Patents by Inventor Chung Hsiao Lee

Chung Hsiao Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Envelope with openable structure
    Patent number: 5732877
    Abstract: An envelope with openable structure includes a front panel, a back panel and a closure flap. The front panel has a front inner and a front outer opposed surface, a front top edge, a front bottom edge, and a front first and a front second opposed side edge. The back panel has a back inner and a back outer opposed surface, a back top edge, a back bottom edge connected to said front bottom edge of said front panel to form a bottom folding line, and a back first and a back second opposed side edge connected to said front first and second side edges respectively to form a first and a second side folding line respectively. The closure flap is extended from said front top edge of said front panel and forms a front folding line therebetween for overlapping and adhering onto said back outer surface of said back panel.
    Type: Grant
    Filed: June 13, 1996
    Date of Patent: March 31, 1998
    Inventor: Chung Hsiao Lee