Patents by Inventor Chung-Chun CHENG

Chung-Chun CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12368222
    Abstract: An electronic device including a substrate, a first metal pattern, a first insulating pattern, and a second metal pattern is provided. The first metal pattern is disposed on the substrate. The first insulating pattern is disposed on the first metal pattern. The second metal pattern is disposed on the first metal pattern and the first insulating pattern. The second metal pattern includes a first contact portion and a second contact portion. In a cross-sectional view, the first contact portion and the second contact portion are in contact with the first metal pattern, and the first insulating pattern is in contact with the first metal pattern and the second metal pattern between the first contact portion and the second contact portion.
    Type: Grant
    Filed: October 27, 2022
    Date of Patent: July 22, 2025
    Assignee: Innolux Corporation
    Inventors: Chung-Chun Cheng, Chia-Chi Ho, Chia-Ping Tseng, Yan-Zheng Wu, Yao-Wen Hsu
  • Publication number: 20250068016
    Abstract: An electronic device is provided. The electronic device includes a first substrate; a second substrate disposed opposite to the first substrate; a liquid crystal layer disposed between the first substrate and the second substrate; a plurality of first electrodes disposed between the first substrate and the liquid crystal layer; a plurality of second electrodes disposed between the second substrate and the liquid crystal layer; a first signal line disposed between the first substrate and the liquid crystal layer, and electrically connected to one of the plurality of first electrodes; and a second signal line disposed between the second substrate and the liquid crystal layer, and electrically connected to one of the plurality of second electrodes. The first signal line and the second signal line include a blackened metal.
    Type: Application
    Filed: November 13, 2024
    Publication date: February 27, 2025
    Inventors: Ting-Wei LIANG, Jiunn-Shyong LIN, I-An YAO, Tzu-Chieh LAI, Chung-Chun CHENG, Shih-Che CHEN
  • Patent number: 12169340
    Abstract: An electronic device is provided. The electronic device includes a first panel. The first panel includes a first substrate, a second substrate, a liquid crystal layer, a first transparent electrode, a second transparent electrode, and a first signal line. The second substrate is opposite to the first substrate. The liquid crystal layer is disposed between the first substrate and the second substrate. The first transparent electrode is disposed between the first substrate and the liquid crystal layer. The second transparent electrode is disposed between the second substrate and the liquid crystal layer. The first signal line is electrically connected to the first transparent electrode and extending along a first direction. The impedance of the first signal line is less than the impedance of the first transparent electrode.
    Type: Grant
    Filed: February 3, 2023
    Date of Patent: December 17, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Ting-Wei Liang, Jiunn-Shyong Lin, I-An Yao, Tzu-Chieh Lai, Chung-Chun Cheng, Shih-Che Chen
  • Publication number: 20240006295
    Abstract: A manufacturing method of electronic components includes the steps of: providing an insulating layer including a first region and a second region; providing a first metal layer disposed in the first region of the insulating layer; providing a second metal layer disposed on the first metal layer; providing a metal line in the second region of the insulating layer, wherein the metal line is electrically connected to the first metal layer; and removing the metal line to form an electronic component, wherein the electronic component includes the insulating layer; and a first metal bump disposed on the insulating layer and including: the first metal layer disposed on the insulating layer; and the second metal layer disposed on the first metal layer.
    Type: Application
    Filed: September 13, 2023
    Publication date: January 4, 2024
    Inventors: Chung-Chun CHENG, Kuang-Ming FAN, Yao-Wen HSU
  • Patent number: 11798875
    Abstract: An electronic component includes: an insulating layer; and a first metal bump disposed on the insulating layer and provided with: a first metal layer disposed on the insulating layer; and a second metal layer disposed on the first metal layer, wherein, in a cross-sectional view of the electronic component, the first metal layer has a first width, the second metal layer has a second width, and the first width is smaller than the second width.
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: October 24, 2023
    Assignee: INNOLUX CORPORATION
    Inventors: Chung-Chun Cheng, Kuang-Ming Fan, Yao-Wen Hsu
  • Publication number: 20230305343
    Abstract: An electronic device is provided. The electronic device includes a first panel. The first panel includes a first substrate, a second substrate, a liquid crystal layer, a first transparent electrode, a second transparent electrode, and a first signal line. The second substrate is opposite to the first substrate. The liquid crystal layer is disposed between the first substrate and the second substrate. The first transparent electrode is disposed between the first substrate and the liquid crystal layer. The second transparent electrode is disposed between the second substrate and the liquid crystal layer. The first signal line is electrically connected to the first transparent electrode and extending along a first direction. The impedance of the first signal line is less than the impedance of the first transparent electrode.
    Type: Application
    Filed: February 3, 2023
    Publication date: September 28, 2023
    Inventors: Ting-Wei LIANG, Jiunn-Shyong LIN, I-An YAO, Tzu-Chieh LAI, Chung-Chun CHENG, Shih-Che CHEN
  • Publication number: 20230170603
    Abstract: An electronic device including a substrate, a first metal pattern, a first insulating pattern, and a second metal pattern is provided. The first metal pattern is disposed on the substrate. The first insulating pattern is disposed on the first metal pattern. The second metal pattern is disposed on the first metal pattern and the first insulating pattern. The second metal pattern includes a first contact portion and a second contact portion. In a cross-sectional view, the first contact portion and the second contact portion are in contact with the first metal pattern, and the first insulating pattern is in contact with the first metal pattern and the second metal pattern between the first contact portion and the second contact portion.
    Type: Application
    Filed: October 27, 2022
    Publication date: June 1, 2023
    Applicant: Innolux Corporation
    Inventors: Chung-Chun Cheng, Chia-Chi Ho, Chia-Ping Tseng, Yan-Zheng Wu, Yao-Wen Hsu
  • Publication number: 20230119959
    Abstract: An electronic component includes: an insulating layer; and a first metal bump disposed on the insulating layer and provided with: a first metal layer disposed on the insulating layer; and a second metal layer disposed on the first metal layer, wherein, in a cross-sectional view of the electronic component, the first metal layer has a first width, the second metal layer has a second width, and the first width is smaller than the second width.
    Type: Application
    Filed: November 24, 2021
    Publication date: April 20, 2023
    Inventors: Chung-Chun CHENG, Kuang-Ming FAN, Yao-Wen HSU
  • Publication number: 20170102816
    Abstract: A touch substrate and a touch device are disclosed. The touch substrate includes a substrate and a touch electrode structure, which has a first transparent conductive layer and a second transparent conductive layer. The first transparent conductive layer is disposed on the substrate and the second transparent conductive layer is disposed on the first transparent conductive layer. The first transparent conductive layer has a first side surface located at a first side of the first transparent conductive layer, and the second transparent conductive layer has a second side surface located above the first side. The first side surface has a first slope, and the second side surface has a second slope. The absolute value of the first slope is greater than that of the second slope. The light reflection amount of the touch sensing structure is reduced to improve the visibility of the touch substrate and touch device.
    Type: Application
    Filed: October 7, 2016
    Publication date: April 13, 2017
    Inventors: Huei-Ying CHEN, Jian-Cheng CHEN, Shun-Fu CHIU, Shih-Che CHEN, Chung-Chun CHENG