Patents by Inventor Chung-Hsiao Lai

Chung-Hsiao Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180186133
    Abstract: An adhesive composition is provided. The adhesive composition includes an organic silicon polymer, a silicon coupling agent, carboxylic polyester, and a solvent. Based on the total weight of the adhesive composition, the content of the organic silicon polymer is 10 wt % to 60 wt %, the content of the silicon coupling agent is 10 wt % to 60 wt %, and the content of the carboxylic polyester is 10 wt % to 60 wt %.
    Type: Application
    Filed: March 3, 2017
    Publication date: July 5, 2018
    Applicant: TAIFLEX Scientific Co., Ltd.
    Inventors: Hsiu-Chu Wu, Meng-Cheng Tsai, Chung-Hsiao Lai