Abstract: An apparatus is described that includes a camera system having a time-of-flight illuminator. The time of flight illuminator has a light source and one or more tiltable mirror elements. The one or more tiltable mirror elements are to direct the illuminator's light to only a region within the illuminator's field of view.

Abstract: An apparatus is described having an integrated two-dimensional image capture and three-dimensional time-of-flight depth capture system. The integrated two-dimensional image capture and three-dimensional time-of-flight depth capture system includes an illuminator to generate light for the time-of-flight depth capture system. The illuminator includes an array of light sources and a movable lens assembly. The movable lens assembly is to movably direct an emitted beam of the light to one of any of a plurality of locations within the illuminator's field of view to form an illuminated region of interest within the illuminator's field of view. The illuminated region of interest has a size that is smaller than the illuminator's field of view.

Abstract: An apparatus is described that includes a camera. The camera has a beam splitter to impose different optical paths for visible light and infra red light received by the camera. The camera has an infra red light detector to detect the infra red light and a visible light detector to detect the visible light.

Abstract: A time-of-flight camera system is described. The time-of-flight camera system includes an illuminator to illuminate a region within the time-of-flight camera system's field of view. The time-of-flight camera system includes an image sensor to receive optical signals from the illumination for determining depth profile information within the field of view using time-of-flight measurement techniques. The image sensor has circuitry to determine one or more regions within the field of view where a received optical signal from the illuminating was weak. The illuminator is also to re-illuminate the one or more regions with stronger light than the one or more regions received during the illuminating. Each of the one or more regions being smaller than the region. The image sensor is also to receive optical signals from the re-illumination for determining depth profile information within the one or more regions.

Abstract: A time-of-flight camera system is described. The time-of-flight camera system includes an illuminator to illuminate a region within the time-of-flight camera system's field of view. The time-of-flight camera system includes an image sensor to receive optical signals from the illumination for determining depth profile information within the field of view using time-of-flight measurement techniques. The image sensor has circuitry to determine one or more regions within the field of view where a received optical signal from the illuminating was weak. The illuminator is also to re-illuminate the one or more regions with stronger light than the one or more regions received during the illuminating. Each of the one or more regions being smaller than the region. The image sensor is also to receive optical signals from the re-illumination for determining depth profile information within the one or more regions.

Abstract: A time of flight camera system is described. The time of flight camera system includes an illuminator. The illuminator has a movable optical component to scan light within the time-of-flight camera's field of view to illuminate a first region within the field of view that is larger than a second region within the time-of-flight camera's field of view that is illuminated at any instant by the light. The illuminator also includes an image sensor to determine depth profile information within the first region using time-of-flight measurement techniques.

Abstract: An apparatus is described that includes first and second pixels arrays integrated on a same semiconductor chip. The first pixel array contains visible light pixels and no Z pixels. The second pixel array contains Z pixels and no visible light pixels. The first and second pixel arrays do not overlap on said same semiconductor chip.

Abstract: An apparatus is described that includes a first semiconductor chip having a first pixel array. The first pixel array has visible light sensitive pixels. The apparatus includes a second semiconductor chip having a second pixel array. The first semiconductor chip is stacked on the second semiconductor chip such that the second pixel array resides beneath the first pixel array. The second pixel array has IR light sensitive pixels for time-of-flight based depth detection.

Abstract: An apparatus is described that includes first and second pixels arrays integrated on a same semiconductor chip. The first pixel array contains visible light pixels and no Z pixels. The second pixel array contains Z pixels and no visible light pixels. The first and second pixel arrays do not overlap on said same semiconductor chip.

Abstract: An apparatus is described that includes an integrated two-dimensional image capture and three-dimensional time-of-flight depth capture system. The three-dimensional time-of-flight depth capture system includes an illuminator to generate light. The illuminator includes arrays of light sources. Each of the arrays is dedicated to a particular different partition within a partitioned field of view of the illuminator.

