Patents by Inventor Chung Fu Chen

Chung Fu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240164111
    Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a first conductive structure arranged over a substrate. A memory layer is arranged over the first conductive structure, below a second conductive structure, and includes a ferroelectric material. An annealed seed layer is arranged between the first and second conductive structures and directly on a first side of the memory layer. An amount of the crystal structure that includes an orthorhombic phase is greater than about 35 percent.
    Type: Application
    Filed: January 23, 2024
    Publication date: May 16, 2024
    Inventors: Song-Fu Liao, Rainer Yen-Chieh Huang, Hai-Ching Chen, Chung-Te Lin
  • Publication number: 20240128217
    Abstract: A semiconductor device includes a first semiconductor die and a second semiconductor die connected to the first semiconductor die. Each of the first semiconductor die and the second semiconductor die includes a substrate, a conductive bump formed on the substrate and a conductive contact formed on the conductive bump. The conductive contact has an outer lateral sidewall, there is an inner acute angle included between the outer lateral sidewall and the substrate is smaller than 85°, and the conductive contact of the first semiconductor die is connected opposite to the conductive contact of the second semiconductor die.
    Type: Application
    Filed: January 20, 2023
    Publication date: April 18, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Jung CHEN, Chen Chiang YU, Wei-An TSAO, Tsung-Fu TSAI, Szu-Wei LU, Chung-Shi LIU
  • Publication number: 20240116707
    Abstract: A powered industrial truck includes a lateral movement assembly including four sliding members and four pivotal members both on a wheeled carriage, four links having a first end pivotably secured to the sliding member and a second end pivotably secured to either end of the pivotal member, a motor shaft having two ends pivotably secured to the pivotal members respectively, a first electric motor on one frame member, and four mounts attached to the sliding members respectively; two lift assemblies including a second electric motor, a shaft having two ends rotatably secured to the sliding members respectively, two gear trains at the ends of the shaft respectively, a first gear connected to the second electric motor, a second gear on the shaft, and a first roller chain on the first and second gears; two electric attachments on the platform and being laterally moveable, each attachment. The mount has rollers.
    Type: Application
    Filed: September 21, 2023
    Publication date: April 11, 2024
    Inventors: Jung-Chieh Chang, Yi-Sheng Chen, Jen-Yung Hsiao, Chia-Fu Hsiao, Wei-Qi Lao, Chen-Chih Chan, Chung-Yu Liu
  • Patent number: 11917831
    Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a first conductive structure arranged over a substrate. A memory layer is arranged over the first conductive structure, below a second conductive structure, and includes a ferroelectric material. An annealed seed layer is arranged between the first and second conductive structures and directly on a first side of the memory layer. An amount of the crystal structure that includes an orthorhombic phase is greater than about 35 percent.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Song-Fu Liao, Rainer Yen-Chieh Huang, Hai-Ching Chen, Chung-Te Lin
  • Patent number: 7647669
    Abstract: A novel blade assembly for windshield wipers is provided herein. The blade assembly mainly contains a number of tubular segments cascaded in series by a number of connectors. At least a flexible strip is threaded through the series-connected tubular segments to provide even distribution of pressure against the windshield. Each connector has a body for sticking into the two neighboring tubular segments so as to cascade the two tubular segments together. The body of the connectors has at least a through channel for the flexible strip's passing through. The aperture of the through channel decreases from the two ends towards the center of the body, making the blade assembly easier to bend and more conforming to the windshield's curvature.
    Type: Grant
    Filed: February 23, 2006
    Date of Patent: January 19, 2010
    Assignee: Hai Rwei Heng Enterprise Co., Ltd.
    Inventor: Chung-Fu Chen
  • Publication number: 20070252167
    Abstract: A surface mounting optoelectronic device is provided. The surface mounting optoelectronic device comprises a circuit board, a conductive layer, an auto-focus LED chip, a flash LED chip, a reflector and an encapsulant. The auto-focus LED chip and the flash LED chip are located on the conductive layer. The reflector is located on the edge of the circuit board. The encapsulant is filled into the reflector to hermetically seal the auto-focus LED chip and the flash LED chip.
    Type: Application
    Filed: November 16, 2006
    Publication date: November 1, 2007
    Inventors: Chung-Fu Chen, Cheng-Yi Chang, Chih-Chia Tsai
  • Publication number: 20070192983
    Abstract: A novel blade assembly for windshield wipers is provided herein. The blade assembly mainly contains a number of tubular segments cascaded in series by a number of connectors. At least a flexible strip is threaded through the series-connected tubular segments to provide even distribution of pressure against the windshield. Each connector has a body for sticking into the two neighboring tubular segments so as to cascade the two tubular segments together. The body of the connectors has at least a through channel for the flexible strip's passing through. The aperture of the through channel decreases from the two ends towards the center of the body, making the blade assembly easier to bend and more conforming to the windshield's curvature.
    Type: Application
    Filed: February 23, 2006
    Publication date: August 23, 2007
    Inventor: Chung-Fu Chen
  • Patent number: D464600
    Type: Grant
    Filed: February 7, 2002
    Date of Patent: October 22, 2002
    Inventor: Chung Fu Chen