Patents by Inventor Chung-Hsien Chen
Chung-Hsien Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240395894Abstract: Middle-of-line (MOL) interconnects and corresponding techniques for forming the MOL interconnects are disclosed herein. An exemplary MOL interconnect structure includes a barrier-free source/drain contact, a barrier-free source/drain via, and a barrier-free gate via disposed in an insulator layer. The barrier-free source/drain is disposed on an epitaxial source/drain, and the barrier-free source/drain contact includes tungsten, molybdenum, or a combination thereof. The barrier-free source/drain via is disposed on the barrier-free source/drain contact and the barrier-free source/drain via includes molybdenum. The barrier-free gate via is disposed on a gate stack disposed adjacent to the epitaxial source/drain, and the barrier-free gate via includes tungsten, molybdenum, or a combination thereof. A width of the barrier-free source/drain via and/or the barrier-free gate via may be less than about 16 nm. The barrier-free source/drain via and/or the barrier-free gate via may be formed at the same time (e.g.Type: ApplicationFiled: September 14, 2023Publication date: November 28, 2024Inventors: Hsiao Chu Chen, Chung-Ting Li, Wei-Hsuan Chen, Che Chia Chang, Kan-Ju Lin, Yi-Hsien Chen
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Publication number: 20240395785Abstract: A method and wafer stack that includes a first wafer component, a second wafer component, and third wafer component. The first wafer component includes a frontside and a backside. The wafer stack also includes a second wafer component having a frontside and a backside, such that the frontside of the second wafer component is bonded to the frontside of the first wafer component. In addition, the wafer stack includes a third wafer component having a frontside and a backside, such that the frontside of the third wafer component is bonded to the backside of the second wafer component. The first wafer component includes a composite metal grid array with one or more photodiodes formed on the backside.Type: ApplicationFiled: May 23, 2023Publication date: November 28, 2024Inventors: Ming-Hsien Yang, Chun-Hao Chou, Chia-Yu Wei, Kuo-Cheng Lee, Chung-Liang Cheng, Sheng-Chau Chen
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Publication number: 20240393680Abstract: A photomask cleaning tool includes various components to automatically remove a particle from a pellicle, such as a multi-jet nozzle to standardize and control the use of a gas to remove the particle, an ultrasonic probe to loosen the particle from the surface of the pellicle, a plurality of multi-jet nozzles to direct gas toward the particle from different directions, a control system to control the automated blower for various sizes and shapes of photomasks and for optimized particle removal techniques, and/or the like. In this way, the photomask cleaning tool is capable of removing a particle from a pellicle of a photomask in a manner that increases the effectiveness of removing the particle and reduces the likelihood of damage to the pellicle, which would otherwise result in expensive and time-consuming photomask rework.Type: ApplicationFiled: July 30, 2024Publication date: November 28, 2024Inventors: Pin Cheng CHEN, Chih-Wei WEN, Chung-Hung LIN, Ting-Hsien KO
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Publication number: 20240371816Abstract: A bonded assembly may be formed by: disposing a packaging substrate having substrate-side bonding structures over a transparent plate; heating the packaging substrate using radiative heating in which a radiative heating source provides radiation to a bottom surface of the packaging substrate through the transparent plate; attaching a semiconductor die having die-side bonding structures to a bottom of a thermocompressive bonding head; bringing the semiconductor die and the packaging substrate to indirect contact with each other with an array of solder material portions therebetween; and bonding the semiconductor die to the packaging substrate by reflowing and solidifying the solder material portions.Type: ApplicationFiled: May 5, 2023Publication date: November 7, 2024Inventors: Ming-Hua Lo, Wei-Hung Lin, Chung-Chih Chen, Hsin-Hsien Wu, Chyi Shyuan Chern
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Publication number: 20240363312Abstract: Methods and systems for uniformly cooling a dome within a plasma treatment system are disclosed. The methods and systems utilize a diffuser including a perforated plate and a cone. The perforated plate includes a center portion and multiple arrays of holes with each array being located circumferentially at a different distance from the center. The cone extends away from the center. The diffuser spreads cooling gas more uniformly across the surface of the dome.Type: ApplicationFiled: July 10, 2024Publication date: October 31, 2024Inventors: Cheng Kuang Tso, Chou-Feng Lee, Chih-Hsien Hsu, Chung-Hsiu Cheng, Jr-Sheng Chen
