Abstract: A thermal resistance measurement result uniformization device for a heat dissipation module, including: a control unit for storing an executable thermal resistance measurement logic; a wind tunnel having a casing, a wind tunnel blower and a flow rate measurement unit, allowing air flow rate inside the wind tunnel to be fixed; a heater attached to a heat dissipation module under test and having a fixed heating power; a heating sensor for sensing the temperature of the heater block; and an environment sensor for sensing ambient temperature, relative humidity and atmospheric pressure. The thermal resistance measurement logic has equations, namely R CVT = R × h h STP , and ? h = W A ? ? ? T , ? ? T = T C - T A , and ? R = ? ? T W , and calculates converted thermal resistance with the equations. The control unit executes the thermal resistance measurement logic to obtain the converted thermal resistance of the heat dissipation module under test.

Abstract: A ventilator-weaning timing prediction system, a program product therefor, and methods for building and using the same are disclosed to help a physician to determine a timing for a ventilator-using patient to try to weaning or completely wean from mechanical ventilation using AI-based prediction.

Abstract: A liquid cooling system having a liquid cooling block coordinating with a bubble cooling liquid includes: a liquid cooling block having a channel, a liquid inlet, a liquid outlet and an adhesive surface; a bubble liquid source having a driving function for driving a liquid, connected to the liquid inlet by an incoming liquid pipe and adapted to provide a bubble cooling liquid; and a liquid storage tank connected to the liquid outlet by an outgoing liquid pipe, adapted to store the bubble cooling liquid, and connected to the bubble liquid source by a communication pipe. The size of the bubbles introduced by the bubble liquid source into the liquid ranges from 50 to 1000 nm. The bubble cooling liquid is a known material that does not boil in a normal working state and thus does not generate additional bubbles otherwise typical of boiling.

Abstract: A method to measure the transient thermal diffusivity performance of a heat dissipation module by selecting two measurement points on the surface of the heat dissipation module, and locating the two measurement points at the same side of the thermal center point but different distances, and measuring the temperature of the two measurement points separately and using first equation which is the analytical solution of the energy equation. After calculating the first equation, second and third equations are used to find M. The distance X1 between M and the first measurement point and temperature T1 at a moment of transient state are also inserted into the first equation to obtain the value of the thermal diffusivity coefficient ?, which represents the transient thermal diffusivity performance for the heat dissipation module.

Abstract: A liquid-vapor composite heat dissipation system includes a heat exchange device filled with a working fluid, a number of liquid-vapor composite heat dissipation units that are positioned higher than the heat exchange device, each of the liquid-vapor composite heat sink units having a housing with an internal capillary occupying the interior of the housing and partially separating a spatially disconnected inlet chamber and an outlet chamber. The bottom of the housing is attached to a heat source. A liquid supply tube is connected to the heat exchange device at one end, and at the other end to a liquid inlet of each of the liquid-vapor composite heat sink units through each of the liquid supply pipes. A liquid return tube is connected to the heat exchange device at one end, and to each of the liquid-vapor composite heat sink units at the other end through each of the return pipes.

Abstract: A liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device that includes a housing with a chamber connected to an inlet and outlet; a capillary structure in the chamber for maintaining a predetermined distance from the inlet and outlet, and separating the chamber into an liquid inlet chamber and a vapor outlet chamber. The liquid inlet chamber is spatially connected to the inlet, and the vapor outlet chamber is spatially connected to the outlet. A drainage structure located at the top surface of the bottom of the housing is affixed to the bottom of the capillary structure for diverting liquid from the liquid inlet chamber to the underside of the capillary structure. The bottom surface of the bottom of the housing is affixed to a heat source, and when the heat source is attached, the drainage structure is located above the heat source.

Abstract: A fan logic evaluation device and method thereof for improving the logic evaluation of a fan. Specifically, a fan logic evaluation device is provided by first installing a fan, which corresponds to a set of parameters, in a wind tunnel device. A computer then performs a logic evaluation to convert the set of parameters into an evaluated pressure-flow curve and a measured pressure-flow curve by measuring the fan's operating conditions with the wind tunnel device. The computer further performs a logic modification to correct the logic evaluation to obtain a logic evaluation modification. The logic evaluation is then replaced by the logic evaluation modification. Finally, the above process is repeated with the same fan or a different fan.

Abstract: A method to measure the transient thermal diffusivity performance of a heat dissipation module by selecting two measurement points on the surface of the heat dissipation module, and locating the two measurement points at the same side of the thermal center point but different distances, and measuring the temperature of the two measurement points separately and using first equation which is the analytical solution of the energy equation. After calculating the first equation, second and third equations are used to find M. The distance X1 between M and the first measurement point and temperature T1 at a moment of transient state are also inserted into the first equation to obtain the value of the thermal diffusivity coefficient ?, which represents the transient thermal diffusivity performance for the heat dissipation module.

Abstract: A ventilator-weaning timing prediction system, a program product therefor, and methods for building and using the same are disclosed to help a physician to determine a timing for a ventilator-using patient to try to weaning or completely wean from mechanical ventilation using AI-based prediction.

