Patents by Inventor Chung-Ching Lai

Chung-Ching Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8375560
    Abstract: A method for manufacturing a condenser microphone includes forming a diaphragm module using microelectromechanical system (MEMS) techniques. The diaphragm module includes a diaphragm that is deformable by energy of sound waves, and a diaphragm spacer that extends from one side of the diaphragm and controls a tension of the diaphragm. The method further includes providing a backplate with vent holes, aligning the vent holes of the backplate with a central region of the diaphragm, and connecting the backplate to the diaphragm spacer to construct a transducer unit. The diaphragm spacer, the diaphragm and the backplate cooperate to form an air chamber in fluid communication with an environment external to the condenser microphone. The backplate and the diaphragm cooperate to form a condenser. The method further includes enclosing the transducer unit in a housing that includes a shell and a circuit board to form the condenser microphone.
    Type: Grant
    Filed: February 22, 2011
    Date of Patent: February 19, 2013
    Assignee: Taiwan Carol Electronics Co., Ltd.
    Inventors: Jean-Yih Tsai, Chung-Ching Lai, Chao-Chih Chang
  • Publication number: 20120210560
    Abstract: A method for manufacturing a condenser microphone includes forming a diaphragm module using microelectromechanical system (MEMS) techniques. The diaphragm module includes a diaphragm that is deformable by energy of sound waves, and a diaphragm spacer that extends from one side of the diaphragm and controls a tension of the diaphragm. The method further includes providing a backplate with vent holes, aligning the vent holes of the backplate with a central region of the diaphragm, and connecting the backplate to the diaphragm spacer to construct a transducer unit. The diaphragm spacer, the diaphragm and the backplate cooperate to form an air chamber in fluid communication with an environment external to the condenser microphone. The backplate and the diaphragm cooperate to form a condenser. The method further includes enclosing the transducer unit in a housing that includes a shell and a circuit board to form the condenser microphone.
    Type: Application
    Filed: February 22, 2011
    Publication date: August 23, 2012
    Applicant: TAIWAN CAROL ELECTRONICS CO., LTD.
    Inventors: Jean-Yih TSAI, Chung-Ching LAI, Chao-Chih CHANG
  • Publication number: 20020187616
    Abstract: A method of eliminating leakage current in shallow trench isolation is disclosed. After the trench is formed on the substrate, the liner oxide layer is formed in the furnace by introducing transdichloroethylene (TLC) into the furnace to round the corner of the trench. An electric filed near the rounded trench corner is decreased; thus, the leakage current produced in the corner of the shallow trench isolation is eliminated.
    Type: Application
    Filed: October 30, 2001
    Publication date: December 12, 2002
    Inventors: Chung-Ching Lai, Jui-Ping Li, Tung-Ming Lai, Chien-Nan Tu
  • Publication number: 20020185698
    Abstract: A gate for preventing dopants from penetrating a gate insulator comprises a polysilicon layer and an amorphous-silicon layer disposing on the polysilicon layer. The layered gate inhibits dopants from penetrating through a gate oxide layer disposing between the gate and a substrate. A source and a drain are disposed in the substrate beside the amorphous-silicon layer and the polysilicon layer.
    Type: Application
    Filed: November 9, 2001
    Publication date: December 12, 2002
    Inventors: Chung-Ching Lai, Jui-Ping Li, Tung-Ming Lai, Chien-Nan Tu