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Publication number: 20240344976Abstract: A system for monitoring a precursor tank during a deposition process includes a sensor and a signal processor. The sensor includes a sensor chamber connected in line with the precursor tank and a deposition chamber, a radiation emitter to emit a radiation passing through a precursor-containing gas in the sensor chamber, and a radiation receiver to receive the radiation passed through the precursor-containing gas. The signal processor obtains an absorption spectrum of the precursor-containing gas from the received radiation and determines a remaining precursor amount in the precursor tank based on the absorption spectrum. The system facilitates inline monitoring the remaining precursor amount in the precursor tank during a deposition operation, thereby advantageously reducing risks of undergoing a deposition operation while the remaining precursor amount is unacceptably low and avoiding replacing the precursor tank while the remaining precursor amount is acceptable.Type: ApplicationFiled: April 14, 2023Publication date: October 17, 2024Inventors: Chia-Hsi WANG, Yen-Yu CHEN, Jui-Mu CHO, Chung Hsien LIAO
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Patent number: 12106036Abstract: A document processing device, a method of processing an image thereof, and a computer program product are disclosed. A set of display area information is preset on the document processing device. When the document processing device receives an input image, a set of reference information corresponding to the input image is obtained. The document processing device adjusts the input image according to the set of display area information and the set of reference information to generate an improved preview image. Because the user does not need to consider the direction in which the document is put into the document processing device, the document processing device directly and automatically generates the preview image that is convenient for the user to view based on the input image, thereby achieving the purpose of improving work efficiency, the convenience in use, and the user experience.Type: GrantFiled: July 25, 2022Date of Patent: October 1, 2024Inventors: Syu-Yang Chen, Chung-Hsien Yeh
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Patent number: 12085848Abstract: A photomask cleaning tool includes various components to automatically remove a particle from a pellicle, such as a multi-jet nozzle to standardize and control the use of a gas to remove the particle, an ultrasonic probe to loosen the particle from the surface of the pellicle, a plurality of multi-jet nozzles to direct gas toward the particle from different directions, a control system to control the automated blower for various sizes and shapes of photomasks and for optimized particle removal techniques, and/or the like. In this way, the photomask cleaning tool is capable of removing a particle from a pellicle of a photomask in a manner that increases the effectiveness of removing the particle and reduces the likelihood of damage to the pellicle, which would otherwise result in expensive and time-consuming photomask rework.Type: GrantFiled: July 31, 2020Date of Patent: September 10, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Pin Cheng Chen, Chih-Wei Wen, Chung-Hung Lin, Ting-Hsien Ko
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Patent number: 12086085Abstract: A motor driver, a control method of the motor driver, and a motor driving system are provided. The motor driver includes a rotation information pin, an analog detecting circuit and a mode switching circuit. The rotation information pin is configured to receive a reference signal. The analog detecting circuit and the mode switching circuit are respectively and electrically connected to the rotation information pin and the analog detecting circuit. The analog detecting circuit determines whether the reference signal is an analog signal, and the motor driver is maintained in a master mode when the reference signal does not belong to the analog signal. The mode switching circuit determines whether the reference signal is a noise when the reference signal is the analog signal. The mode switching circuit switches the motor driver from the master mode to a slave mode when the reference signal is not the noise.Type: GrantFiled: November 17, 2021Date of Patent: September 10, 2024Assignee: ANPEC ELECTRONICS CORPORATIONInventors: Li-Wei Chen, Chung-Hsien Fu, Kun-Min Chen
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Publication number: 20240274508Abstract: A method includes: accessing a first cell, where the first cell includes: a first active region and a second active; gate electrodes arranged in a second layer over the first layer; first conductive lines extending in the second layer; second conductive lines extending in the second layer; a third and a fourth conductive lines extending in a third layer over the second layer; and first gate vias arranged in a fourth layer and electrically coupled to the gate electrodes. The method also includes: determining a performance metric and a dielectric voltage stress level; and in response to the performance metric or the dielectric voltage stress level failing to fulfilling a specification, revising the first cell to generate a second cell by moving at least one of the first gate vias to be electrically coupled to the fourth conductive line.Type: ApplicationFiled: February 15, 2023Publication date: August 15, 2024Inventors: CHUNG-CHIEH YANG, MING-YIH WANG, PO-HSIEN CHEN, YI-JUI CHANG
