Abstract: A directional silicon condenser microphone having an additional back chamber is disclosed. The directional silicon condenser microphone in accordance with the present invention comprises a case having a front sound hole for passing through a front sound; a acoustic delay device for delaying a phase of a sound; a substrate including a chamber case, a MEMS chip having an additional back chamber formed by the chamber case, a ASIC chip for operating the MEMS chip, a conductive pattern for bonding the substrate to the case, and a rear sound hole for passing through a rear sound; a fixing means for fixing the case to the substrate; and an adhesive for bonding the case and the substrate, wherein the adhesive is applied to an entirety of a bonding surface of the case and the substrate fixed by the fixing means.

Abstract: Provided is a MEMS microphone package having a sound hole in a PCB, which can ground-connect a metal case to a main board using an assembly process including bending and clamping an end of the case. The MEMS microphone package includes a tetragonal container-shaped metal case having an open-side to insert components into an inner space, and a chamfered end on the open-side to easily perform a curling operation, a printed circuit board (PCB) substrate to which a MEMS microphone chip and an application specific integrated circuit (ASIC) chip are mounted, the PCB substrate being inserted into the metal case and having a sound hole for introducing an external sound, and a support configured to support the PCB substrate in the curling operation and define a space between the metal case and the PCB substrate.

Abstract: A silicon condenser microphone has an additional back chamber and a sound hole in a PCB. The microphone includes a case for blocking an external sound; a substrate including a chamber case, a MEMS chip having an additional back chamber formed by the chamber case, an ASIC chip for operating the MEMS chip, a conductive pattern for a bonding to the case, and a sound hole for passing the external sound. A fixing means fixes the case to the substrate and an adhesive is applied to an entirety of a bonding surface of the case and the substrate fixed by the fixing means. When the sound hole is formed through the PCB instead of the case, the mounting space for a microphone is reduced. The chamber case forms the additional back chamber under the MEMS chip and is employed to increase back chamber space to improve sensitivity and reduce noise.

Abstract: A directional silicon condenser microphone having an additional back chamber is disclosed. The directional silicon condenser microphone comprises a case having a front sound hole for passing through a front sound; a acoustic delay device for delaying a phase of a sound; a substrate including a chamber case, a MEMS chip having an additional back chamber formed by the chamber case, an ASIC chip for operating the MEMS chip, a conductive pattern for bonding the substrate to the case, and a rear sound hole for passing through a rear sound; a fixing means for fixing the case to the substrate; and an adhesive for bonding the case and the substrate, wherein the adhesive is applied to an entirety of a bonding surface of the case and the substrate fixed by the fixing means.

Abstract: Provided is a MEMS microphone package that can shield a MEMS microphone chip from noise to greatly improve sound quality and reduce manufacturing costs, by inserting a PCB substrate to which the MEMS microphone chip is mounted into a metal case, and then by ground-connecting the metal case to a main board using an assembly process including bending and clamping an end of the case. The MEMS microphone package includes a tetragonal container-shaped metal case having an open-side to insert components into an inner space, and a chamfered end on the open-side to easily perform a curling operation, a PCB substrate to which a MEMS microphone chip and an ASIC chip are mounted, the PCB substrate being inserted into the case, and a support configured to support the PCB substrate and define a space between the case and the PCB substrate.

Abstract: Provided is a silicon condenser microphone using a case in which a plating layer is formed on a body formed of resin. The silicon condenser microphone includes: a case having a can-shaped resin body with one side open, and a plating layer formed on the body; and a substrate on which a micro electro mechanical system (MEMS) microphone chip and an application-specific integrated circuit (ASIC) chip for processing an electrical signal are mounted, a connection pattern for attaching the case is formed, and the case is attached to the connection pattern using a conductive adhesive. The case may be formed in a cylindrical shape or a rectangular box shape. The plating layer may be formed on an inner surface, an outer surface, or an entire surface of the body and a step may be formed along an inner periphery on an end portion of an opening surface of the body.

Abstract: Provided is an SMD type electret condenser microphone having a rectangular box shape, in which a curling process can be easily performed. In the electret condenser microphone, a pair of a diaphragm and a backplate is disposed to face each other, with a spacer being interposed therebetween. A conductive base electrically conducts the diaphragm, and an insulating base electrically insulates the backplate and the conductive base. A polar ring electrically conducts the diaphragm. A metal case has a rectangular box shape with one side open, such that the mechanical components are received. The metal case includes a curling surface, an edge portion of which is chamfered. Circuit components are mounted on a printed circuit board, which has a conductive pattern and a protruding connection terminal. A sealing pad is mounted on the insulating base to seal a gap between the metal case and the printed circuit board.

Abstract: There is provided a surface mount parallelepiped condenser microphone. In the surface mount parallelepiped condenser microphone, a case has a rectangular box shape with an opening, a backplate has a circular shape with a sound hole, a spacer has thin ring shape, an insulation ring has a hollow cylindrical shape with top and bottom openings, a diaphragm faces the backplate with disposing the spacer therebetween, and a PCB has a rectangular shape with a sound hole at a center portion, the PCB being electrically connected with the diaphragm through a conductive ring, wherein a metal ring, the backplate, the spacer, the insulation ring, the diaphragm, the conductive ring, and the PCB are sequentially disposed in the case, and the case is curled at the opening. Therefore, the direction of the surface mount condenser microphone can be easily detected when mounting on a main PCB.

