Patents by Inventor Chung-Fu Tsai

Chung-Fu Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11985906
    Abstract: A magnetic tunnel junction (MTJ) memory cell and a metallic etch mask portion are formed over a substrate. At least one dielectric etch stop layer is deposited over the metallic etch mask portion, and a via-level dielectric layer is deposited over the at least one dielectric etch stop layer. A via cavity may be etched through the via-level dielectric layer, and a top surface of the at least one dielectric etch stop layer is physically exposed. The via cavity may be vertically extended by removing portions of the at least one dielectric etch stop layer and the metallic etch mask portion. A contact via structure is formed directly on a top surface of the top electrode in the via cavity to provide a low-resistance contact to the top electrode.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: May 14, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Yu-Feng Yin, Tai-Yen Peng, An-Shen Chang, Han-Ting Tsai, Qiang Fu, Chung-Te Lin
  • Publication number: 20240128217
    Abstract: A semiconductor device includes a first semiconductor die and a second semiconductor die connected to the first semiconductor die. Each of the first semiconductor die and the second semiconductor die includes a substrate, a conductive bump formed on the substrate and a conductive contact formed on the conductive bump. The conductive contact has an outer lateral sidewall, there is an inner acute angle included between the outer lateral sidewall and the substrate is smaller than 85°, and the conductive contact of the first semiconductor die is connected opposite to the conductive contact of the second semiconductor die.
    Type: Application
    Filed: January 20, 2023
    Publication date: April 18, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Jung CHEN, Chen Chiang YU, Wei-An TSAO, Tsung-Fu TSAI, Szu-Wei LU, Chung-Shi LIU
  • Patent number: 6731206
    Abstract: A voice system for announcing the type of failure when the basic input/output system (BIOS) program in the computer discovers an error during start-up. The voice system includes a pre-recorded voice integrated circuit and a voice output device. The BIOS program tests a plurality of peripheral devices. When errors are found in any peripheral device, a warning signal is sent to the pre-recorded voice integrated circuit. A corresponding error signal message is looked up in the pre-recorded voice integrated circuit and then the error signal message is transferred to the voice output device. A verbal failure message is announced through the voice output device. The error signal message includes all kinds of failures recorded in voice data format.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: May 4, 2004
    Assignee: First International Computer Inc.
    Inventors: Stephen Yang, Chung-Fu Tsai, Wen-Bin Liu
  • Publication number: 20030126425
    Abstract: A voice system for announcing the type of failure when the basic input/output system (BIOS) program in the computer discovers an error during start-up. The voice system includes a pre-recorded voice integrated circuit and a voice output device. The BIOS program tests a plurality of peripheral devices. When errors are found in any peripheral device, a warning signal is sent to the pre-recorded voice integrated circuit. A corresponding error signal message is looked up in the pre-recorded voice integrated circuit and then the error signal message is transferred to the voice output device. A verbal failure message is announced through the voice output device. The error signal message includes all kinds of failures recorded in voice data format.
    Type: Application
    Filed: December 28, 2001
    Publication date: July 3, 2003
    Inventors: Stephen Yang, Chung-Fu Tsai, Wen-Bin Liu