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Publication number: 20240274100Abstract: A frame rate control method is provided. A primary scenario and a non-primary scenario are identified according to two or more windows displayed on a screen. Each of the primary scenario and the non-primary scenario is performed by an individual application. A frame rate of the non-primary scenario is decreased when a performance index indicates that a first condition is present. The application corresponding to the non-primary scenario is disabled when the performance index indicates that a second condition is present after decreasing the frame rate of the non-primary scenario, so as to remove the window corresponding to the non-primary scenario from the screen.Type: ApplicationFiled: January 18, 2024Publication date: August 15, 2024Inventors: Chung-Yang CHEN, Chia-Chun HSU, Jei-Feng LI, Yi-Hsin SHEN, Guo LI, Ta-Chang LIAO, Yu-Chia CHANG, Hung-Hao CHANG, Po-Ting CHEN, Yu-Hsien LIN
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Patent number: 12062523Abstract: Methods and systems for uniformly cooling a dome within a plasma treatment system are disclosed. The methods and systems utilize a diffuser including a perforated plate and a cone. The perforated plate includes a center portion and multiple arrays of holes with each array being located circumferentially at a different distance from the center. The cone extends away from the center. The diffuser spreads cooling gas more uniformly across the surface of the dome.Type: GrantFiled: February 14, 2022Date of Patent: August 13, 2024Assignee: Taiwan SemiConductor Manufacturing Company, LTD.Inventors: Cheng Kuang Tso, Chou-Feng Lee, Chih-Hsien Hsu, Chung-Hsiu Cheng, Jr-Sheng Chen
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Publication number: 20240265956Abstract: A memory chip includes a first decoding device and a memory device. The first decoding device is configured to generate multiple word line signals. The memory device is configured to generate a third data signal based on a first data signal and a second data signal. The memory device includes a first memory circuit and a second memory circuit. The first memory circuit is configured to generate the first data signal at a first node according to the word line signals during a first period. The second memory circuit is configured to generate the second data signal at a second node different from the first node according to the word line signals during a second period after the first period. A method of operating a memory chip is also disclosed herein.Type: ApplicationFiled: April 15, 2024Publication date: August 8, 2024Inventors: Hsiang-Chi CHENG, Shyh-Bin KUO, Yi-Cheng LAl, Chung-Hung CHEN, Shih-Hsien YANG, Yu-Chih WANG, Kuo-Hsiang CHEN
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Publication number: 20240258390Abstract: A semiconductor device includes a substrate, a gate structure on the substrate, a source/drain (S/D) region and a contact. The S/D region is located in the substrate and on a side of the gate structure. The contact lands on and connected to the S/D region. The contact wraps around the S/D region.Type: ApplicationFiled: April 15, 2024Publication date: August 1, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Po-Hsien Cheng, Jr-Hung Li, Tai-Chun Huang, Tze-Liang Lee, Chung-Ting Ko, Jr-Yu Chen, Wan-Chen Hsieh
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Publication number: 20240251568Abstract: A semiconductor device includes a substrate; a memory array over the substrate, the memory array including first magnetic tunnel junctions (MTJs), where the first MTJs are in a first dielectric layer over the substrate; and a resistor circuit over the substrate, the resistor circuit including second MTJs, where the second MTJs are in the first dielectric layer.Type: ApplicationFiled: April 4, 2024Publication date: July 25, 2024Inventors: Tai-Yen Peng, Tsung-Hsien Chang, Yu-Shu Chen, Chih-Yuan Ting, Jyu-Horng Shieh, Chung-Te Lin
