Patents by Inventor Chung-Hao J. Chen
Chung-Hao J. Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11177680Abstract: Techniques for focusing the energy radiated by a wireless power transmitting unit are described. An example power transmitting unit includes a transmit coil configured to generate a magnetic field to wirelessly power a device within an active wireless charging area. The power transmitting unit also includes a power generating circuitry to deliver current to the transmit coil to generate the magnetic field. The power transmitting unit also includes a ferrite structure disposed below the transmit coil, the ferrite structure comprising a flat sheet and a projection of ferrite material projecting above the flat sheet.Type: GrantFiled: April 4, 2017Date of Patent: November 16, 2021Assignee: Intel CorporationInventors: Jaejin Lee, Hao-Han Hsu, Chung-Hao J. Chen
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Patent number: 10950555Abstract: Semiconductor packages and a method of forming a semiconductor package are described. The semiconductor package has a foundation layer, a conductive layer formed in the foundation layer, and a magnetic layer formed between the conductive and the foundation layer. The conductive layer and the magnetic layer are coupled to form a low-profile inductor shield. The semiconductor package also has a dielectric layer formed between the magnetic and foundation layer. The foundation layer is mounted between a motherboard and a semiconductor die, where the foundation layer is attached to the motherboard with solder balls. Accordingly, the low-profile inductor shield may include a z-height that is less than a z-height of the solder balls. The low-profile inductor shield may have solder pads that are coupled to the conductive layer. The foundation layer may include at least one of voltage regulator and inductor, where the inductor is located above the low-profile inductor shield.Type: GrantFiled: March 30, 2017Date of Patent: March 16, 2021Assignee: Intel CorporationInventors: Kaladhar Radhakrishnan, Jaejin Lee, Hao-Han Hsu, Chung-Hao J. Chen, Dong-Ho Han
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Patent number: 10530174Abstract: Techniques for focusing an energy radiated by a wireless power transmitting unit are described. An example power transmitting unit includes a transmit coil configured to generate a magnetic field to wirelessly power a device within an active wireless charging area. The power transmitting unit also includes a power generating circuitry to deliver a current to the transmit coil to generate the magnetic field. The power transmitting unit also includes a patch array disposed in parallel with the transmit coil to reduce a strength of the magnetic field at frequencies outside of the operating frequency during operation of the power transmitting unit.Type: GrantFiled: April 1, 2016Date of Patent: January 7, 2020Assignee: Intel CorporationInventors: Jaejin Lee, Chung-Hao J. Chen, Zhen Yao, Songnan Yang, Jonathan Rosenfeld, Sreenivas Kasturi
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Publication number: 20190393165Abstract: Semiconductor packages and a method of forming a semiconductor package are described. The semiconductor package has a foundation layer, a conductive layer formed in the foundation layer, and a magnetic layer formed between the conductive and the foundation layer. The conductive layer and the magnetic layer are coupled to form a low-profile inductor shield. The semiconductor package also has a dielectric layer formed between the magnetic and foundation layer. The foundation layer is mounted between a motherboard and a semiconductor die, where the foundation layer is attached to the motherboard with solder balls. Accordingly, the low-profile inductor shield may include a z-height that is less than a z-height of the solder balls. The low-profile inductor shield may have solder pads that are coupled to the conductive layer. The foundation layer may include at least one of voltage regulator and inductor, where the inductor is located above the low-profile inductor shield.Type: ApplicationFiled: March 30, 2017Publication date: December 26, 2019Inventors: Kaladhar RADHAKRISHNAN, Jaejin LEE, Hao-Han HSU, Chung-Hao J. CHEN, Dong-Ho HAN
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Patent number: 10403581Abstract: Electronic device packages utilizing a stiffener coupled to a substrate with a magnetic lossy bonding layer to attenuate or absorb electromagnetic signals such as radio frequency interference (RFI) along with related systems and method are disclosed.Type: GrantFiled: September 29, 2017Date of Patent: September 3, 2019Assignee: Intel CorporationInventors: Jaejin Lee, Hao-Han Hsu, Chung-Hao J. Chen, Dong-Ho Han
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Publication number: 20190103366Abstract: Electronic device packages utilizing a stiffener coupled to a substrate with a magnetic lossy bonding layer to attenuate or absorb electromagnetic signals such as radio frequency interference (RFI) along with related systems and method are disclosed.Type: ApplicationFiled: September 29, 2017Publication date: April 4, 2019Applicant: Intel CorporationInventors: Jaejin Lee, Hao-Han Hsu, Chung-Hao J. Chen, Dong-Ho Han
