Abstract: A silver paste composition for screen and/or 3D printing of interconnects of an integrated circuit chip on a metal oxide ink coated stainless steel substrate carrier comprising a mixture of two or more distinct range of sizes of electrically conductive silver particles, a resin in an amount from 0.05 to 10 wt. % of the silver paste composition, a solvent in an amount from 1 to 25 wt. % of the silver paste composition, such that the silver paste composition has silver particles containing calcium content of less than 20 ppm and a viscosity of 10 to 400 Pa·s at a shear rate of 10 sec?1 at 25° C.

Abstract: A method for controlling corrosion of a substrate is provided herein. In one embodiment, a method for controlling corrosion of a substrate includes the steps of providing a substrate having a patterned photoresist layer with a metallic residue disposed thereon; exposing the substrate to a hydrogen-based plasma to remove the metallic residue; and removing the photoresist. The metallic residue may comprise residue from etching at least one of aluminum or copper. The metallic residue may further comprise a halogen compound from etching a metal-containing layer with a halogen-based process gas. The hydrogen-based plasma may comprise hydrogen (H2) and may further comprise at least one of nitrogen (N2) and water (H2O) vapor. The hydrogen-based plasma may further comprise an inert gas, such as argon (Ar).

Abstract: A method for controlling corrosion of a substrate is provided herein. In one embodiment, a method for controlling corrosion of a substrate includes the steps of providing a substrate having a patterned photoresist layer with a metallic residue disposed thereon; exposing the substrate to a hydrogen-based plasma to remove the metallic residue; and removing the photoresist. The metallic residue may comprise residue from etching at least one of aluminum or copper. The metallic residue may further comprise a halogen compound from etching a metal-containing layer with a halogen-based process gas. The hydrogen-based plasma may comprise hydrogen (H2) and may further comprise at least one of nitrogen (N2) and water (H2O) vapor. The hydrogen-based plasma may further comprise an inert gas, such as argon (Ar).

Abstract: Provided is a method of etching an etch layer using a polycarbonate layer as a mask. The method includes placing an etch structure in a reaction chamber, the etch structure including an etch layer underlying a polycarbonate layer, the polycarbonate layer having apertures. The etch layer is then etched using a low-pressure high density plasma generate at a pressure in the range of approximately 1 to 30 millitorr where the ionized particle concentration is at least 1011 ions/cm3 and where the ionized particle concentration is substantially equal throughout the volume of the reaction chamber. To increase the etch rate, the etch structure can be cooled or biased. To decrease the etch rate, an inert gas can be added to the process gas mixture used to form the plasma.

Abstract: Scattered or/and transmitted light is employed to determine characteristics, including dimensional information, of an object (60) such as part (10) of a flat-panel display. The dimensional information includes the average diameter of openings (62) in the object, the average density of the openings, and the average thickness of a layer (64) of the object. Light-diffraction patterns are produced to determine characteristics, such as abnormalities (146 and 148), of crossing lines (140 and 142) in such an object.

Abstract: A flat panel display and a method for forming a flat panel display. In one embodiment, the flat panel display includes a wall which is held in place by a structure formed either on the faceplate or on the backplate. In one embodiment the supporting structure is formed by two adjacent walls that form a slot which mechanically restrains the wall. In another embodiment a slot is formed within the faceplate and the walls of the slot mechanically restrain the wall. In one embodiment wall segments are inserted into supporting structures that mechanically restrain each wall segment. In another embodiment a UV curable or a heat curable adhesive is used to maintain walls in their proper alignment and position. In yet another embodiment a conductive material is melted so as to bond conductive lines located on the wall and conductive lines located on the faceplate.

Abstract: A flat panel display and a method for forming a flat panel display. In one embodiment, the flat panel display includes a wall which is held in place by a structure formed either on the faceplate or on the backplate. In one embodiment the supporting structure is formed by two adjacent walls that form a slot which mechanically restrains the wall. In another embodiment a slot is formed within the faceplate and the walls of the slot mechanically restrain the wall. In one embodiment wall segments are inserted into supporting structures that mechanically restrain each wall segment. In another embodiment a UV curable or a heat curable adhesive is used to maintain walls in their proper alignment and position. In yet another embodiment a conductive material is melted so as to bond conductive lines located on the wall and conductive lines located on the faceplate.

