Abstract: A heat dissipation device includes a main fixed base plate, a main heat pipe set, a lower heat dissipation fin set and an upper heat dissipation module. The main heat pipe set is fixed on the main fixed base plate, and the lower heat dissipation fin set is also fixed on the main fixed base plate, and the main heat pipe set passes through the lower heat dissipation fin set, and is exposed on the lower heat dissipation fin set. In addition, the upper heat dissipation module is detachably installed on the lower heat dissipation fin set and contacts the main heat pipe set.

Abstract: A heat dissipation device includes a vapor chamber for contacting a heat source; at least one heat pipe having a first end and a second end connected to the vapor chamber; at least one partition disposed inside the heat pipe to partition the inside of the heat pipe into a first channel and a second channel isolated from each other; and a heat dissipation fin set disposed on the vapor chamber and partially covers the heat pipe. The vapor chamber is filled with a liquid working medium that absorbs the heat of the heat source and then gasifies into a gaseous working medium. The gaseous working medium moves into the first channel and the second channel to be condensed by the heat dissipation fin set, so the gaseous working medium is liquefied into the liquid working medium, and then the liquid working medium flows back into the vapor chamber.

Abstract: An anti-wear screw includes a U-shaped anti-wear clip and a locking screw. The U-shaped anti-wear clip is used to clamp on a heat dissipation substrate, and the locking screw is passed through the U-shaped anti-wear clip to fix the heat dissipation substrate. In addition, the anti-wear screw further includes a pressure spring installed between the locking screw and the U-shaped anti-wear clip to exert pressure on the U-shaped anti-wear clip and the heat dissipation substrate.

Abstract: A heat dissipation device includes a main fixed base plate, a main heat pipe set, a lower heat dissipation fin set and an upper heat dissipation module. The main heat pipe set is fixed on the main fixed base plate, and the lower heat dissipation fin set is also fixed on the main fixed base plate, and the main heat pipe set passes through the lower heat dissipation fin set, and is exposed on the lower heat dissipation fin set. In addition, the upper heat dissipation module is detachably installed on the lower heat dissipation fin set and contacts the main heat pipe set.

Abstract: A heat dissipation device includes a vapor chamber for contacting a heat source; at least one heat pipe having a first end and a second end connected to the vapor chamber; at least one partition disposed inside the heat pipe to partition the inside of the heat pipe into a first channel and a second channel isolated from each other; and a heat dissipation fin set disposed on the vapor chamber and partially covers the heat pipe. The vapor chamber is filled with a liquid working medium that absorbs the heat of the heat source and then gasifies into a gaseous working medium. The gaseous working medium moves into the first channel and the second channel to be condensed by the heat dissipation fin set, so the gaseous working medium is liquefied into the liquid working medium, and then the liquid working medium flows back into the vapor chamber.

Abstract: A fan structure includes a fan impeller, a fan seat and a hollow shaft rod. The fan impeller has a circumferential section and a top section. The circumferential section has multiple fan blades. The fan seat has a bearing cup. A light-emitting unit and a photoconductive component are received in the bearing cup. The hollow shaft rod has a first end, a second end and a through hole. The through hole axially passes through the hollow shaft rod between the first and second ends. A first end of the hollow shaft rod is inserted in the top section of the fan impeller. A second end of the hollow shaft rod is inserted in the bearing cup of the fan seat and assembled with the photoconductive component. The fan structure improves the shortcoming of the conventional light-emitting fan that the light can be hardly fully projected.

Abstract: A fan structure includes a fan impeller, a fan seat and a hollow shaft rod. The fan impeller has a circumferential section and a top section. The circumferential section has multiple fan blades. The fan seat has a bearing cup. A light-emitting unit and a photoconductive component are received in the bearing cup. The hollow shaft rod has a first end, a second end and a through hole. The through hole axially passes through the hollow shaft rod between the first and second ends. A first end of the hollow shaft rod is inserted in the top section of the fan impeller. A second end of the hollow shaft rod is inserted in the bearing cup of the fan seat and assembled with the photoconductive component. The fan structure improves the shortcoming of the conventional light-emitting fan that the light can be hardly fully projected.