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Publication number: 20180287411Abstract: Techniques for focusing the energy radiated by a wireless power transmitting unit are described. An example power transmitting unit includes a transmit coil configured to generate a magnetic field to wirelessly power a device within an active wireless charging area. The power transmitting unit also includes a power generating circuitry to deliver current to the transmit coil to generate the magnetic field. The power transmitting unit also includes a ferrite structure disposed below the transmit coil, the ferrite structure comprising a flat sheet and a projection of ferrite material projecting above the flat sheet.Type: ApplicationFiled: April 4, 2017Publication date: October 4, 2018Applicant: INTEL CORPORATIONInventors: Jaejin Lee, Hao-Han Hsu, Chung-Hao J. Chen
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Publication number: 20180189217Abstract: Various embodiments may be generally directed to techniques for an extendable peripheral port. Some embodiments are particularly directed to a computing device, such as an input/output (I/O) device, with a peripheral port that can be selectively repositioned to increase the distance between the peripheral port and one or more components of the I/O device that are sensitive to radio frequency interference (RFI), such as an antenna.Type: ApplicationFiled: December 29, 2016Publication date: July 5, 2018Inventors: PUJITHA DAVULURI, CHUNG-HAO J. CHEN, BOON PING KOH
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Publication number: 20170288445Abstract: Techniques for focusing the energy radiated by a wireless power transmitting unit are described. An example power transmitting unit includes a transmit coil configured to generate a magnetic field to wirelessly power a device within an active wireless charging area. The power transmitting unit also includes a power generating circuitry to deliver current to the transmit coil to generate the magnetic field. The power transmitting unit also includes a patch array disposed in parallel with the transmit coil to reduce the strength of the magnetic field at frequencies outside of the operating frequency during operation of the power transmitting unit.Type: ApplicationFiled: April 1, 2016Publication date: October 5, 2017Applicant: Intel CorporationInventors: Jaejin Lee, Chung-Hao J. Chen, Zhen Yao, Songnan Yang, Jonathan Rosenfeld, Sreenivas Kasturi
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Patent number: 9755334Abstract: A retention apparatus for a shielded cable is described. In one embodiment, the apparatus comprises a substrate having a ground; a connector coupled to the substrate; a cable shielded with a conductive material and having an end connectable to the connector to electrically connect with the connector; an electrically conductive material coupled to the ground of the substrate; and a grounding retention mechanism to cause the electrically conductive material to electrically connect the cable to the ground of the substrate by applying a force to the cable shield.Type: GrantFiled: June 25, 2015Date of Patent: September 5, 2017Assignee: INTEL CORPORATIONInventors: Xiang Li, Yun Ling, Chung-Hao J. Chen, Hao-Han Hsu, Shyamjith Mohan, Kuan-Yu Chen
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Patent number: 9705182Abstract: A patch-based proximity sensor having a capacitance and/or inductance that varies based on a proximity of an animate body, a sense circuit to sense the capacitance and/or inductance, and a control system to compare one or more sensed values to one or more thresholds, and to selectively enable/disable one or more antennas based on the comparison(s). The threshold may correspond to a desired/permitted minimum distance between an antenna and an animate body, and/or a desired/permitted maximum electromagnetic energy exposure to the animate body. A multi-layer module may include one or more patch-based proximity sensors and one or more patch-antennas. Multiple antennas may be individually controllable based on corresponding proximity measures.Type: GrantFiled: June 29, 2012Date of Patent: July 11, 2017Assignee: INTEL CORPORATIONInventors: Hao-Han Hsu, Songnan Yang, Dong-Ho Han, Chung-Hao J. Chen
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Patent number: 9577448Abstract: Described herein are techniques related to one or more systems, apparatuses, methods, etc. for implementing a wireless charging and a wireless connectivity in a device.Type: GrantFiled: July 30, 2013Date of Patent: February 21, 2017Assignee: Intel CorporationInventors: Songnan Yang, Bin Xiao, Ulun Karacaoglu, Chung-Hao J. Chen, James Utz
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Patent number: 9544991Abstract: Multi-pair differential lines printed circuit board common mode filters are generally described. In one embodiment, the apparatus includes a multi-layer printed circuit board, a first signal line and a second signal line forming a first differential pair on a first layer of the printed circuit board, a second differential pair on the first layer of the printed circuit board, and a common mode filter on a second layer of the printed circuit board, the common mode filter comprising an absence of a predominantly occurring dielectric material of the printed circuit board, the common mode filter spanning an area directly below at least a portion of both the first and the second differential pairs. Other embodiments are also described and claimed.Type: GrantFiled: December 19, 2011Date of Patent: January 10, 2017Assignee: Intel CorporationInventors: Chung-Hao J. Chen, Dong-Ho Han, Mike Schaffer