Abstract: An image sensor is described having a pixel array. The pixel array has a unit cell that includes visible light photodiodes and an infra-red photodiode. The visible light photodiodes and the infra-red photodiode are coupled to a particular column of the pixel array. The unit cell has a first capacitor coupled to the visible light photodiodes to store charge from each of the visible-light photodiodes. The unit cell has a readout circuit to provide the first capacitor's voltage on the particular column. The unit cell has a second capacitor that is coupled to the infra-red photodiode through a first transfer gate transistor to receive charge from the infra-red photodiode during a time-of-flight exposure. The first capacitor is coupled to the infra-red photodiode through a second transfer gate transistor to receive charge from the infra-red photodiode during the time-of-flight exposure.

Abstract: An apparatus is described that includes an image sensor having a first output port and a second output port. The first output port is to transmit a first image stream concurrently with a second image stream transmitted from the second output port.

Abstract: An apparatus is described that includes an integrated two-dimensional image capture and three-dimensional time-of-flight depth capture system. The three-dimensional time-of-flight depth capture system includes an illuminator to generate light. The illuminator includes arrays of light sources. Each of the arrays is dedicated to a particular different partition within a partitioned field of view of the illuminator.

Abstract: An apparatus is described. The apparatus includes a camera comprising a beam splitter to impose different optical paths for visible light and infra red light received by the camera. The camera also includes an infra red light detector to detect the infra red light and a visible light detector to detect the visible light, wherein, the different optical paths include an optical path having more than one internal reflection within the beam splitter.

Abstract: Apparatuses and methods for charge transfer in image sensors are disclosed. One example of an image sensor pixel may include a first charge storage node and a second charge storage node. A transfer circuit may be coupled between the first and second charge storage nodes, and the transfer circuit may have a first region proximate the first charge storage node and configured to have a first potential. The transfer circuit may also have a second region proximate the second charge storage node configured to have a second, higher potential. An input node may be configured to control the first and second potentials based on a transfer signal provided to the input node.

Abstract: An apparatus is described that includes a first semiconductor chip having a first pixel array. The first pixel array has visible light sensitive pixels. The apparatus includes a second semiconductor chip having a second pixel array. The first semiconductor chip is stacked on the second semiconductor chip such that the second pixel array resides beneath the first pixel array. The second pixel array has IR light sensitive pixels for time-of-flight based depth detection.

Abstract: An apparatus is described that includes a first semiconductor chip having a first pixel array. The first pixel array has visible light sensitive pixels. The apparatus includes a second semiconductor chip having a second pixel array. The first semiconductor chip is stacked on the second semiconductor chip such that the second pixel array resides beneath the first pixel array. The second pixel array has IR light sensitive pixels for time-of-flight based depth detection.

Abstract: An apparatus is described that includes an integrated two-dimensional image capture and three-dimensional time-of-flight depth capture system. The three-dimensional time-of-flight depth capture system includes an illuminator to generate light. The illuminator includes arrays of light sources. Each of the arrays is dedicated to a particular different partition within a partitioned field of view of the illuminator.

Abstract: An apparatus is described that includes a camera system having a time-of-flight illuminator. The time of flight illuminator has a light source and one or more tiltable mirror elements. The one or more tiltable mirror elements are to direct the illuminator's light to only a region within the illuminator's field of view.

Abstract: A pixel in an image sensor can include a photodetector and a storage region disposed in one substrate, or a photodetector disposed in one substrate and a storage region in another substrate. A buried light shield is disposed between the photodetector and the storage region. A sense region, such as a floating diffusion, can be adjacent to the storage region, with the buried light shield disposed between the photodetector and the storage and sense regions. When the photodetector and the storage region are disposed in separate substrates, a vertical gate can be formed through the buried light shield and used to initiate the transfer of charge from the photodetector and the storage region. A transfer channel formed adjacent to, or around the vertical gate provides a channel for the charge to transfer from the photodetector to the storage region.