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Publication number: 20240237953Abstract: Disclosed is a method for collecting and presenting physiological signal data and location information, comprising: receiving physiological signal data; providing a first user interface to receive a first user input, the first user interface including a first representation of human body or a part thereof, and the first user input including a first location of the first representation; converting the first location to a first location information according to a predetermined first mapping relationship; storing the physiological signal data in association with an identification of the first location information; and in response to a request, providing a second user interface, the second user interface including a selection function, which provides a second representation corresponding to the first representation, wherein when a second location in the second representation corresponding to the first location information is selected, the second user interface presents the physiological signal data.Type: ApplicationFiled: October 12, 2022Publication date: July 18, 2024Applicant: SyncVision Technology CorporationInventors: Kuan Hsien CHEN, Chia Hung WU, Chung Han LIU
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Patent number: 12031718Abstract: A system and method to prevent an oxidizer overheating using cold side bypass for a volatile organic compounds (VOCs) treatment system with a series rotor are described, which is mainly used in the organic waste air treatment system. The system is equipped with a thermal oxidizer (to), a first heat exchanger, a second heat exchanger, a third heat exchanger, a first cold-side transporting pipeline, a first adsorption rotor, a second adsorption rotor, and a chimney. A cold-side proportional damper is installed between the first desorption-treated air pipeline and the first cold-side transporting pipeline, or it is installed on the first desorption-treated air pipeline. When the VOCs concentration becomes higher, the cold-side proportional damper can regulate the airflow to adjust the heat-recovery amount or concentration, when treating the organic waste air, it can prevent the thermal oxidizer from being overheated due to high oxidizer temperature, and protect from thermal oxidizer shut-down.Type: GrantFiled: December 16, 2022Date of Patent: July 9, 2024Assignees: DESICCANT TECHNOLOGY CORPORATION, DESICCANT TECHNOLOGY(SHANGHAI) CORPORATIONInventors: Shih-Chih Cheng, Kuo-Yuan Lin, Ya-Ming Fu, Chung-Hsien Chen, Pang-Yu Liu
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Patent number: 12031719Abstract: The disclosure relates to preventing an oxidizer from overheating using cold side bypass during high input for a VOCs treatment system having a series rotor, which may be used in an organic waste air treatment system. The system includes a thermal oxidizer (TO), a first heat exchanger, a second heat exchanger, a third heat exchanger, a fourth heat exchanger, a first cold-side transporting pipeline, a fourth cold-side transporting pipeline, a first adsorption rotor, a second adsorption rotor, and a chimney. A cold-side proportional damper is installed between the first desorption-treated air pipeline and the first cold-side transporting pipeline, between the first desorption-treated air pipeline and the fourth cold-side transporting pipeline, or between the first cold-side transporting pipeline and the fourth cold-side transporting pipeline, or the damper is installed on the first desorption-treated air pipeline.Type: GrantFiled: February 17, 2023Date of Patent: July 9, 2024Assignees: DESICCANT TECHNOLOGY CORPORATION, DESICCANT TECHNOLOGY(SHANGHAI) CORPORATIONInventors: Shih-Chih Cheng, Kuo-Yuan Lin, Ya-Ming Fu, Chung-Hsien Chen, Pang-Yu Liu
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Publication number: 20230389492Abstract: The present invention generally relates to a hydroponic culture medium and a hydroponic planting system, more particularly to a Houttuynia cordata hydroponic culture medium, a Houttuynia cordata hydroponic planting system, Houttuynia cordata extracts, a method, and applications thereof.Type: ApplicationFiled: March 14, 2023Publication date: December 7, 2023Inventors: FANG-RONG CHANG, WEI-HUNG WU, YI-HONG TSAI, CHUNG-HSIEN CHEN, YEN-CHI LOO, HSUEH-ER CHEN, YEN-CHANG CHEN, HUI-PING HSIEH, CHEN HSIEH
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Patent number: 11767976Abstract: The instant disclosure described a system and method to prevent the oxidizer overheating using cold side bypass for a VOCs treatment system with series rotor, which may be used in an organic waste air treatment system. The system is equipped with a Thermal Oxidizer (TO), a First Heat Exchanger, a Second Heat Exchanger, a third heat exchanger, a First Cold-Side Transporting Pipeline, a First Adsorption Rotor, a Second Adsorption Rotor, and a Chimney. There is a Cold-Side Proportional Damper installed between the First Desorption-Treated Air Pipeline and the First Cold-Side Transporting Pipeline, or it is installed on the First Desorption-Treated Air Pipeline. When the VOCs concentration becomes higher, the Cold-Side Proportional Damper can regulate the airflow to adjust the heat-recovery amount or concentration, when treating the organic waste air, it can prevent the TO from being overheated due to high oxidizer temperature, and protect it from Thermal Oxidizer shut-down.Type: GrantFiled: July 5, 2021Date of Patent: September 26, 2023Assignees: DESICCANT TECHNOLOGY CORPORATION, DESICCANT TECHNOLOGY(SHANGHAI) CORPORATIONInventors: Shih-Chih Cheng, Kuo-Yuan Lin, Ya-Ming Fu, Chung-Hsien Chen, Pang-Yu Liu