Abstract: A semiconductor package includes a redistribution structure, a supporting layer, a semiconductor device, and a transition waveguide structure. The redistribution structure includes a plurality of connectors. The supporting layer is formed over the redistribution structure and disposed beside and between the plurality of connectors. The semiconductor device is disposed on the supporting layer and bonded to the plurality of connectors, wherein the semiconductor device includes a device waveguide. The transition waveguide structure is disposed on the supporting layer adjacent to the semiconductor device, wherein the transition waveguide structure is optically coupled to the device waveguide.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a photonic die, an encapsulant and a wave guide structure. The photonic die includes: a substrate, having a wave guide pattern formed at front surface; and a dielectric layer, covering the front surface of the substrate, and having an opening overlapped with an end portion of the wave guide pattern. The encapsulant laterally encapsulates the photonic die. The wave guide structure lies on the encapsulant and the photonic die, and extends into the opening of the dielectric layer, to be optically coupled to the wave guide pattern.

Abstract: A package includes an electronic die, a photonic die underlying and electronically communicating with the electronic die, a lens disposed on the electronic die, and a prism structure disposed on the lens and optically coupled to the photonic die. The prism structure includes first and second polymer layers, the first polymer layer includes a first curved surface concaving toward the photonic die, the second polymer layer embedded in the first polymer layer includes a second curved surface substantially conforming to the first curved surface, and an outer sidewall of the second polymer layer substantially aligned with an outer sidewall of the first polymer layer.

Abstract: An integrated circuit package and a method of forming the same are provided. The integrated circuit package includes a photonic integrated circuit die. The photonic integrated circuit die includes an optical coupler. The integrated circuit package further includes an encapsulant encapsulating the photonic integrated circuit die, a first redistribution structure over the photonic integrated circuit die and the encapsulant, and an opening extending through the first redistribution structure and exposing the optical coupler.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: Various embodiments of the present disclosure provide a semiconductor device structure. In one embodiment, the semiconductor device structure includes a first source/drain feature and a second source/drain feature, a plurality of semiconductor layers vertically stacked and disposed between the first and second source/drain features, a gate electrode layer surrounding a portion of each of the plurality of the semiconductor layers, and an interfacial layer (IL) disposed between the gate electrode layer and one of the plurality of the semiconductor layers, wherein a topmost semiconductor layer of the plurality of the semiconductor layers has a first length, and the IL has a second length greater than the first length.

Abstract: The present invention is directed to a method for treating cross-linked (cured) filled or untilled unsaturated polyester for deriving an alcohol recycle reactant useful in the synthesis of alcohol-formed derivative products. The first step of the method is the attrition of the cured unsaturated polyester to form particulates thereof. In the next step of the process, at least a fraction of any filler or fiberglass in the cured unsaturated polyester is separated to form a cured unsaturated polyester regrind. The next step is the subjecting of the cured unsaturated polyester regrind to agitated, uncatalyzed or catalyzed glycolysis in the presence of excess glycol and, optionally, a transesterification catalyst under agitation at elevated transesterification temperature. The final step of the process is the recovery of the recycle alcohol reactant for use in the synthesis of alcohol-formed derivative products.

Abstract: Disclosed is the compatibilizing of an incompatible blend of a long-chain polyether polyol and a short chain diol by providing that the polyether polyol comprises at least two polyoxypropylene triols, one of which has a molecular weight of between about 2,000 and 8,000, the second of which has a molecular weight of between about 300 and 900. The blend is fluid and substantially devoid of polyoxyethylene polyol content.

Abstract: Disclosed is a storage stable blend of a long chain polyol and a short chain diol wherein the diol is present in an amount whereby the diol and polyol form an incompatible blend. The blend is rendered storage stable by the addition of a compatibilizing amount of an ethylenically unsaturated esterol. Alternatively, the compatibilizing agent comprises an adduct of the ethylenically unsaturated esterol and a polyol, e.g. glycol. The storage stable blends find utility in making rigid, tough RIM parts.

Abstract: Isocyanate-reactive prepolymers containing at least one terminal epoxide group with an associated secondary hydroxy group and grafted thereto a polymeric moiety derived from polymerizing an ethylenically unsaturated monomer are disclosed. When reacted with isocyanate, these prepolymers form thermoset compositions which comprise oxazolidone groups in the backbone that are separated by ester linkages, urethane linkages in side chains attached to the backbone, and polymeric moieties derived from one or more ethylenically unsaturated monomer grafted to the polymer backbone.

Abstract: Isocyanate-reactive prepolymers containing at least one terminal epoxide group with an associated secondary hydroxy group and grafted thereto a polymeric moiety derived from polymerizing an ethylenically unsaturated monomer are disclosed. When reacted with isocyanate, these prepolymers form thermoset compositions which comprise oxazolidone groups in the backbone that are separated by ester linkages, urethane linkages in side chains attached to the backbone, and polymeric moieties derived from one or more ethylenically unsaturated monomer grafted to the polymer backbone.

Abstract: Phase stable compositions containing a paraffinic polyol chain extender, e.g., 1,4-butanediol, and an isocyanate-reactive prepolymer containing hydroxy and epoxy groups are formed by heating the polyol and prepolymer in the presence of one another to yield the phase stable composition. The composition, when reacted with a polyisocyanate, yields poly(oxazolidone/urethane) thermoset compositions.

Abstract: Reaction of a polyol, acid anhydride and diepoxide, preferably in a single step, yields a prepolymer composition containing a prepolymer containing terminal epoxy and non-terminal, secondary hydroxy groups. Reaction of this prepolymer with a polyisocyanate yields a poly(oxazolidone/urethane) thermoset composition which is essentially free of isocyanurate linkages. The thermoset contains oxazolidone linkages in the backbone of its recurring unit and urethane linkages which are present in a side chain of the unit.