Patents by Inventor Chung-Hsiang Wang
Chung-Hsiang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11984668Abstract: A device includes a patch antenna, which includes a feeding line, and a ground panel over the feeding line. The ground panel has an aperture therein. A low-k dielectric module is over and aligned to the aperture. A patch is over the low-k dielectric module.Type: GrantFiled: June 28, 2021Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Monsen Liu, Lai Wei Chih, Chung-Hao Tsai, Jeng-Shien Hsieh, En-Hsiang Yeh, Chuei-Tang Wang
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Package structure comprising buffer layer for reducing thermal stress and method of forming the same
Patent number: 11961777Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.Type: GrantFiled: June 27, 2022Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo, Jung-Wei Cheng, Tsung-Ding Wang, Yu-Hsiang Hu, Sih-Hao Liao -
Publication number: 20240120304Abstract: The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a package structure, a circuit structure, a bonding structure and an external element. The circuit structure is disposed on the package structure and is electrically connected to the package structure. The circuit structure has a recess. The bonding structure includes a first bonding pad and a second bonding pad. The second bonding pad is disposed in the recess, and the second bonding pad is disposed on the first bonding pad. The bonding structure is disposed between the circuit structure and the external element. The external element is electrically connected to the circuit structure through the bonding structure. A width of the first bonding pad is smaller than a width of the second bonding pad.Type: ApplicationFiled: November 24, 2022Publication date: April 11, 2024Applicant: Innolux CorporationInventors: Tzu-Sheng Wu, Haw-Kuen Liu, Chung-Jyh Lin, Cheng-Chi Wang, Wen-Hsiang Liao, Te-Hsun Lin
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Publication number: 20240107414Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for switching a secondary cell to a primary cell. A user equipment (UE) monitors a first radio condition of the UE for beams of a primary cell and a second radio condition for beams of one or more secondary cells configured for the UE in carrier aggregation. The UE transmits a request to configure a candidate beam of at least one candidate secondary cell as a new primary cell in response to the first radio condition not satisfying a first threshold and the second radio condition for the at least one candidate secondary cell satisfying a second threshold. A base station determines to reconfigure at least one secondary cell as the new primary cell. The base station and the UE perform a handover of the UE to the new primary cell.Type: ApplicationFiled: September 23, 2022Publication date: March 28, 2024Inventors: Yu-Chieh HUANG, Kuhn-Chang LIN, Jen-Chun CHANG, Wen-Hsin HSIA, Chia-Jou LU, Sheng-Chih WANG, Chenghsin LIN, Yeong Leong CHOO, Chun-Hsiang CHIU, Chihhung HSIEH, Kai-Chun CHENG, Chung Wei LIN
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Patent number: 10067320Abstract: A lens module includes a lens set and a prism. The lens set has a first light emitting surface and a first engaging structure, wherein the first engaging structure is formed on the first light emitting surface. The prism is disposed adjacent to the lens set. The prism has a light incident surface and a second engaging structure, wherein the second engaging structure is formed on the light incident surface. The lens set and the prism are assembled with each other by engaging the first engaging structure with the second engaging structure.Type: GrantFiled: November 10, 2015Date of Patent: September 4, 2018Assignee: HIMAX TECHNOLOGIES LIMITEDInventors: Yin-Dong Lu, Han-Ching Lin, Yu-Feng Yen, Chung-Hsiang Wang
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Publication number: 20170131529Abstract: A lens module includes a lens set and a prism. The lens set has a first light emitting surface and a first engaging structure, wherein the first engaging structure is formed on the first light emitting surface. The prism is disposed adjacent to the lens set. The prism has a light incident surface and a second engaging structure, wherein the second engaging structure is formed on the light incident surface. The lens set and the prism are assembled with each other by engaging the first engaging structure with the second engaging structure.Type: ApplicationFiled: November 10, 2015Publication date: May 11, 2017Inventors: Yin-Dong Lu, Han-Ching Lin, Yu-Feng Yen, Chung-Hsiang Wang
