Patents by Inventor Chung-Chun Huang

Chung-Chun Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250087529
    Abstract: A method for filling a gap includes: filling a dielectric layer in the gap so that a seam is formed in the dielectric layer, the dielectric layer including two surface portions at two opposite sides of the seam, respectively; introducing a surface modification agent into the seam such that each of the two surface portions has first functional groups and second functional groups; forming a stress layer on the dielectric layer to cover the seam, the stress layer including a material different from that of the dielectric layer; and applying an energy field to permit the two surface portions to bond with each other through reaction between the first functional groups and the second functional groups.
    Type: Application
    Filed: September 11, 2023
    Publication date: March 13, 2025
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Po-Hsien CHENG, Tai-Chun HUANG, Chung-Ting KO, Chia-Yu FANG, Sung-En LIN, Yu-Yun PENG
  • Publication number: 20250070092
    Abstract: Various embodiments of the present disclosure are directed towards a shared frontside pad/bridge layout for a three-dimensional (3D) integrated circuit (IC), as well as the 3D IC and a method for forming the 3D IC. A second IC die underlies the first IC die, and a third IC die underlies the second IC die. A first-die backside pad, a second-die backside pad, and a third die backside pad are in a row extending in a dimension and overlie the first, second, and third IC dies. Further, the first-die, second-die, and third-die backside pads are electrically coupled respectively to individual semiconductor devices of the first, second, and third IC dies. The second and third IC dies include individual pad/bridge structures at top metal (TM) layers of corresponding interconnect structures. The pad/bridge structures share the shared frontside pad/bridge layout and provide lateral routing in the dimension for the aforementioned electrical coupling.
    Type: Application
    Filed: November 12, 2024
    Publication date: February 27, 2025
    Inventors: Harry-Hak-Lay Chuang, Wei-Cheng Wu, Wen-Tuo Huang, Chia-Sheng Lin, Wei Chuang Wu, Shih Kuang Yang, Chung-Jen Huang, Shun-Kuan Lin, Chien Lin Liu, Ping-Tzu Chen, Yung Chun Tu
  • Publication number: 20250046720
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a device layer, and a metallization structure. The substrate has a first surface. The device layer is over the first surface of the substrate. The device layer includes a plurality of passive component units. The metallization structure is over the device layer. The metallization structure includes a conductive bridge portion electrically connecting two adjacent passive component units.
    Type: Application
    Filed: August 1, 2023
    Publication date: February 6, 2025
    Inventors: WEN-LIANG CHEN, CHUNG-CHIANG HUANG, YING-CHUN LIN, YEN-JUN LI
  • Patent number: 12216281
    Abstract: The present specification describes examples of position-based switching of display devices. An example augmented reality (AR) device includes an AR display device to render display data. The example AR device also includes a wireless communication device to transmit and receive wireless signals. The example AR device further includes a processor to: 1) determine a position of the AR device relative to a computing device based on wireless signals communicated with the computing device; and 2) switch an activity state of the AR display device based on the determined position of the AR device relative to the computing device.
    Type: Grant
    Filed: October 25, 2022
    Date of Patent: February 4, 2025
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chung-Chun Chen, Ming-Shien Tsai, Chih-Ming Huang
  • Patent number: 12211897
    Abstract: The present disclosure provides a semiconductor device with a plurality of semiconductor channel layers. The semiconductor channel layers include a first semiconductor layer and a second semiconductor layer disposed over the first semiconductor layer. A strain in the second semiconductor layer is different from a strain in the first semiconductor layer. A gate is disposed over the plurality of semiconductor channel layers.
