Patents by Inventor Chung-Chuan Tsent

Chung-Chuan Tsent has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220045049
    Abstract: A method of making a semiconductor device, includes: providing a first dielectric layer; sequentially forming a first metal layer, a dummy capacitor dielectric layer, and a second metal layer over the first dielectric layer; and using a single mask layer with two patterns to simultaneously recess two portions of the second metal layer so as to define a metal thin film of a resistor and a top metal plate of a capacitor.
    Type: Application
    Filed: October 22, 2021
    Publication date: February 10, 2022
    Inventors: Chen-Hsiang HUNG, Li-Hsin CHU, Chia-Ping LAI, Chung-Chuan TSENT
  • Publication number: 20190148370
    Abstract: A semiconductor device includes: a capacitor that includes a first metal plate; a capacitor dielectric layer disposed over the first metal plate; and a second metal plate disposed over the capacitor dielectric layer; and a resistor that includes a metal thin film, wherein the metal thin film of the resistor and the second metal plate of the capacitor are formed of a same metal material and wherein a top surface of the metal thin film is substantially coplanar with a top surface of the second metal plate of the capacitor.
    Type: Application
    Filed: April 27, 2018
    Publication date: May 16, 2019
    Inventors: Chen-Hsiang Hung, Li-Hsin Chu, Chia-Ping Lai, Chung-Chuan Tsent