Abstract: An anti-peep display device includes a display module and an anti-peep module disposed on the display module. The anti-peep module includes the following features. The first light incident surface faces the display surface, the second and third light incident surfaces are located on opposite sides of the first light incident surface, the first condensing portion is disposed corresponding to the second light incident surface and the first light source, the second condensing portion is disposed corresponding to the third light incident surface and the second light source, the first and second condensing portions convert beams of the first and second light sources into anti-peep beams with a beam angle less than 10 degrees, and the optical microstructures reflect the anti-peep beams and exit the anti-peep beams from the light guide plate. The present invention also provides an anti-peep method applicable to the anti-peep display device.

Abstract: An integrated chip including a gate layer. An insulator layer is over the gate layer. A channel structure is over the insulator layer. A pair of source/drains are over the channel structure and laterally spaced apart by a dielectric layer. The channel structure includes a first channel layer between the insulator layer and the pair of source/drains, a second channel layer between the insulator layer and the dielectric layer, and a third channel layer between the second channel layer and the dielectric layer. The first channel layer, the second channel layer, and the third channel layer include different semiconductors.

Abstract: In one or more embodiments, an information handling system may include multiple fans, a chassis configured to house components of the information handling system, and at least one mat fastened to the chassis, among others. For example, the chassis may include multiple holes through the chassis. For instance, the at least one mat may cover the multiple holes. In one or more embodiments, the at least one mat and the multiple holes may be configured to reduce acoustic energy within the chassis produced by the multiple fans.

Abstract: A fastener includes a main body and a bending body. The main body includes a protrusion section and an extension section. The extension section is connected with the protrusion section. The bending body is connected with the extension section of the main body. The bending body includes a first plate and a second plate. The first plate is connected with the extension section. The second plate is connected with the first plate. An angle is formed between the first plate and the second plate. The second plate has a first surface and a second surface which is opposite to the first surface. The first surface faces toward the main body, and the second plate has a first rib protruding from the second surface.

Abstract: A shock isolation cage including a bottom plate, two side plates, a top plate, and two shock isolation members is provided. Each of the side plates is fixed to the bottom plate. The top plate is fixed to the side plates. The bottom plate, the side plates, and the top plate surround to form an accommodating space for accommodating an electronic apparatus. Each of the shock isolation members includes a main body, a first shock isolation portion, and a second shock isolation portion. The main body is fixed to the corresponding side plate. The first and second shock isolation portions are connected to the main body, and respectively contact the bottom surface and the top surface of the electronic apparatus.

Abstract: A vibration-absorbing module comprises a case structure and an electronic device. The case structure comprises a bottom plate, two lateral walls and a plurality of vibration absorbing elements. The two lateral walls are disposed on and perpendicular to the bottom plate. The vibration absorbing elements are pivotally disposed on the two lateral walls respectively. The distance between opposing pairs of vibration absorbing elements disposed on the two opposite lateral walls is smaller than the distance between the two lateral walls. The electronic device is detachably disposed between the two lateral walls, and the vibration absorbing elements are in contact with two opposite sides of the electronic device.