Abstract: An image sensor package includes: a package base substrate having a cavity extending inwards from an upper surface thereof, and including a plurality of upper surface connection pads and a plurality of lower surface connection pads; an image sensor chip in the cavity, and including a chip body having a first surface and a second surface facing each other, a sensor unit located in the first surface of the chip body, and a plurality of chip pads around the sensor unit; a filter glass above the image sensor chip, and including a transparent substrate and a plurality of redistribution patterns on a lower surface of the transparent substrate; and a plurality of connection terminals between the plurality of redistribution patterns and the plurality of chip pads and between the plurality of redistribution patterns and the plurality of upper surface connection pads.

Abstract: A semiconductor device includes a pad disposed on a semiconductor layer, an insulating layer disposed between the semiconductor layer and the pad, a through-via penetrating the semiconductor layer and the insulating layer so as to be connected to the pad, and an isolation layer penetrating the semiconductor layer and surrounding the pad when viewed from a plan view.

Abstract: A semiconductor device includes a pad disposed on a semiconductor layer, an insulating layer disposed between the semiconductor layer and the pad, a through-via penetrating the semiconductor layer and the insulating layer so as to be connected to the pad, and an isolation layer penetrating the semiconductor layer and surrounding the pad when viewed from a plan view.

Abstract: An image sensor includes a substrate, a shallow trench isolation layer, a first deep trench isolation layer, and a second deep trench isolation layer. The substrate includes a first surface, a second surface opposing the first surface, and a plurality of unit pixel regions. The shallow trench isolation layer is adjacent to the first surface. The first deep trench isolation layer is adjacent to the shallow trench isolation layer and extends toward the second surface in the substrate. The second deep trench isolation layer is adjacent to the second surface and vertically overlaps the first deep trench isolation layer. The first and second deep trench isolation layers isolate the unit pixel regions from each other.

Abstract: An image sensor includes a substrate, a shallow trench isolation layer, a first deep trench isolation layer, and a second deep trench isolation layer. The substrate includes a first surface, a second surface opposing the first surface, and a plurality of unit pixel regions. The shallow trench isolation layer is adjacent to the first surface. The first deep trench isolation layer is adjacent to the shallow trench isolation layer and extends toward the second surface in the substrate. The second deep trench isolation layer is adjacent to the second surface and vertically overlaps the first deep trench isolation layer. The first and second deep trench isolation layers isolate the unit pixel regions from each other.