    Type: Grant
    Filed: July 31, 2023
    Date of Patent: January 28, 2025
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Chung-En Tsai, Chia-Che Chung, Chee-Wee Liu, Fang-Liang Lu, Yu-Shiang Huang, Hung-Yu Yeh, Chien-Te Tu, Yi-Chun Liu
  • Patent number: 11768112
    Abstract: An insert coaxial thermal radiation image evaluating system includes a cage support, first lens, first cage movable frame, second cage movable frame, cage holder and light detector. The first cage movable frame is movably disposed at the cage support and connected to the first lens. The second cage movable frame is movably disposed at the cage support and connected to the light detector. The cage holder is connected to the cage support to fix the cage support to an optical substrate. The first cage movable frame is movably disposed in the cage holder. The first lens and a second lens of a metal additive manufacturing system together form a structure of conjugate foci, such that a thermal radiation generated from a high-power infrared laser irradiation zone forms according to a fixed ratio an image captured by the light detector.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: September 26, 2023
    Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Yuan-Yao Lin, Chao-Kuei Lee, Yi-Jen Chiu, Chung-Chun Huang, Qian-Mao Zhou, Ya-Hsuan Cheng, Ming-Wei Liu, Kuo-Kuang Jen, Chih-Peng Chen
  • Publication number: 20210356326
    Abstract: An insert coaxial thermal radiation image evaluating system includes a cage support, first lens, first cage movable frame, second cage movable frame, cage holder and light detector. The first cage movable frame is movably disposed at the cage support and connected to the first lens. The second cage movable frame is movably disposed at the cage support and connected to the light detector. The cage holder is connected to the cage support to fix the cage support to an optical substrate. The first cage movable frame is movably disposed in the cage holder. The first lens and a second lens of a metal additive manufacturing system together form a structure of conjugate foci, such that a thermal radiation generated from a high-power infrared laser irradiation zone forms according to a fixed ratio an image captured by the light detector.
    Type: Application
    Filed: February 25, 2021
    Publication date: November 18, 2021
    Inventors: YUAN-YAO LIN, CHAO-KUEI LEE, YI-JEN CHIU, CHUNG-CHUN HUANG, QIAN-MAO ZHOU, YA-HSUAN CHENG, MING-WEI LIU, KUO-KUANG JEN, CHIH-PENG CHEN
  • Patent number: 11065814
    Abstract: The present application provides not only a heating device for additive manufacturing but also a heating module and a manufacturing apparatus utilizing the heating device. The heating device utilizes a rotational reflective cover to modulate a heating direction of a heating source, which expands an area correspondingly irradiated by the heating source and enhances uniformity of heating. Besides, the heating modules can be coupled and controlled by a controlling subsystem so as to respectively irradiate different areas with ranges at least partially intersecting each other, which also improves heating uniformity for heating a large area.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: July 20, 2021
    Assignee: National Chung-Shan Institute of Science and Technology
    Inventors: Chung-Chun Huang, Chih-Peng Chen, Po-Shen Lin
  • Patent number: 10814556
    Abstract: An additive manufacturing apparatus includes a main system and a cleaning transportation system separated from the main system. The main system includes an additive manufacturing module. The additive manufacturing module includes an additive manufacturing chamber. The additive manufacturing chamber includes a powder discharging openings and a vibration unit. The powder discharging openings are formed at a lower portion of the additive manufacturing chamber, and the powders in the additive manufacturing chamber are discharged down via gravitation. The vibrational unit is for vibrating the powders so as to accelerate downward powder discharging via vibration of the vibrational unit. The present application solves the conventional problems of excessive consumed energy, large required installation and operational space, inconvenience of powder removing and swirled raised powder haze in the environment.
    Type: Grant
    Filed: October 21, 2018
    Date of Patent: October 27, 2020
    Assignee: National Chung-Shan Institute of Science and Technology
    Inventors: Chung-Chun Huang, Chih-Peng Chen, Po-Shen Lin, Yu-Ching Tseng
  • Patent number: 10780504
    Abstract: A powder recycling system includes a supply tank, a continuous loss-in-weight module, a pneumatic module, a transfer channel, a recycle module, and a refilling tank. The supply tank accommodates recycling powder. The continuous loss-in-weight module includes a storage tank receiving the recycling powder from the supply tank and a rotary output pipe connected to the storage tank to output the recycling powder. The continuous loss-in-weight module controls the mass flow rate of the output of the recycling powder according to the weight change of the storage tank. The pneumatic module enables the recycling powder to float and move in the transfer channel. The recycle module is connected to the transfer channel to receive the recycling powder, sieves the recycling powder, provides virgin powder, and mixes the virgin powder with the recycling powder. The refilling tank is connected to the recycle module to receive the recycling powder and the virgin powder.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: September 22, 2020
    Assignee: NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Yi-Lun Xiao, Li-Tsung Sheng, Shu-San Hsiau, Kuo-Kuang Jen, Chih-Peng Chen, Po-Shen Lin, Chung-Chun Huang
  • Publication number: 20190160798
    Abstract: A replacing device for a laminated manufacturing platform is provided. The replacing device has a box, a carrying body, and a lifting mechanism. The box includes two slides. The carrying body can slide on the slide and be replaced by another carrying body. Thus, problems that a working platform of a laminated manufacturing equipment is not moved, workpieces are not automatically produced and the workpieces are not synchronously replaced can be effectively solved.
