Patents by Inventor Chung-Chiao TAN

Chung-Chiao TAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11400484
    Abstract: A fan blade and a fabricating method thereof are provided. The fan blade includes a rough coating layer on a surface thereof. The rough coating layer includes a plurality of recessed regions. A maximum depth of recess of the recessed regions is between 50 ?m to 130 ?m.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: August 2, 2022
    Assignee: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chung-Chiao Tan
  • Patent number: 11349188
    Abstract: An electronic device includes a casing, a fan base, a fan side wall and an impeller. The casing has a fan top wall. The fan top wall has an airflow inlet. The fan base is provided in the casing. The fan side wall extends from the casing or the fan base. The fan top wall, the fan base and the fan side wall define a fan space communicated with the airflow inlet and a first airflow outlet communicated with the fan space. The impeller is mounted at the fan base and is located in the fan space.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: May 31, 2022
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chung-Chiao Tan, Wei-Cheng Liu
  • Publication number: 20220120284
    Abstract: A fan blade and a fabricating method thereof are provided. The fan blade includes a rough coating layer on a surface thereof. The rough coating layer includes a plurality of recessed regions. A maximum depth of recess of the recessed regions is between 50 ?m to 130 ?m.
    Type: Application
    Filed: October 19, 2020
    Publication date: April 21, 2022
    Applicant: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chung-Chiao Tan
  • Patent number: 11262819
    Abstract: An electronic device includes a casing, a motherboard, a battery, a fan, and a heat dissipation module. The motherboard is arranged in the casing, and defines a first space with the casing. The battery is arranged in the casing and defines a second space with the motherboard. The motherboard separates the first space and the second space. The fan is arranged in the casing and has a first airflow outlet and a second airflow outlet independent of the first airflow outlet. The first airflow outlet communicates with the first space and the second space. The heat dissipation module is arranged in the casing and transfers heat from the motherboard to the second airflow outlet.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: March 1, 2022
    Assignee: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chung-Chiao Tan, Tung-Hsin Yeh
  • Patent number: 11249514
    Abstract: A head-mounted display device includes a casing, a control circuit board and a fan. The casing has a heat dissipation hole, and a face side and an external side opposite each other. The control circuit board is disposed in the casing. The fan is disposed in the casing and located between the control circuit board and the face side of the casing, and is configured to generate an air flow flowing from the face side toward the heat dissipation hole.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: February 15, 2022
    Assignee: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chung-Chiao Tan
  • Publication number: 20210303024
    Abstract: A head-mounted display device includes a casing, a control circuit board and a fan. The casing has a heat dissipation hole, and a face side and an external side opposite each other. The control circuit board is disposed in the casing. The fan is disposed in the casing and located between the control circuit board and the face side of the casing, and is configured to generate an air flow flowing from the face side toward the heat dissipation hole.
    Type: Application
    Filed: July 7, 2020
    Publication date: September 30, 2021
    Applicant: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chung-Chiao Tan
  • Publication number: 20210265718
    Abstract: An electronic device includes a casing, a fan base, a fan side wall and an impeller. The casing has a fan top wall. The fan top wall has an airflow inlet. The fan base is provided in the casing. The fan side wall extends from the casing or the fan base. The fan top wall, the fan base and the fan side wall define a fan space communicated with the airflow inlet and a first airflow outlet communicated with the fan space. The impeller is mounted at the fan base and is located in the fan space.
    Type: Application
    Filed: September 8, 2020
    Publication date: August 26, 2021
    Applicant: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chung-Chiao Tan, Wei-Cheng Liu
  • Publication number: 20210216119
    Abstract: An electronic device includes a casing, a motherboard, a battery, a fan, and a heat dissipation module. The motherboard is arranged in the casing, and defines a first space with the casing. The battery is arranged in the casing and defines a second space with the motherboard. The motherboard separates the first space and the second space. The fan is arranged in the casing and has a first airflow outlet and a second airflow outlet independent of the first airflow outlet. The first airflow outlet communicates with the first space and the second space. The heat dissipation module is arranged in the casing and transfers heat from the motherboard to the second airflow outlet.
    Type: Application
    Filed: September 8, 2020
    Publication date: July 15, 2021
    Applicant: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chung-Chiao Tan, Tung-Hsin Yeh
  • Publication number: 20180026495
    Abstract: A micro fan is provided. The micro fan includes a rotor and a stator. The stator includes an axial induced coil unit and a circuit board. The axial induced coil unit is made by twining a coil in an axial direction for at least two layers and in a radial direction for at least two layers.
    Type: Application
    Filed: March 23, 2017
    Publication date: January 25, 2018
    Inventors: Chao-Wen LU, Che-Wei LEE, Chung-Chiao TAN