Patents by Inventor Chung-Hao Tseng
Chung-Hao Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12048228Abstract: An image capture device including an image capture module and a display panel is provided. The display panel is disposed on the image capture module and includes multiple pixels. Each of the pixels includes a first light-emitting region and a second light-emitting region. The first light-emitting region emits a first light beam. The first light beam is transmitted to the image capture module through a region outside the first light-emitting region. In each of the pixels, a total area of the first light-emitting region is smaller than a total area of the second light-emitting region.Type: GrantFiled: June 2, 2021Date of Patent: July 23, 2024Assignee: Gingy Technology Inc.Inventors: Chung Hao Tseng, Mon-Nan Ho
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Patent number: 11987678Abstract: Provided is a polyester composite film, comprising a first thermoplastic polyether ester elastomer (TPEE) film and a second TPEE film. The melting point of a second TPEE resin of the second TPEE film is higher than that of a first TPEE resin of the first TPEE film, and the absolute difference in enthalpy of fusion between the first and second TPEE films is 5 J/g to 15 J/g. By adopting the first and second TPEE films having specific absolute difference of the enthalpy of fusion and controlling the melting points of the first and second TPEE resins, the polyester composite film can be well attached onto the fabric by hot pressing to obtain sufficient peel strength, and thereby the attached fabric can have excellent waterproof performance. Besides, a hot melt adhesive laminate comprising the polyester composite film also exhibits the above beneficial effects when attached to the fabric.Type: GrantFiled: August 18, 2022Date of Patent: May 21, 2024Assignee: CHANG CHUN PLASTICS CO., LTD.Inventors: Chung-Hao Tseng, Te-Shun Lin
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Patent number: 11919988Abstract: Provided is a thermoplastic polyether ester elastomer composition having a first chain represented by the following Formula (I) and a second chain represented by the following Formula (II), which are connected to each other: Wherein, the melting point of the thermoplastic polyether ester elastomer composition ranges from 80° C. to 160° C., and the enthalpy of fusion of the thermoplastic polyether ester elastomer composition is greater than 6 J/g. Production of the thermoplastic polyether ester elastomer composition has low energy consumption and facilitates smooth cutting strands into pellets, which is beneficial to mass production of the thermoplastic polyether ester elastomer composition.Type: GrantFiled: July 7, 2021Date of Patent: March 5, 2024Assignee: CHANG CHUN PLASTICS CO., LTD.Inventors: Chen-Yu Kuan, Chung-Hao Tseng, Te-Shun Lin
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Patent number: 11783621Abstract: An optical fingerprint imaging device, including a substrate, an imaging module, at least one light emitting element, a light shielding element, a case, and a pressing substrate, is provided. The light shielding element is disposed between the imaging module and the light emitting element. The optical fingerprint imaging device satisfies conditional expressions, h?H?h+(R/tan(?/2)) and Ravg<S<5Ravg, where h is a height from a field angle origin of the imaging module to the substrate, H is a height of the light shielding element at a measurement position, R is a distance from a center of the imaging module to the measurement position, ? is an angle of a field angle of the imaging module, Ravg is an average value of distances from the center to measurement positions of the light shielding element, and S is a distance from the center to a center of the light emitting element.Type: GrantFiled: November 18, 2022Date of Patent: October 10, 2023Assignee: Gingy Technology Inc.Inventors: Ping-Chen Chen, Mon-Nan Ho, Chuan Min Lee, Chung Hao Tseng
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Publication number: 20230272173Abstract: Provided is a polyester composite film, comprising a first thermoplastic polyether ester elastomer (TPEE) film and a second TPEE film. The melting point of a second TPEE resin of the second TPEE film is higher than that of a first TPEE resin of the first TPEE film, and the absolute difference in enthalpy of fusion between the first and second TPEE films is 5 J/g to 15 J/g. By adopting the first and second TPEE films having specific absolute difference of the enthalpy of fusion and controlling the melting points of the first and second TPEE resins, the polyester composite film can be well attached onto the fabric by hot pressing to obtain sufficient peel strength, and thereby the attached fabric can have excellent waterproof performance. Besides, a hot melt adhesive laminate comprising the polyester composite film also exhibits the above beneficial effects when attached to the fabric.Type: ApplicationFiled: August 18, 2022Publication date: August 31, 2023Inventors: Chung-Hao TSENG, Te-Shun LIN
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Publication number: 20220372194Abstract: Provided is a thermoplastic polyether ester elastomer composition having a first chain represented by the following Formula (I) and a second chain represented by the following Formula (II), which are connected to each other: Wherein, the melting point of the thermoplastic polyether ester elastomer composition ranges from 80° C. to 160° C., and the enthalpy of fusion of the thermoplastic polyether ester elastomer composition is greater than 6 J/g. Production of the thermoplastic polyether ester elastomer composition has low energy consumption and facilitates smooth cutting strands into pellets, which is beneficial to mass production of the thermoplastic polyether ester elastomer composition.Type: ApplicationFiled: July 7, 2021Publication date: November 24, 2022Inventors: Chen-Yu Kuan, Chung-Hao Tseng, Te-Shun Lin