    Type: Application
    Filed: February 18, 2018
    Publication date: May 30, 2019
    Inventors: Kuo-kuang JEN, Chung-chun HUANG, Che-chang CHENG, Tzu-chia YANG, Chi-hsiang HUNG, Hsin-pao CHEN, Jui-hsiung YEN
  • Publication number: 20190160751
    Abstract: The present application provides not only a heating device for additive manufacturing but also a heating module and a manufacturing apparatus utilizing the heating device. The heating device utilizes a rotational reflective cover to modulate a heating direction of a heating source, which expands an area correspondingly irradiated by the heating source and enhances uniformity of heating. Besides, the heating modules can be coupled and controlled by a controlling subsystem so as to respectively irradiate different areas with ranges at least partially intersecting each other, which also improves heating uniformity for heating a large area.
    Type: Application
    Filed: October 24, 2018
    Publication date: May 30, 2019
    Inventors: Chung-Chun Huang, Chih-Peng Chen, Po-Shen Lin
  • Publication number: 20190151954
    Abstract: A powder recycling system includes a supply tank, a continuous loss-in-weight module, a pneumatic module, a transfer channel, a recycle module, and a refilling tank. The supply tank accommodates recycling powder. The continuous loss-in-weight module includes a storage tank receiving the recycling powder from the supply tank and a rotary output pipe connected to the storage tank to output the recycling powder. The continuous loss-in-weight module controls the mass flow rate of the output of the recycling powder according to the weight change of the storage tank. The pneumatic module enables the recycling powder to float and move in the transfer channel. The recycle module is connected to the transfer channel to receive the recycling powder, sieves the recycling powder, provides virgin powder, and mixes the virgin powder with the recycling powder. The refilling tank is connected to the recycle module to receive the recycling powder and the virgin powder.
    Type: Application
    Filed: November 17, 2017
    Publication date: May 23, 2019
    Inventors: Yi-Lun Xiao, Li-Tsung Sheng, Shu-San Hsiau, Kuo-Kuang Jen, Chih-Peng Chen, Po-Shen Lin, Chung-Chun Huang
  • Publication number: 20190143597
    Abstract: The present application discloses an additive manufacturing chamber, an additive manufacturing module and an additive manufacturing apparatus therewith. Powder discharging openings are formed at a lower portion of the additive manufacturing chamber, and the powders in the additive manufacturing chamber are discharged down via gravitation. The present application further includes a vibrational unit for vibrating the powders so as to accelerate downward powder discharging via vibration of the vibrational unit. The additive manufacturing apparatus can include a main system and a cleaning transportation system separated from the main system. The present application solves the conventional problems of excessive consumed energy, large required installation and operational space, inconvenience of powder removing and swirled raised powder haze in the environment.
    Type: Application
    Filed: October 21, 2018
    Publication date: May 16, 2019
    Inventors: Chung-Chun Huang, Chih-Peng Chen, Po-Shen Lin, Yu-Ching Tseng
  • Patent number: 8684709
    Abstract: A micro cooling fan includes a housing, a fan wheel, and a main circuit board. The main circuit board has a stator and a driving circuit. The stator is electrically connected to the driving circuit. The stator is disposed on a first inner surface, and the driving circuit is disposed on a first outer surface, so that the housing and the driving circuit of the micro fan motor form an integral structure. The first outer surface is opposite to the first inner surface, or the first outer surface is located on a side surface of the housing. Therefore, by disposing the driving circuit on the first outer surface, the wind resistance of the fan blades is reduced, and the air volume of the micro cooling fan is increased accordingly, so that the cooling effect of the micro cooling fan is improved.