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Publication number: 20130256540Abstract: The present invention provides a readout device of an accelerator beam monitoring detector, comprising: a transimpedance amplifier receiving a charge signal from a particle detector and converting the charge signal into an analog voltage signal; and a data acquisition system comprising an analog-to-digital converter (ADC) to covert the analog voltage signal into digital data.Type: ApplicationFiled: March 26, 2013Publication date: October 3, 2013Applicants: Academia Sinica, National United University, National Central UniversityInventors: PING-KUN TENG, AUGUSTINE EI-FANG CHEN, MING-LEE CHU, CHIH-HSUN LIN, CHUNG-HSIANG WANG
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Patent number: 8250471Abstract: An electronic device and a method for controlling an user interface thereof are provided. The method includes detecting an orientation of the electronic device, determining a arrangement of the user interface according to the detected orientation, displaying a shortcut key area and a status area on the user interface, and adjusting the user interface according to the operational signals from a touch panel of the electronic device.Type: GrantFiled: November 11, 2009Date of Patent: August 21, 2012Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) LimitedInventors: Chung-Hsiang Wang, Yu-Sheng Hou, Jian-Cheng Lin, El-Hinn Elizabeth, Pei-Hsi Cheng, Zhi-Fang Chen, Bor-Chuan Lin, Jiing-Renn Yu, Tzu-Cheng Yu
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Publication number: 20100287469Abstract: An electronic device and a method for controlling an user interface thereof are provided. The method includes detecting an orientation of the electronic device, determining a arrangement of the user interface according to the detected orientation, displaying a shortcut key area and a status area on the user interface, and adjusting the user interface according to the operational signals from a touch panel of the electronic device.Type: ApplicationFiled: November 11, 2009Publication date: November 11, 2010Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITEDInventors: CHUNG-HSIANG WANG, YU-SHENG HOU, JIAN-CHENG LIN, EL-HINN ELIZABETH, PEI-HSI CHENG, ZHI-FANG CHEN, BOR-CHUAN LIN, JIING-RENN YU, TZU-CHENG YU
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Patent number: 7795131Abstract: A method of fabricating metal interconnects and an inter-metal dielectric layer thereof. A first metal interconnect pattern and a second metal interconnect pattern disposed thereon are formed on a substrate by plating processes. Subsequently, an inter-metal dielectric layer is formed on the substrate, the first metal interconnect pattern and the second metal interconnect pattern. The inter-metal dielectric layer is then planarized and the second metal interconnect pattern is exposed.Type: GrantFiled: March 12, 2007Date of Patent: September 14, 2010Assignee: Touch Micro-System Technology Inc.Inventors: Kuan-Jui Huang, Jie-Mei Huang, Chung-Hsiang Wang
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Publication number: 20080146021Abstract: A method of fabricating metal interconnects and an inter-metal dielectric layer thereof. A first metal interconnect pattern and a second metal interconnect pattern disposed thereon are formed on a substrate by plating processes. Subsequently, an inter-metal dielectric layer is formed on the substrate, the first metal interconnect pattern and the second metal interconnect pattern. The inter-metal dielectric layer is then planarized and the second metal interconnect pattern is exposed.Type: ApplicationFiled: March 12, 2007Publication date: June 19, 2008Inventors: Kuan-Jui Huang, Jie-Mei Huang, Chung-Hsiang Wang
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Publication number: 20030133630Abstract: A packaging device with a fake-proof adhesive tape is proposed, including a body; a cover integrally formed with the body, for sealing an open end of the body; a fake-proof adhesive tape containing a thin sheet of substrate, and attached to the cover for adhering the cover to the body; a first adhesive layer applied over a first surface of the substrate, for attaching the fake-proof adhesive tape onto the cover; a fake-proof mark layer printed on a second surface of the substrate, and being adherent with the substrate; a colored layer for covering the mark layer and the second surface of the substrate; a transparent or semi-transparent viscous film applied over the colored layer; and a second adhesive layer formed on the viscous film, for adhering the fake-proof adhesive tape to the body.Type: ApplicationFiled: January 16, 2003Publication date: July 17, 2003Inventor: Chung-Hsiang Wang