Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: A ferroelectric memory device and a semiconductor die are provided. The ferroelectric memory device includes a gate electrode; a channel layer, overlapped with the gate electrode; source/drain contacts, in contact with separate ends of the channel layer; a ferroelectric layer, lying between the gate electrode and the channel layer; and a first insertion layer, extending in between the ferroelectric layer and the channel layer, and comprising a metal carbonitride or a metal nitride.

Abstract: The present invention is directed to a method for treating cross-linked (cured) filled or untilled unsaturated polyester for deriving an alcohol recycle reactant useful in the synthesis of alcohol-formed derivative products. The first step of the method is the attrition of the cured unsaturated polyester to form particulates thereof. In the next step of the process, at least a fraction of any filler or fiberglass in the cured unsaturated polyester is separated to form a cured unsaturated polyester regrind. The next step is the subjecting of the cured unsaturated polyester regrind to agitated, uncatalyzed or catalyzed glycolysis in the presence of excess glycol and, optionally, a transesterification catalyst under agitation at elevated transesterification temperature. The final step of the process is the recovery of the recycle alcohol reactant for use in the synthesis of alcohol-formed derivative products.

Abstract: Disclosed is the compatibilizing of an incompatible blend of a long-chain polyether polyol and a short chain diol by providing that the polyether polyol comprises at least two polyoxypropylene triols, one of which has a molecular weight of between about 2,000 and 8,000, the second of which has a molecular weight of between about 300 and 900. The blend is fluid and substantially devoid of polyoxyethylene polyol content.

Abstract: Disclosed is a storage stable blend of a long chain polyol and a short chain diol wherein the diol is present in an amount whereby the diol and polyol form an incompatible blend. The blend is rendered storage stable by the addition of a compatibilizing amount of an ethylenically unsaturated esterol. Alternatively, the compatibilizing agent comprises an adduct of the ethylenically unsaturated esterol and a polyol, e.g. glycol. The storage stable blends find utility in making rigid, tough RIM parts.

Abstract: Isocyanate-reactive prepolymers containing at least one terminal epoxide group with an associated secondary hydroxy group and grafted thereto a polymeric moiety derived from polymerizing an ethylenically unsaturated monomer are disclosed. When reacted with isocyanate, these prepolymers form thermoset compositions which comprise oxazolidone groups in the backbone that are separated by ester linkages, urethane linkages in side chains attached to the backbone, and polymeric moieties derived from one or more ethylenically unsaturated monomer grafted to the polymer backbone.

Abstract: Isocyanate-reactive prepolymers containing at least one terminal epoxide group with an associated secondary hydroxy group and grafted thereto a polymeric moiety derived from polymerizing an ethylenically unsaturated monomer are disclosed. When reacted with isocyanate, these prepolymers form thermoset compositions which comprise oxazolidone groups in the backbone that are separated by ester linkages, urethane linkages in side chains attached to the backbone, and polymeric moieties derived from one or more ethylenically unsaturated monomer grafted to the polymer backbone.

Abstract: Phase stable compositions containing a paraffinic polyol chain extender, e.g., 1,4-butanediol, and an isocyanate-reactive prepolymer containing hydroxy and epoxy groups are formed by heating the polyol and prepolymer in the presence of one another to yield the phase stable composition. The composition, when reacted with a polyisocyanate, yields poly(oxazolidone/urethane) thermoset compositions.

Abstract: Reaction of a polyol, acid anhydride and diepoxide, preferably in a single step, yields a prepolymer composition containing a prepolymer containing terminal epoxy and non-terminal, secondary hydroxy groups. Reaction of this prepolymer with a polyisocyanate yields a poly(oxazolidone/urethane) thermoset composition which is essentially free of isocyanurate linkages. The thermoset contains oxazolidone linkages in the backbone of its recurring unit and urethane linkages which are present in a side chain of the unit.