Abstract: An information handling system may include a processor, one or more audio speakers configured to play back audible audio signals, and a basic input/output system (BIOS) comprising a program of instructions comprising boot firmware configured to be the first code executed by the processor when the information handling system is booted or powered on in order to initialize the information handling system for operation. The BIOS may be further configured to monitor for an error occurring during execution of the BIOS and responsive to an error occurring during execution of the BIOS, cause the one or more audio speakers to play back a sequence of one or more multi-frequency audio signals encoding an identity of the error.

Abstract: It is checked, using machine learning, whether at least one fail bit in a memory block of a memory is unrepairable, according to a location of the at least one fail bit, and an available repair resource in the memory. When the checking indicates that the at least one fail bit is not unrepairable, it is determined whether a CSP containing constraints is solvable. The constraints correspond to the location of the at least one fail bit in the memory block, and the available repair resource. In response to determining that the CSP is not solvable, the memory block is marked as unrepairable or the memory is rejected. In response to the checking, using the machine learning, indicating that the at least one fail bit is unrepairable, the memory block is marked as unrepairable or the memory is rejected, without making further determinations as to repairability of the memory block.

Abstract: A method of fabricating a semiconductor device includes forming, over a substrate, alternating layers of a first semiconductor layer formed of a first semiconductor material and a second semiconductor layer formed of a second semiconductor material, the first semiconductor layers including a first, a second, and a third sub-layers; patterning the alternating layers of the first and the second semiconductor layers to form stacks of the alternating layers; and exposing, under etch conditions, lateral edges of the alternating layers to an etchant to selectively etch recesses in the lateral edges of the first, the second, and the third sub-layers, such that a first lateral depth of the first sub-layer is greater than a second lateral depth of the second sub-layer, and the second lateral depth of the second sub-layer is greater than a third lateral depth of the third sub-layer.

Abstract: A manufacturing method of a semiconductor package is provided. The method includes: providing an initial rigid-flexible substrate, wherein the initial rigid-flexible substrate includes rigid structures and a flexible core laterally penetrating through the rigid structures, and further includes a supporting frame connected to the rigid structures; bonding a package structure onto the initial rigid-flexible substrate, wherein the package structure includes semiconductor dies and an encapsulant laterally surrounding the semiconductor dies; and removing the supporting frame.

Abstract: A semiconductor device includes a semiconductor layer. A gate structure is disposed over the semiconductor layer. A spacer is disposed on a sidewall of the gate structure. A height of the spacer is greater than a height of the gate structure. A liner is disposed on the gate structure and on the spacer. The spacer and the liner have different material compositions.

Abstract: A method for fabricating a semiconductor device includes the steps of forming a fin-shaped structure on a substrate, forming a first trench and a second trench in the fin-shaped structure, forming a first dielectric layer in the first trench and the second trench, removing part of the first dielectric layer, forming a second dielectric layer in the first trench and the second trench to form a first single diffusion break (SDB) structure and a second SDB structure, and then forming a gate structure on the fin-shaped structure, the first SDB structure, and the second SDB structure.

Abstract: An embodiment is a device including an integrated circuit die having an active side and a back side, the back side being opposite the active side, a molding compound encapsulating the integrated circuit die, and a first redistribution structure overlying the integrated circuit die and the molding compound, the first redistribution structure including a first metallization pattern and a first dielectric layer, the first metallization pattern being electrically coupled to the active side of the integrated circuit die, at least a portion of the first metallization pattern forming an inductor.

Abstract: Semiconductor structures and methods of forming the same are provided. A semiconductor structure includes gate electrodes and first insulation patterns laterally disposed and alternately arranged on a substrate, a gate dielectric layer disposed on the gate electrodes and the first insulation patterns, at least one channel pattern disposed on the gate dielectric layer, source electrodes and drain electrodes laterally disposed and alternately arranged on the channel pattern, and second insulation patterns disposed on the channel pattern between the source and drain electrodes. Besides, from a top view, each of the drain electrodes is overlapped with one of the first insulation patterns.

Abstract: A manufacturing method of a semiconductor package is provided. The method includes: providing an initial rigid-flexible substrate, wherein the initial rigid-flexible substrate includes rigid structures and a flexible core laterally penetrating through the rigid structures, and further includes a supporting frame connected to the rigid structures; bonding a package structure onto the initial rigid-flexible substrate, wherein the package structure includes semiconductor dies and an encapsulant laterally surrounding the semiconductor dies; and removing the supporting frame.

Abstract: A dummy gate electrode and a dummy gate dielectric are removed to form a recess between adjacent gate spacers. A gate dielectric is deposited in the recess, and a barrier layer is deposited over the gate dielectric. A first work function layer is deposited over the barrier layer. A first anti-reaction layer is formed over the first work function layer, the first anti-reaction layer reducing oxidation of the first work function layer. A fill material is deposited over the first anti-reaction layer.

Abstract: A lighting decoration module includes an LGP, at least one light source, and first and second optical microstructures. The LGP has at least one light incident surface and first and second light exit surfaces that are opposite to each other and connect the light incident surface. The light source corresponds to the light incident surface. The first optical microstructures are disposed on the first light exit surface and each has a first surface facing the light source. A first angle between the first surface and the first light exit surface is within a range from 40-60 degrees or 15-35 degrees. The second optical microstructures are disposed on the second light exit surface and each has a second surface facing the light source. A second angle between the second surface and the second light exit surface is within a range from 40-60 degrees.