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Publication number: 20220359624Abstract: An image capture device including an image capture module and a display panel is provided. The display panel is disposed on the image capture module and includes multiple pixels. Each of the pixels includes a first light-emitting region and a second light-emitting region. The first light-emitting region emits a first light beam. The first light beam is transmitted to the image capture module through a region outside the first light-emitting region. In each of the pixels, a total area of the first light-emitting region is smaller than a total area of the second light-emitting region.Type: ApplicationFiled: June 2, 2021Publication date: November 10, 2022Applicant: Gingy Technology Inc.Inventors: Chung Hao Tseng, Mon-Nan Ho
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Patent number: 10170709Abstract: A platinum complex having at least one carbene fragment, and an OLED using the same are described. The platinum complex contains a platinum cation, a zero-valent nitrogen-containing heterocyclic bidentate chelate, and a dianionic nitrogen-containing heterocyclic bidentate chelate. The zero-valent nitrogen-containing heterocyclic bidentate chelate has at least one carbene unit coordinating to platinum. The dianionic nitrogen-containing heterocyclic bidentate chelate has at least one electron-withdrawing substituent, and forms two N—Pt bonds, or one N—Pt bond and one C—Pt bond, with the central platinum cation.Type: GrantFiled: November 23, 2015Date of Patent: January 1, 2019Assignee: National Tsing Hua UniversityInventors: Yun Chi, Che-Wei Hsu, Chung-Hao Tseng, Jia-Ling Liao
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Publication number: 20170005279Abstract: A platinum complex having at least one carbene fragment, and an OLED using the same are described. The platinum complex contains a platinum cation, a zero-valent nitrogen-containing heterocyclic bidentate chelate, and a dianionic nitrogen-containing heterocyclic bidentate chelate. The zero-valent nitrogen-containing heterocyclic bidentate chelate has at least one carbene unit coordinating to platinum. The dianionic nitrogen-containing heterocyclic bidentate chelate has at least one electron-withdrawing substituent, and forms two N—Pt bonds, or one N—Pt bond and one C—Pt bond, with the central platinum cation.Type: ApplicationFiled: November 23, 2015Publication date: January 5, 2017Inventors: Yun Chi, Che-Wei Hsu, Chung-Hao Tseng, Jia-Ling Liao
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Patent number: 7881592Abstract: A digital audio/video playback system capable of controlling audio and video playback speed for decoding a digital audio/video signal and then outputting such signal. The system includes: a loader configured to receive the digital audio/video signals, a parser configured to resolve the digital audio/video signals into a video bitstream and an audio bitstream, a video decoder and an audio decoder respectively configured to receive and decode the video bitstream and the audio bitstream, and a playback speed controller configured to adjust the sound frequency of the decoded audio based on a set playback speed and output the decoded video/audio at the set playback speed.Type: GrantFiled: September 8, 2006Date of Patent: February 1, 2011Assignee: Novatek Microelectronics Corp.Inventors: Hsi-jung Tsai, Chung-hao Tseng, Tzu-chuan Huang, Hao-huan Shih
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Publication number: 20070098369Abstract: A digital audio/video playback system capable of controlling audio and video playback speed for decoding a digital audio/video signal and then outputting such signal. The system includes: a loader configured to receive the digital audio/video signals, a parser configured to resolve the digital audio/video signals into a video bitstream and an audio bitstream, a video decoder and an audio decoder respectively configured to receive and decode the video bitstream and the audio bitstream, and a playback speed controller configured to adjust the sound frequency of the decoded audio based on a set playback speed and output the decoded video/audio at the set playback speed.Type: ApplicationFiled: September 8, 2006Publication date: May 3, 2007Inventors: Hsi-jung Tsai, Chung-hao Tseng, Tzu-chuan Huang, Hao-huan Shih
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Patent number: 6896304Abstract: An automatic sensing wafer blade for picking up wafers that is equipped with a sensor capable of self-diagnosing potential failure conditions of the blade and a method for using the wafer blade are described. The automatic sensing wafer blade is equipped with a V-shaped seal ring on a top surface, and a sensor of either a limit switch or a capacitance sensor for sensing the presence or absence of a wafer on top of the wafer blade. The automatic sensing wafer blade is further capable of self-diagnosing any potential failure conditions of the function of the wafer blade due to contaminating particles, or contaminating liquid on the wafer surface, or due to an aged or malfunctioning seal ring on top of the wafer blade.Type: GrantFiled: September 3, 2002Date of Patent: May 24, 2005Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Hsiao-Yi Li, Chin-Hsin Peng, Cheng-Shun Chan, Jiann-Sheng Chang, Chung-Hao Tseng, Chien-Ling Huang
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Publication number: 20040041421Abstract: An automatic sensing wafer blade for picking up wafers that is equipped with a sensor capable of self-diagnosing potential failure conditions of the blade and a method for using the wafer blade are described. The automatic sensing wafer blade is equipped with a V-shaped seal ring on a top surface, and a sensor of either a limit switch or a capacitance sensor for sensing the presence or absence of a wafer on top of the wafer blade. The automatic sensing wafer blade is further capable of self-diagnosing any potential failure conditions of the function of the wafer blade due to contaminating particles, or contaminating liquid on the wafer surface, or due to an aged or malfunctioning seal ring on top of the wafer blade.Type: ApplicationFiled: September 3, 2002Publication date: March 4, 2004Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yi-Li Hsiao, Chin-Hsin Peng, Cheng-Shun Chan, Jiann-Sheng Chang, Chung-Hao Tseng, Chien-Ling Huang