Abstract: Provided is a package structure and a method of forming the same. The package structure includes a semiconductor package, a stacked patch antenna structure, and a plurality of conductive connectors. The semiconductor package includes a die. The stacked patch antenna structure is disposed on the semiconductor package, and separated from the semiconductor package by an air cavity. The plurality of conductive connectors is disposed in the air cavity between the semiconductor package and the stacked patch antenna structure to connect the semiconductor package and the stacked patch antenna structure.

Abstract: A wafer loading device having improved lift-pin structure is provided to solve the particle clogging problems. The wafer loading device includes a pedestal with a plurality of holes for allowing the lift pins to move in vertical direction. The structure of the lift pins includes a neck portion connecting a head portion and a support portion. The neck portion is narrower than the support portion for leaving a gap in the hole. The lift ring is driven by a lift driver and disposed beneath the pedestal for controlling the movement of the lift pins.