download the PCIe firmware from a non-volatile memory and provide the PCIe firmware to the PCIe interface. The PCIe interface may receive a PCIe firmware for the PCIe interface before the firmware agent is to receive the first firmware. Other embodiments are described and claimed.

Abstract: A shared mesh comprises a mesh station. The mesh station is used to couple to at least a first core component and a second core component. The mesh station includes a logic unit. The mesh station is shared by at least the first core component and the second core component. A memory is coupled to the mesh station.

Abstract: A shared mesh comprises a mesh station. The mesh station is used to couple to at least a first core component and a second core component. The mesh station includes a logic unit. The mesh station is shared by at least the first core component and the second core component. A memory is coupled to the mesh station.

Abstract: The present invention discloses a touch panel structure and a method for forming the same. A touch panel structure according to the present invention comprises a substrate, a first color layer, a second color layer, and an indium tin oxide (ITO) conductive layer. The first color layer is disposed on a surface of the substrate. The second color layer is disposed on a surface of the first color layer which is opposite to the substrate, and a portion of the second color layer extends further to be in contact with the substrate. The ITO conductive layer is disposed on a surface of the second color layer which is opposite to the first color layer and also disposed on the surface of the substrate. With the touch panel structure of the present invention, the conductive layer will not break easily, and the yield rates for touch panels will be improved.

Abstract: The present invention discloses a touch panel structure, a method for forming the same and a touch device having the same. A touch panel structure of the present invention comprises a substrate, a color layer, an inorganic layer, and a photoresist layer. The color layer is disposed on a surface of the substrate. The inorganic layer is disposed on a surface of the color layer which is opposite to the substrate. The photoresist layer is disposed on a surface of the inorganic layer which is opposite to the substrate, wherein the color layer and the photoresist layer have different surface tensions. For electronic products that rely on the Colorful OGS (One Glass Solution) technology, by providing an inorganic layer between the color layer and the photoresist layer, problems related to different surface tensions when the layers are stacked during the manufacturing process of a touch panel can be solved.

Abstract: The present invention discloses a touch panel structure, a method for forming the same and a touch device comprising the same. A touch panel structure of the present invention comprises a substrate, a color layer, and a shielding layer. The shielding layer is disposed on a surface of the color layer which is opposite to the substrate. The shielding layer has at least one hollow area, and the color layer has a transmittance of more than 1%. With the present invention, the logo and function key icons and their surrounding area on a touch device share a same color layer of the same material. Therefore, the visual color difference perceived by the user is eliminated.

Abstract: The present invention is directed to a method of calibrating sensitivity gain. In a preview mode, an imaging device is calibrated by a standard light source, therefore obtaining standard sensitivity gain of the preview mode. In a capture mode, the imaging device is calibrated by the standard light source, therefore obtaining standard sensitivity gain of the capture mode. A gain ratio of the standard sensitivity gain of the capture mode to the standard sensitivity gain of the preview mode is determined, and is then used to deduce the exposure parameters of the capture mode according to the exposure parameters of the preview mode.

Abstract: In some embodiments a request is received to perform an error injection or a memory migration, a mode is entered that blocks requests from agents other than a current processor core or thread, the error is injected or the memory is migrated, and the mode that blocks requests from the agents other than the current processor core or thread is exited. Other embodiments are described and claimed.

Abstract: In some embodiments system reconfiguration code and data to be used to perform a dynamic hardware reconfiguration of a system including a plurality of processor cores is cached and any direct or indirect memory accesses during the dynamic hardware reconfiguration are prevented. One of the processor cores executes the cached system reconfiguration code and data in order to dynamically reconfigure the hardware. Other embodiments are described and claimed.

Abstract: The present invention is directed to a method of calibrating sensitivity gain. In a preview mode, an imaging device is calibrated by a standard light source, therefore obtaining standard sensitivity gain of the preview mode. In a capture mode, the imaging device is calibrated by the standard light source, therefore obtaining standard sensitivity gain of the capture mode. A gain ratio of the standard sensitivity gain of the capture mode to the standard sensitivity gain of the preview mode is determined, and is then used to deduce the exposure parameters of the capture mode according to the exposure parameters of the preview mode.

Abstract: In one embodiment, the present invention includes a method for receiving a first memory request from a first caching agent associated with a first processor, in a home agent associated with a memory, directing the first memory request to a writeback queue of the home agent if the first memory request is a writeback request and otherwise directing the first memory request to a second queue of the home agent. In this way, circular dependencies may be avoided. Other embodiments are described and claimed.

Abstract: According to one embodiment, a computer system is disclosed. The computer system includes a graphics accelerator and a graphics cache coupled to the graphics accelerator. The graphics cache stores texture data, color data and depth data.