Patents by Inventor Chung-Fa Chen

Chung-Fa Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967570
    Abstract: A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.
    Type: Grant
    Filed: March 4, 2022
    Date of Patent: April 23, 2024
    Assignee: MediaTek Inc.
    Inventors: Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen, Chung-Fa Lee
  • Publication number: 20240071535
    Abstract: Provided is an anti-fuse memory including a anti-fuse memory cell including an isolation structure, a select gate, first and second gate insulating layers, an anti-fuse gate, and first, second and third doped regions. The isolation structure is disposed in a substrate. The select gate is disposed on the substrate. The first gate insulating layer is disposed between the select gate and the substrate. The anti-fuse gate is disposed on the substrate and partially overlapped with the isolation structure. The second gate insulating layer is disposed between the anti-fuse gate and the substrate. The first doped region and the second doped region are disposed in the substrate at opposite sides of the select gate, respectively, wherein the first doped region is located between the select gate and the anti-fuse gate. The third doped region is disposed in the substrate and located between the first doped region and the isolation structure.
    Type: Application
    Filed: October 16, 2022
    Publication date: February 29, 2024
    Applicant: United Microelectronics Corp.
    Inventors: Chung-Hao Chen, Chi-Hsiu Hsu, Chi-Fa Lien, Ying-Ting Lin, Cheng-Hsiao Lai, Ya-Nan Mou
  • Publication number: 20230309725
    Abstract: A multifunctional wine glass includes a glass body, a glass stem, a glass base connecting seat, and a glass base. The glass body has a glass body connecting seat on one end thereof. The glass stem has one end movably connected with the glass body connecting seat. The glass base connecting seat has a first and a second connecting ends, and the first connecting end is movably connected with another end of the glass stem. The glass base has an arc face and a flat face disposed on two opposite sides thereof. The glass base has a connecting bore movably connected with the second connecting end. With the connecting bore, the glass base is selectively disposed in an arrangement for the arc face or the flat face to face the glass body.
    Type: Application
    Filed: October 7, 2022
    Publication date: October 5, 2023
    Inventor: CHUNG-FA CHEN
  • Publication number: 20190059623
    Abstract: A composite vessel includes a main body and a decoration member. The bottom portion of the main body is combined with the decoration member. The material forming the main body is different from the material forming the decoration member. Also, the material of the decoration member is light-permeable. Therefore, the composite vessel has an improved aesthetic appearance and utility thereof.
    Type: Application
    Filed: August 21, 2018
    Publication date: February 28, 2019
    Inventor: CHUNG-FA CHEN
  • Publication number: 20080150176
    Abstract: A dual-layer recordable optical disc includes a first recording layer and a second recording layer disposed on the first recording layer. The first recording layer is made of organic material, and the second recording layer is made of inorganic material. The optical disc may further includes a first substrate, a second substrate and a bonding layer. The first recording layer includes a dye recording layer disposed on the first substrate, and a first reflection layer disposed on the dye recording layer, whereas the second recording layer includes an inorganic recording layer and a second reflection layer disposed on the inorganic recording layer. In addition, the second substrate is disposed on the second reflection layer, and the bonding layer is disposed between the first reflection layer and the inorganic recording layer. A manufacturing process of the optical disc is also provided to increase production yield and lower manufacturing cost.
    Type: Application
    Filed: March 6, 2008
    Publication date: June 26, 2008
    Inventors: RU-LIN YEH, Chung-Fa Chen, Chun-Ying Lin, Wei-Hsiang Wang
  • Publication number: 20060110570
    Abstract: A dual-layer recordable optical disc includes a first recording layer and a second recording layer disposed on the first recording layer. The first recording layer is made of organic material, and the second recording layer is made of inorganic material. The optical disc may further includes a first substrate, a second substrate and a bonding layer. The first recording layer includes a dye recording layer disposed on the first substrate, and a first reflection layer disposed on the dye recording layer, whereas the second recording layer includes an inorganic recording layer and a second reflection layer disposed on the inorganic recording layer. In addition, the second substrate is disposed on the second reflection layer, and the bonding layer is disposed between the first reflection layer and the inorganic recording layer. A manufacturing process of the optical disc is also provided to increase production yield and lower manufacturing cost.
    Type: Application
    Filed: November 22, 2005
    Publication date: May 25, 2006
    Inventors: Ru-Lin Yeh, Chung-Fa Chen, Chun-Ying Lin, Wei-Hsiang Wang