Patents by Inventor Chung-Ching CHU

Chung-Ching CHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230024339
    Abstract: A method for forming a semiconductor memory structure is provided. The method includes forming a stack over a substrate, and the stack includes first dielectric layers and second dielectric layers vertically alternately arranged. The method also includes forming first dielectric pillars through the stack, and etching the stack to form first trenches. Sidewalls of the first dielectric pillars are exposed from the first trenches. The method also includes removing the first dielectric pillars to form through holes, removing the second dielectric layers of the stack to form gaps between the first dielectric layers, and forming first conductive lines in the gaps.
    Type: Application
    Filed: February 9, 2022
    Publication date: January 26, 2023
    Inventors: Chih-Hsuan Cheng, Chieh-Fang Chen, Sheng-Chen Wang, Chieh-Yi Shen, Han-Jong Chia, Feng-Ching Chu, Meng-Han Lin, Feng-Cheng Yang, Yu-Ming Lin, Chung-Te Lin
  • Patent number: 11513638
    Abstract: A silver nanowire (SNW) protection layer structure includes a substrate; a SNW layer, disposed on the substrate and covering only a partial region of a surface of the substrate, the SNW layer including a plurality of SNW channels; and a SNW protection layer, disposed on the SNW layer and covering a region corresponding to the plurality of SNW channels, the SNW protection layer including a light-resistant antioxidant. A manufacturing method for the SNW protection layer structure above is further provided. The SNW protection layer structure and the manufacturing method thereof are applicable in a touch sensor.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: November 29, 2022
    Assignee: Cambrios Film Solutions Corporation
    Inventors: Yeh-Sheng Wang, Wei-Chia Fang, Chun-Hung Chu, Chung-Chin Hsiao, Ya-Ting Lin, Shih-Ching Chen
  • Publication number: 20220352353
    Abstract: A method for fabricating a semiconductor device that includes a merged source/drain feature extending between two adjacent fin structures is provided. An air gap is formed under the merged source/drain feature. Forming the epitaxial feature includes growing a first epitaxial feature having a first portion over the first fin structure and a second portion over the second fin structure, growing a second epitaxial feature over the first and second portions of the first epitaxial feature, and growing a third epitaxial feature over the second epitaxial feature. The second epitaxial feature includes a merged portion between the first fin structure and the second fin structure.
    Type: Application
    Filed: July 20, 2022
    Publication date: November 3, 2022
    Inventors: Feng-Ching Chu, Chung-Chi WEN, Wei-Yuan LU, Feng-Cheng YANG, Yen-Ming CHEN
  • Publication number: 20220290211
    Abstract: Disclosed is a method of determining a bacterial strain suitable for treating a human skin dysbiotic condition, comprising a step of doing network analysis by a computer to determine the connectivity of said bacterial strain with at least a second bacterial strain in a dysbiotic condition as well as a non-dysbiotic condition, wherein there is difference in said connectivity between said dysbiotic condition and said non-dysbiotic condition wherein said connectivity means a positive correlation or negative correlation and further wherein said network is generated by co-occurrence analysis of abundance of said bacterial strain and said second bacterial strain by DNA sequencing by following 16s rRNA amplicon or whole genome sequencing method.
    Type: Application
    Filed: August 20, 2020
    Publication date: September 15, 2022
    Applicant: Conopco, Inc., d/b/a UNILEVER
    Inventors: Chung-Ching CHU, Mingming PU, Yining XU
  • Publication number: 20220226213
    Abstract: The present invention relates to Use of thymol or terpineol or an analogue of thymol or terpineol in a topical composition el for balancing microbiota of amenable skin, where balancing means selectively reducing microbial count of at least one genus of harmful microbes or of at least one genus of microbes that exhibit abnormal growth, while selectively increasing microbial count of at least one genus of beneficial microbes or of at least one genus of microbes whose numbers have abnormally reduced.
    Type: Application
    Filed: May 26, 2020
    Publication date: July 21, 2022
    Applicant: Conopco, Inc., d/b/a UNILEVER
    Inventors: Chung-Ching CHU, Mingming PU, Yining XU
  • Publication number: 20220223618
    Abstract: The present disclosure provides a semiconductor structure and a method for forming a semiconductor structure. The semiconductor structure includes a substrate, and a dielectric stack over the substrate. The dielectric stack includes a first layer over the substrate and a second layer over the first layer. The semiconductor structure further includes a gate layer including a first portion traversing the second layer and a second portion extending between the first layer and the second layer.
    Type: Application
    Filed: May 3, 2021
    Publication date: July 14, 2022
    Inventors: Feng-Ching Chu, Feng-Cheng Yang, Katherine H. Chiang, Chung-Te Lin, Chieh-Fang Chen
  • Publication number: 20210275415
    Abstract: This invention relates to an antimicrobial composition, especially one which provides synergistic anti-dandruff efficacy. This is achieved through a judicious combination of anti-dandruff agent zinc pyrithione and select antimicrobial lipids. These compositions can be delivered through shampoo or conditioner. Disclosed is an anti-microbial composition comprising: (i) 0.1 to 3% by weight of zinc pyrithione; (ii) 0.01 to 5.0% by weight of an antimicrobial lipid selected from sapienic acid, palmitoleic acid, sphingosine, dihydrosphingosine, and phytosphingosine; and a cosmetically acceptable vehicle, wherein said composition is a shampoo or a conditioner for preventing or alleviating the symptoms of dandruff on the scalp and/or hair and where an antimicrobial alcohol having 1 to 7 carbon atoms are absent from the composition.
    Type: Application
    Filed: April 5, 2018
    Publication date: September 9, 2021
    Inventors: Chung-Ching CHU, Mingming PU
  • Publication number: 20210030646
    Abstract: This invention relates to an antimicrobial composition, especially one which provides synergistic anti-dandruff or anti-acne efficacy. This is achieved through a judicious combination of select essential oil actives chosen from thymol, or terpineol and certain antimicrobial lipids selected from sapienic acid, palmitoleic acid, sphingosine, dihydrosphingosine, phytosphingosine, and 6-hydroxysphingosine. These compositions can be delivered through very many different types of personal care products e.g. shampoo, conditioner; face wash or hand wash product; or a leave on cream/lotion.
    Type: Application
    Filed: February 19, 2018
    Publication date: February 4, 2021
    Applicant: Conopco, Inc., d/b/a UNILEVER
    Inventors: Chung-Ching CHU, Mingming PU
  • Publication number: 20200360260
    Abstract: Disclosed is a topical composition comprising an antimicrobial lipid found in the sebum or stratum corneum of human beings, other than saturated C8 to 18 fatty acids, wherein said composition further comprises a biphenol obtainable from Magnolia spp.
    Type: Application
    Filed: November 15, 2018
    Publication date: November 19, 2020
    Applicant: Conopco, Inc., d/b/a UNILEVER
    Inventors: Chung-Ching CHU, Mingming PU, Yining XU