Abstract: A method of forming a semiconductor device structure is provided. The method includes forming a masking structure with first openings over a semiconductor substrate and correspondingly forming metal layers in the first openings. The method also includes recessing the masking structure to form second openings between the metal layers and forming a sacrificial layer surrounded by a first liner in each of the second openings. In addition, after forming a second liner over the sacrificial layer in each of the second openings, the method includes removing the sacrificial layer in each of the second openings to form a plurality of air gaps therefrom.

Abstract: A method for starting a motor vehicle having an internal combustion engine, an operator actuatable switch, an electric starter and a corresponding starter relay includes coupling a first control circuit to the starter relay during one or more crank operations, and coupling a second control circuit to the starter relay during the one or more crank operations, the coupling steps resulting in a minimal delay time associated with the starting of the motor vehicle.

Abstract: A method for starting a motor vehicle having an internal combustion engine, an operator actuatable switch, an electric starter and a corresponding starter relay includes coupling a first control circuit to the starter relay during one or more crank operations, and coupling a second control circuit to the starter relay during the one or more crank operations, the coupling steps resulting in a minimal delay time associated with the starting of the motor vehicle.