Patents by Inventor Chung-Hao Tzeng

Chung-Hao Tzeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Combination nozzle and vacuum hood that is self cleaning
    Patent number: 5988526
    Abstract: The invention provides a combination of a nozzle and a vacuum hood. The vacuum hood has a chamber that surrounds the tip of the nozzle and removes residue from the tip by a vacuum which flows in the chamber past the nozzle tip. This vacuum catches and removes residue from the nozzle tip and prevents the reside from interfering with the spraying action or dripping down. The method of the instant invention provides for dispensing a fluid from a nozzle without dripping fluid from the nozzle having a vacuum hood. The method comprises: (a) dispensing a fluid on a rotating semiconductor wafer through a nozzle over the wafer; (b) terminating the fluid flow through the nozzle; (c) creating an upward flow of gas about the dispensing nozzle when the flow of fluid through the nozzle is terminated; (d) capturing any fluid residue from the nozzle in the upward flow of gas; (e) removing the wafer and positioning another wafer; and (f) terminating the upward flow of gas; and repeating the process of steps (a) through (f).
    Type: Grant
    Filed: March 9, 1998
    Date of Patent: November 23, 1999
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Hao Tzeng, Dong-Shiuh Cheng, Cherng-Yui Chang, Yung-Kai Lin
  • Combination nozzle and vacuum hood that is self cleaning
    Patent number: 5756155
    Abstract: The invention provides a combination of a nozzle and a vacuum hood. The vacuum hood has a chamber that surrounds the tip of the nozzle and removes residue from the tip by a vacuum which flows in the chamber past the nozzle tip. This vacuum catches and removes residue from the nozzle tip and prevents the reside from interfering with the spraying action or dripping down. The method of the instant invention provides for dispensing a fluid from a nozzle without dripping fluid from the nozzle having a vacuum hood. The method comprises: (a) dispensing a fluid on a rotating semiconductor wafer through a nozzle over the wafer; (b) terminating the fluid flow through the nozzle; (c) creating an upward flow of gas about the dispensing nozzle when the flow of fluid through the nozzle is terminated; (d) capturing any fluid residue from the nozzle in the upward flow of gas; (e) removing the wafer and positioning another wafer; and (f) terminating the upward flow of gas; and repeating the process of steps (a) through (f).
    Type: Grant
    Filed: January 22, 1996
    Date of Patent: May 26, 1998
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Hao Tzeng, Dong-Shiuh Cheng, Cherng-Yui Chang, Yung-Kai Lin