Abstract: A flat panel display and a method for forming a flat panel display. In one embodiment, the flat panel display includes a wall which is held in place by a structure formed either on the faceplate or on the backplate. In one embodiment the supporting structure is formed by two adjacent walls that form a slot which mechanically restrains the wall. In another embodiment a slot is formed within the faceplate and the walls of the slot mechanically restrain the wall. In one embodiment wall segments are inserted into supporting structures that mechanically restrain each wall segment. In another embodiment a UV curable or a heat curable adhesive is used to maintain walls in their proper alignment and position. In yet another embodiment a conductive material is melted so as to bond conductive lines located on the wall and conductive lines located on the faceplate.

Abstract: A flat panel display and a method for forming a flat panel display. In one embodiment, the flat panel display includes a wall which is held in place by a structure formed either on the faceplate or on the backplate. In one embodiment the supporting structure is formed by two adjacent walls that form a slot which mechanically restrains the wall. In another embodiment a slot is formed within the faceplate and the walls of the slot mechanically restrain the wall. In one embodiment wall segments are inserted into supporting structures that mechanically restrain each wall segment. In another embodiment a UV curable or a heat curable adhesive is used to maintain walls in their proper alignment and position. In yet another embodiment a conductive material is melted so as to bond conductive lines located on the wall and conductive lines located on the faceplate.

Abstract: A flat panel display and a method for forming a flat panel display. In one embodiment, the flat panel display includes a wall which is held in place by a structure formed either on the faceplate or on the backplate. In one embodiment the supporting structure is formed by two adjacent walls that form a slot which mechanically restrains the wall. In another embodiment a slot is formed within the faceplate and the walls of the slot mechanically restrain the wall. In one embodiment wall segments are inserted into supporting structures that mechanically restrain each wall segment. In another embodiment a UV curable or a heat curable adhesive is used to maintain walls in their proper alignment and position. In yet another embodiment a conductive material is melted so as to bond conductive lines located on the wall and conductive lines located on the faceplate.

Abstract: A flat panel display and a method for forming a flat panel display. In one embodiment, the flat panel display includes a wall which is held in place by a structure formed either on the faceplate or on the backplate. In one embodiment the supporting structure is formed by two adjacent walls that form a slot which mechanically restrains the wall. In another embodiment a slot is formed within the faceplate and the walls of the slot mechanically restrain the wall. In one embodiment wall segments are inserted into supporting structures that mechanically restrain each wall segment. In another embodiment a UV curable or a heat curable adhesive is used to maintain walls in their proper alignment and position. In yet another embodiment a conductive material is melted so as to bond conductive lines located on the wall and conductive lines located on the faceplate.

Abstract: Provided is a method of etching an etch layer using a polycarbonate layer as a mask. The method includes placing an etch structure in a reaction chamber, the etch structure including an etch layer underlying a polycarbonate layer, the polycarbonate layer having apertures. The etch layer is then etched using a low pressure-high density plasma generate at a pressure in the range of approximately 1 to 30 millitorr where the ionized particle concentration is at least 10.sup.11 ions/cm.sup.3 and where the ionized particle concentration is substantially equal throughout the volume of the reaction chamber. To increase the etch rate, the etch structure can be heated or biased. To decrease the etch rate, an inert gas can be added to the process gas mixture used to form the plasma.

Abstract: A field emission display device has a faceplate and a backplate. The faceplate includes a faceplate interior side with an active region made of a plurality of phosphor pixel elements; and the backplate has a backplate interior side with a plurality of field emitters. Sidewalls are positioned between the faceplate and the backplate, to form an enclosed sealed envelope between the sidewalls, backplate interior side and the faceplate interior side. At least one spacer wall in the envelope supports the backplate and the faceplate against forces acting in a direction toward the envelope. At least one internal structure fixes and constrains the faceplate and the backplate, and aligns a plurality of phosphor pixels with corresponding field emitters. Additionally, the faceplate can include at least one faceplate fiducial, and the backplate include a corresponding backplate fiducial. The faceplate fiducial is optically aligned with the backplate fiducial. First, the spacer wall is positioned in the wall gripper.

Abstract: A faceplate for a field emission display includes a substrate defining a faceplate interior side. Pluralities of phosphor pixels are disposed on the faceplate interior side. A black matrix grid is formed of column and row guard bands on the faceplate interior side. At least one wall gripper is formed in a column or row guard band, with the wall gripper adapted to receive a spacer wall and mount it relative to the pluralities of phosphor pixels. The faceplate can include a faceplate fiducial that optically aligns to a corresponding backplate fiducial. A spacer wall is positioned in the wall gripper and mounted relative to a corresponding locator formed on a backplate interior side. The wall gripper includes a receiving trench that is positioned adjacent to a plurality of deformation accommodation gaps.