    Type: Grant
    Filed: August 9, 2010
    Date of Patent: April 1, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Chung-Chun Huang, Chien-Chang Wang, Kun-Yi Liang
  • Patent number: 8608463
    Abstract: A micro cooling fan comprises a housing and a main circuit board. The housing has an accommodation space, a first inner surface, and a gap. The gap is in communication with the accommodation space, and two opposite side edges of the gap have a groove respectively. The main circuit board comprises a first circuit board and a second circuit board. The first circuit board has a stator, the second circuit board has a driving circuit, and the stator is electrically connected to the driving circuit. The first circuit board is disposed on the first inner surface, and the second circuit board is embedded into the grooves and blocks the gap.
    Type: Grant
    Filed: July 11, 2012
    Date of Patent: December 17, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Chung Chun Huang, Chien Chang Wang, Kun Yi Liang
  • Patent number: 8536970
    Abstract: A multilayered miniature coil component, comprising a plurality of coil layers and insulating layers, the plurality of coil layers and insulating layers being alternately overlapped on each other. Each of the plurality of coil layers includes a plurality of coils and wires, each of the coils has a first and a second end, and a plurality of first conductive portions is disposed on each of the coil layers, at least one second conductive portion is disposed on at least one of the coil layers, and each of the plurality of insulating layers has a plurality of conductive through holes disposed correspondingly to the first conductive portions and the second conductive portions, thus through the plurality of wires, the first and the second conductive portions and the conductive through holes, the plurality of coils in each of the coil layers are composed as a circuit loop.
    Type: Grant
    Filed: February 1, 2012
    Date of Patent: September 17, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Kun-Yi Liang, Chien-Chang Wang, Chung-Chun Huang
  • Publication number: 20130120096
    Abstract: A multilayered miniature coil component, comprising a plurality of coil layers and insulating layers, the plurality of coil layers and insulating layers being alternately overlapped on each other.
    Type: Application
    Filed: February 1, 2012
    Publication date: May 16, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kun-Yi Liang, Chien-Chang Wang, Chung-Chun Huang
  • Publication number: 20120275909
    Abstract: A micro cooling fan comprises a housing and a main circuit board. The housing has an accommodation space, a first inner surface, and a gap. The gap is in communication with the accommodation space, and two opposite side edges of the gap have a groove respectively. The main circuit board comprises a first circuit board and a second circuit board. The first circuit board has a stator, the second circuit board has a driving circuit, and the stator is electrically connected to the driving circuit. The first circuit board is disposed on the first inner surface, and the second circuit board is embedded into the grooves and blocks the gap.
    Type: Application
    Filed: July 11, 2012
    Publication date: November 1, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chung Chun Huang, Chien Chang Wang, Kun Yi Liang
  • Patent number: 8228007
    Abstract: The invention discloses a microwave supplying apparatus including a microwave generator, a first power divider, a second power divider, a first waveguide, and a second wave guide. The first waveguide is connected to the microwave generator and has a first output terminal and a second output terminal to divide a microwave generated by the microwave generator along a first direction. The second power divider is connected to the first output terminal and has a third output terminal and a fourth output terminal to divide the microwave along a second direction. The first waveguide and the second waveguide are connected to the third output terminal and the fourth terminal respectively and receive the microwave through the first power divider and the second power divider to respectively output the microwave fields with approximate intensity distributions.
    Type: Grant
    Filed: December 24, 2009
    Date of Patent: July 24, 2012
    Assignees: Chung-Shan Institute of Science and Technology, Armaments Bureau, Ministry of National Defense
    Inventors: Chung-Chun Huang, Tsun-Hsu Chang, Bo-Hung Lin, Chi-Wen Hu