Abstract: An anti-peep light source module and an anti-peep display device having an anti-peep function and good image quality are provided. The anti-peep light source module includes a light guide plate, a first light emitting element, a second light emitting element, a plurality of optical microstructures and a first surface. The light guide plate has a first light incident surface and a second light incident surface. Each of the optical microstructures has a first optical surface facing the first light incident surface and a second optical surface facing the second light incident surface. A magnitude of a first included angle between the first optical surface and the first surface and a magnitude of a second included angle between the second optical surface and the first surface gradually change as getting farther away from the first surface.

Abstract: An anti-peep display device includes a display module and an anti-peep module disposed on the display module. The anti-peep module includes the following features. The first light incident surface faces the display surface, the second and third light incident surfaces are located on opposite sides of the first light incident surface, the first condensing portion is disposed corresponding to the second light incident surface and the first light source, the second condensing portion is disposed corresponding to the third light incident surface and the second light source, the first and second condensing portions convert beams of the first and second light sources into anti-peep beams with a beam angle less than 10 degrees, and the optical microstructures reflect the anti-peep beams and exit the anti-peep beams from the light guide plate. The present invention also provides an anti-peep method applicable to the anti-peep display device.

Abstract: An anti-peep display device includes a display module and an anti-peep module disposed on the display module. The anti-peep module includes the following features. The first light incident surface faces the display surface, the second and third light incident surfaces are located on opposite sides of the first light incident surface, the first condensing portion is disposed corresponding to the second light incident surface and the first light source, the second condensing portion is disposed corresponding to the third light incident surface and the second light source, the first and second condensing portions convert beams of the first and second light sources into anti-peep beams with a beam angle less than 10 degrees, and the optical microstructures reflect the anti-peep beams and exit the anti-peep beams from the light guide plate. The present invention also provides an anti-peep method applicable to the anti-peep display device.

Abstract: A light source module including a light guide plate, a first light source and a plurality of first optical microstructures is provided. The light guide plate has a first incident surface and a bottom surface connected to the first incident surface. The first light source is disposed on a side of the first incident surface of the light guide plate. The first optical microstructures are disposed on the bottom surface. Each of the first optical microstructures has a first light receiving surface disposed toward the first light source. Each of the first light receiving surfaces of a first portion of the first optical microstructures has a first edge at a junction with the bottom surface, and a perpendicular bisector of the first edge passes through the first light source.

Abstract: A display device, including a display module and a peep-proof light source module, is provided. The display module is used to provide a display beam. The peep-proof light source module is disposed on a transmission path of the display beam and includes at least one light emitting element, a light guide plate, and optical microstructures. The light emitting element is used to provide a privacy light. The light guide plate has at least one light incident surface. Each optical microstructure has an optical surface facing the light incident surface. At least part of the privacy light is reflected by the optical surface and then exits the light guide plate. The distribution density of the optical microstructures on the light guide plate close to the light incident surface is substantially the same as the distribution density away from the light incident surface and close to the center.

Abstract: A display device, including a display module and a peep-proof light source module, is provided. The display module is used to provide a display beam. The peep-proof light source module is disposed on a transmission path of the display beam and includes at least one light emitting element, a light guide plate, and optical microstructures. The light emitting element is used to provide a privacy light. The light guide plate has at least one light incident surface. Each optical microstructure has an optical surface facing the light incident surface. At least part of the privacy light is reflected by the optical surface and then exits the light guide plate. The distribution density of the optical microstructures on the light guide plate close to the light incident surface is substantially the same as the distribution density away from the light incident surface and close to the center.

Abstract: The invention provides a light source module including a light guide plate and light emitting elements. The light guide plate includes a main plate body and a plurality of optical microstructures. The main plate body has a light emitting surface and a back surface opposite to each other, and a light incident surface connected therebetween. The optical microstructures are formed on the back surface. Each optical microstructure includes at least two sections connected to each other, each section having a reflective surface. The light emitting elements are disposed on the light incident surface, and light emitted by each of the light emitting elements is reflected by at least some of the reflective surfaces and transmitted to the light emitting surface. In any optical microstructure, the reflective surfaces are not parallel to each other.

Abstract: A light source module including a light guide plate, a first light source and a plurality of first optical microstructures is provided. The light guide plate has a first incident surface and a bottom surface connected to the first incident surface. The first light source is disposed on a side of the first incident surface of the light guide plate. The first optical microstructures are disposed on the bottom surface. Each of the first optical microstructures has a first light receiving surface disposed toward the first light source. Each of the first light receiving surfaces of a first portion of the first optical microstructures has a first edge at a junction with the bottom surface, and a perpendicular bisector of the first edge passes through the first light source.

Abstract: A display apparatus with multi screens includes a plurality of display screens and a prism structure optical element disposed between two adjacent display screens. The prism structure optical element includes a base and a plurality of prism pillars arranged on the base in a predetermined direction and facing two adjacent display screens. The base includes adjacent a first region and a second region. Lengths of the first region and the second region along the predetermined direction are La and Lb, respectively, wherein La?Lb. The prism pillars include a plurality of first prism pillars arranged in the first region and a plurality of second prism pillars arranged in the second region. Each of the first prism pillars and the second prism pillars respectively has a total reflecting surface and a refracting surface. The total reflecting surface is located between the refracting surface and an adjacent area.