Abstract: A thermal diffusivity performance measurement system is configured to measure a temperature of a pillar. The thermal diffusivity performance measurement system has a temperature sensor and a calculation unit. The temperature sensor is disposed at the pillar and configured to measure the temperature of the pillar. The calculation unit is configured to calculate a ratio of heat conduction to convection intensity per unit conduction intensity and a dimensionless time based on the measuring results of the temperature sensor.

Abstract: A thermal diffusivity performance measurement system is configured to measure a temperature of a pillar. The thermal diffusivity performance measurement system has a heater, a temperature sensor and a calculation unit. The heater is configured to heat the pillar. The temperature sensor is disposed at the pillar and configured to measure the temperature of the pillar. The calculation unit is connected to temperature sensor. The calculation unit is configured to calculate a ratio of heat conduction to convection intensity per unit conduction intensity and a dimensionless time based on the measuring results of the temperature sensor.

Abstract: A method for fabricating a semiconductor device includes forming a fin extending along a first direction on a semiconductor substrate and forming a sacrificial gate electrode structure extending along a second direction substantially perpendicular to the first direction over the fin. The sacrificial gate electrode structure comprises a sacrificial gate dielectric layer and a sacrificial gate electrode layer disposed over the sacrificial gate dielectric layer. Opposing gate sidewall spacers are formed extending along the second direction, on opposing sides of the sacrificial gate electrode layer. The sacrificial gate electrode layer is removed to form a gate space. Fluorine is implanted into the gate sidewall spacers after removing the gate electrode layer by performing a first fluorine implantation. The sacrificial gate dielectric layer is removed and a high-k gate dielectric layer is formed in the gate space.

Abstract: A method for fabricating a semiconductor device includes forming a fin extending along a first direction on a semiconductor substrate and forming a sacrificial gate electrode structure extending along a second direction substantially perpendicular to the first direction over the fin. The sacrificial gate electrode structure comprises a sacrificial gate dielectric layer and a sacrificial gate electrode layer disposed over the sacrificial gate dielectric layer. Opposing gate sidewall spacers are formed extending along the second direction, on opposing sides of the sacrificial gate electrode layer. The sacrificial gate electrode layer is removed to form a gate space. Fluorine is implanted into the gate sidewall spacers after removing the gate electrode layer by performing a first fluorine implantation. The sacrificial gate dielectric layer is removed and a high-k gate dielectric layer is formed in the gate space.

Abstract: Provided herein are methods for treating or preventing Wnt-associated cancers, comprising administering an effective amount of a DNAPK inhibitor to a patient having a Wnt-associated cancer.

Abstract: Disclosed are a shoe insole and its manufacturing method. The method includes the steps of crushing a rubber foam material into irregular primary crushed particles, covering a mixed elastomeric material onto a surface of the primary crushed particle uniformly, using a pressurizing, heating and curing method to form a primary modified foam material, crushing the primary modified foam material again to form irregular secondary crushed particles, covering the secondary crushed particles uniformly mixed with the elastomeric material onto a surface of the secondary crushed particle, and using the pressurizing, heating and curing method to form a secondary modified foam material similarly. The shoe sole made of the secondary modified foam material has good breathability, elasticity, comfortability and compressive strength.

Abstract: Provided is a method of fabricating a filter medium including the following steps. An assembly of first fiber is formed by a first spinning device. A plurality of second fiber is formed by a second spinning device. On a reception device is collected a film having a three-dimensional non-woven structure constructed by the first fibers and the second fibers. Each of the first fibers has a diameter of 1-50 ?m. Each of the second fibers has a diameter of 1-1000 nm. The second spinning device is positioned between the first spinning device and the reception device. The first fibers and the second fibers stack with each other in a random manner to form the three-dimensional non-woven structure.

Abstract: An encapsulation apparatus for encapsulating data includes an input to receive the data, a machine to generate information related to the encapsulation of data and a logic coupled to the machine. A processing machine is coupled to the input and the logic.

Abstract: Provided is a method of fabricating a filter medium including the following steps. An assembly of first fiber is formed by a first spinning device. A plurality of second fiber is formed by a second spinning device. On a reception device is collected a film having a three-dimensional non-woven structure constructed by the first fibers and the second fibers. Each of the first fibers has a diameter of 1-50 ?m. Each of the second fibers has a diameter of 1-1000 nm. The second spinning device is positioned between the first spinning device and the reception device. The first fibers and the second fibers stack with each other in a random manner to form the three-dimensional non-woven structure.

Abstract: Methods and systems for processing video data are described. A set of candidate motion vectors is selected from motion vectors associated with macroblocks in a first frame of video data and from motion vectors associated with macroblocks in a second frame of the video data. A statistical measure of the set is determined. The statistical measure defines a motion vector for a macroblock of interest in the second frame.

Abstract: The present invention discloses a method for assembling a camera module. The method includes putting plural conductive bumps on a conductive contact of a substrate such that a large conductive bump is formed, and pressing the substrate and an image chip together such that the conductive contact contacts with a pad formed on the image chip through the large conductive bump to combine the conductive contact and the pad. Since there is no contact between the substrate and the image chip but the large conductive bump, the method decreases the probability for fracture between the substrate and the image chip and improves the quality of the camera module.