Abstract: An electrical connector includes an insulating body having a bottom surface, a receiving groove formed in the bottom surface, and at least one support block projecting downwardly from the bottom surface for connection with a circuit board and cooperating with the bottom surface to define a venting space that communicates with the receiving groove and a solder hole in the circuit board. A conductive terminal includes a first positioning portion extending into and positioned in the receiving groove, and a second positioning portion connected to the first positioning portion and extending through the venting space and adapted to be positioned in the solder hole.

Abstract: A method for assembling a heat generating element and a heat dissipating element includes: preparing a pressure sensitive element including a pressure sensitive layer and first and second release films connected to the pressure sensitive layer; separating the second release film from the pressure sensitive layer and then adhering a heat dissipating element to the pressure sensitive layer; forcing the first release film; separating the first release film from the pressure sensitive layer, and then adhering a heat generating element to the pressure sensitive layer; and fixedly attaching the heat generating element onto the pressure sensitive layer. A pressure sensitive element and a power supplying unit are also disclosed.

Abstract: A method for assembling a heat generating element and a heat dissipating element includes: preparing a pressure sensitive element including a pressure sensitive layer and first and second release films connected to the pressure sensitive layer; separating the second release film from the pressure sensitive layer and then adhering a heat dissipating element to the pressure sensitive layer; forcing the first release film; separating the first release film from the pressure sensitive layer, and then adhering a heat generating element to the pressure sensitive layer; and fixedly attaching the heat generating element onto the pressure sensitive layer. A pressure sensitive element and a power supplying unit are also disclosed.

Abstract: In a semiconductor element, and a display pixel and a display panel using the same, the semiconductor element includes a first electrode, a second electrode, an organic light-emitting layer and a third electrode. The second electrode and the first electrode are disposed separately. The organic light-emitting layer is electrically connected with the first electrode and the second electrode. The third electrode is disposed above the organic light-emitting layer.

Abstract: A class-D audio amplifier is protected by thermal regulation which decreases the gain of the class-D audio amplifier by asserting an over-temperature signal when the temperature of the class-D audio amplifier is detected to be higher than a threshold. The output of the class-D audio amplifier is therefore reduced by the smaller gain, and the chance for the class-D audio amplifier to stop working due to overheating is greatly reduced.

Abstract: A class-D audio amplifier is protected by thermal regulation which decreases the gain of the class-D audio amplifier by asserting an over-temperature signal when the temperature of the class-D audio amplifier is detected to be higher than a threshold. The output of the class-D audio amplifier is therefore reduced by the smaller gain, and the chance for the class-D audio amplifier to stop working due to overheating is greatly reduced.