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Publication number: 20160380370Abstract: A retention apparatus for a shielded cable is described. In one embodiment, the apparatus comprises a substrate having a ground; a connector coupled to the substrate; a cable shielded with a conductive material and having an end connectable to the connector to electrically connect with the connector; an electrically conductive material coupled to the ground of the substrate; and a grounding retention mechanism to cause the electrically conductive material to electrically connect the cable to the ground of the substrate by applying a force to the cable shield.Type: ApplicationFiled: June 25, 2015Publication date: December 29, 2016Inventors: Xiang Li, Yun Ling, Chung-Hao J. Chen, Hao-Han Hsu, Shyamjith Mohan
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Patent number: 9525441Abstract: Techniques for noise reduction are described herein. The techniques include an apparatus for noise reduction including a voltage tuner to adjust a voltage swing for a signal line in a differential signal line pair. The apparatus may also include a timing module to adjust a timing skew between the differential signal line pair, wherein the voltage swing and timing skew adjustment introduce a common mode noise in the differential signal line pair to reduce a radio frequency interference (RFI) noise coupling.Type: GrantFiled: December 11, 2014Date of Patent: December 20, 2016Assignee: Intel CorporationInventors: Chung-Hao J. Chen, Howard L. Heck, Pujitha Davuluri, Hao-Han Hsu
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Patent number: 9484680Abstract: An apparatus is described herein. The apparatus includes a receptacle to receive a plug to couple a peripheral device to a computing device. The apparatus includes a ground contact of a printed circuit board of the computing device. The apparatus includes a shield communicatively coupled to the ground contact, wherein the shield is to reduce radio frequency interference (RFI) from an interface between the plug and the receptacle.Type: GrantFiled: June 12, 2013Date of Patent: November 1, 2016Assignee: Intel CorporationInventors: Pujitha Davuluri, Chung-Hao J. Chen, Kuan-Yu Chen
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Publication number: 20160173142Abstract: Techniques for noise reduction are described herein. The techniques include an apparatus for noise reduction including a voltage tuner to adjust a voltage swing for a signal line in a differential signal line pair. The apparatus may also include a timing module to adjust a timing skew between the differential signal line pair, wherein the voltage swing and timing skew adjustment introduce a common mode noise in the differential signal line pair to reduce a radio frequency interference (RFI) noise coupling.Type: ApplicationFiled: December 11, 2014Publication date: June 16, 2016Applicant: Intel CorporationInventors: Chung-Hao J. Chen, Howard L. Heck, Pujitha Davuluri, Hao-Han Hsu
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Patent number: 9306304Abstract: Methods and apparatuses may provide for a grounding between a shield on a flat flexible cable and a printed circuit board. According to one embodiment, the pins of a connector include ground pins that contact both ground traces on the flat flexible cable and a shield on the flat flexible cable, further connecting the cable to a ground plane.Type: GrantFiled: June 12, 2014Date of Patent: April 5, 2016Assignee: Intel CorporationInventors: Chung-Hao J. Chen, Xiang Li
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Patent number: 9219463Abstract: A system, hybrid common mode choke, and method are described herein. The system includes a differential signal transmitter and a differential signal receiver. A differential signal transmitter ground and a differential signal receiver ground are electrically disconnected in a manner that enables a common mode filter. The transmitter ground and the receiver ground may be coupled using an inductor, a resistor, a capacitor, or any combination thereof.Type: GrantFiled: February 6, 2013Date of Patent: December 22, 2015Assignee: Intel CorporationInventor: Chung-Hao J. Chen
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Publication number: 20150364846Abstract: Methods and apparatuses may provide for a grounding between a shield on a flat flexible cable and a printed circuit board. According to one embodiment, the pins of a connector include ground pins that contact both ground traces on the flat flexible cable and a shield on the flat flexible cable, further connecting the cable to a ground plane.Type: ApplicationFiled: June 12, 2014Publication date: December 17, 2015Inventors: CHUNG-HAO J. CHEN, XIANG LI