Patents by Inventor Chung H. Ling

Chung H. Ling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE
    Publication number: 20240071936
    Abstract: Disclosed are an interposer substrate, a package structure and a manufacturing method of a package structure. In one embodiment, the interposer substrate includes a substrate, a bridge device in the substrate, a memory in the substrate and beside the bridge device and a through substrate via in the substrate and beside the bridge device and the memory.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Yu Ling, Hsin-Yu LAI, Katherine H CHIANG, Chung-Te Lin
  • Condenser microphones based on silicon with humidity resistant surface treatment
    Patent number: 5208789
    Abstract: An condenser microphone element including a silicon core, a layer of silicon dioxide thereon, and a layer of tantalum pentoxide thereon.
    Type: Grant
    Filed: April 13, 1992
    Date of Patent: May 4, 1993
    Assignee: Lectret S. A.
    Inventor: Chung H. Ling