Abstract: A condenser microphone and a method of mounting a condenser microphone on a main PCB are provided. The method includes assembling the condenser microphone by assembling elements of the condenser microphone such that a vibration plate including a diaphragm and a backplate is directed toward an opened surface of a casing of the condenser microphone. The casing has a closed bottom surface and an opened surface opposite to the closed bottom surface. A PCB includes a sound hole. The assembled condenser microphone is positioned on a main PCB such that the sound hole of the PCB is aligned in accordance with a through hole formed in the main PCB. According to the present invention, if necessary, the main PCB can be mounted such that its elements surface is directed toward an inside of an electronic product, thereby maintaining good sound quality due to a short delivery path of sound waves.

Abstract: A surface mounted device (SMD) type biased condenser microphone includes two terminals for a surface mounting process. The SMD type biased condenser microphone includes a grounding terminal for connecting with an external circuit, a diaphragm/backplate set, one end of which is connected to the grounding terminal, for varying a capacity according to an intensity of sound pressure and converting sound into an electric signal, a DC-DC converter for providing a bias voltage so as to form an electrostatic field at one side of the diaphragm/backplate set, a buffer IC for amplifying the electric signal from the diaphragm/backplate set, and a decoupling capacitor for preventing the bias voltage output from the DC-DC converter from being directly applied to the buffer IC and transferring the electric signal from the diaphragm/backplate set to the buffer IC.

Abstract: An electret condenser microphone includes a case, a diaphragm electrically connected to the case, a fixed electrode plate disposed opposing the diaphragm with a spacer interposed therebetween, the fixed electrode plate being formed of a metal plate coated with a polymer film on which an electret is formed, an insulating ring for insulating the fixed electrode plate from the case, a printed circuit board (PCB) defining a back chamber with the fixed electrode plate, and an integrated base for supporting the fixed electrode plate and the PCB and electrically connecting the fixed electrode plate to the circuit component embedded in the PCB through a connecting terminal. The integrated base includes a hollow cylindrical insulating body and metal plating layers formed on the top and bottom of the insulating body. Outer diameters of the metal plating layers are less than the insulating body and are electrically connected by a conductor.

Abstract: Disclosed are a silicon based condenser microphone and a packaging method for the silicon based condenser microphone. The silicon based condenser microphone comprises a metal case, and a board which is mounted with a MEMS microphone chip and an ASIC chip having an electric voltage pump and a buffer IC and is formed with a connecting pattern for bonding with the metal case, wherein the connecting pattern is welded to the metal case. The method for packaging a silicon based condenser microphone includes the steps of inputting a board which is mounted with a MEMS chip and an ASIC chip and is formed with a connecting pattern; inputting a metal case, aligning the metal case on the connecting pattern of the board, and welding an opened end of the metal case to the connecting pattern of the board. Thus, the metal case is welded to the board by the laser.

Abstract: A condenser microphone employs a wide band stop filter, having improved resistance to electrostatic discharge. This includes providing a condenser microphone used for a multi-band by comprising a wide band stop filter capable of efficiently blocking a wide band signal including low frequency and radio frequency used in a mobile communication. A condenser microphone includes: an acoustic module for converting sound pressure into an electric signal; an FET for amplifying the electric signal; and a wide band stop filter for blocking a wide band signal including low frequency and radio frequency output from the FET. The filter is realized by resistors and/or capacitors which are connected selectively according to the radio frequency band between the drain and the source of the FET. The range capable of removing EM noise is widened, an excellent filtering effect of noise is obtained, and resistance of electrostatic discharge applied from outside is improved.

Abstract: There is provided a surface mount parallelepiped condenser microphone. In the surface mount parallelepiped condenser microphone, a case has a rectangular box shape with an opening, a backplate has a circular shape with a sound hole, a spacer has thin ring shape, an insulation ring has a hollow cylindrical shape with top and bottom openings, a diaphragm faces the backplate with disposing the spacer therebetween, and a PCB has a rectangular shape with a sound hole at a center portion, the PCB being electrically connected with the diaphragm through a conductive ring, wherein a metal ring, the backplate, the spacer, the insulation ring, the diaphragm, the conductive ring, and the PCB are sequentially disposed in the case, and the case is curled at the opening. Therefore, the direction of the surface mount condenser microphone can be easily detected when mounting on a main PCB.

Abstract: A laser video projector using an optical pumping valve is provided. The video projector according to the present invention forms an image using an optical pumping valve including a laser resonator for resonating light of a certain wavelength, an optical pumping source for performing pumping so that the laser resonator can generate a laser beam, and an optical valve for filtering the laser beam emitted from the laser resonator so that the filtered laser beam forms a picture instead of a cathode ray tube (CRT).

Abstract: A semiconductor laser CRT for driving at room temperature, whose target is pumped by an electron beam, in which a laser target is fixed to a beaker-shaped transparent glass support plate, and the glass support plate is sealed with a glass bulb using fused frit glass. Accordingly, there is no cracking of the glass bulb due to a difference in thermal expansion or destroying of a sustained airtight vacuum.

Abstract: There is provided a method for fabricating a target for a laser cathode ray tube including the steps of (a) polishing one plane of a semiconductor layer, (b) forming a first mirror on the polished plane of the semiconductor layer, (c) forming an adhesion layer made of a bisbenzocyclobutene solution on top of a radiation layer, (d) adhering the adhesion layer and the first mirror to each other, (e) polishing the other surface of the semiconductor layer, and (f) forming a second mirror on the other surface of the semiconductor layer.