Patents by Inventor Chung-Fu Chu

Chung-Fu Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plant senescence-inducible promoter
    Patent number: 8129513
    Abstract: This invention provides a plant senescence-inducible promoter and its relevant recombinant plasmid and transgenic plant.
    Type: Grant
    Filed: September 22, 2008
    Date of Patent: March 6, 2012
    Assignee: National Taiwan University
    Inventors: Shih-Tong Jeng, Pu-Huan Liu, Chung-Fu Chu
  • Plant senescence-inducible promoter
    Publication number: 20090241231
    Abstract: This invention provides a plant senescence-inducible promoter and its relevant recombinant plasmid and transgenic plant.
    Type: Application
    Filed: September 22, 2008
    Publication date: September 24, 2009
    Applicant: NATIONAL TAIWAN UNIVERSITY
    Inventors: Shih-Tong Jeng, Pu-Huan Liu, Chung-Fu Chu
  • Post-etch treatment of plasma-etched feature surfaces to prevent corrosion
    Patent number: 6153530
    Abstract: Disclosed herein is a post-etch treatment for plasma etched metal-comprising features in semiconductor devices. The post-etch treatment significantly reduces or eliminates surface corrosion of the etched metal-comprising feature. It is particularly important to prevent the formation of moisture on the surface of the feature surface prior to an affirmative treatment to remove corrosion-causing contaminants from the feature surface. Avoidance of moisture formation is assisted by use of a high vacuum; use of an inert, moisture-free purge gas; and by maintaining the substrate at a sufficiently high temperature to volatilize moisture.
    Type: Grant
    Filed: March 16, 1999
    Date of Patent: November 28, 2000
    Assignee: Applied Materials, Inc.
    Inventors: Yan Ye, Xiaoye Zhao, Chang-Lin Hsieh, Xian-Can Deng, Wen-Chiang Tu, Chung-Fu Chu, Diana Xiaobing Ma