Abstract: The present disclosure provides a voice coil structure, a method for manufacturing the voice coil structure, and a loudspeaker. The voice coil structure includes a first insulation layer, a first wiring layer, a second insulation layer, at least one second wiring layer, and a third insulation layer. The second insulation layer extends to wiring gaps of the first wiring layer. The third insulation layer extends to wiring gaps of the at least one second wiring layer. Each of the first wiring layer and the at least one second wiring layer has a winding structure. The first wiring layer is electrically connected in series or in parallel with the at least one second wiring layer and forming two output terminals.

Abstract: The present disclosure provides a voice coil structure and a loudspeaker. The voice coil structure includes a substrate, a first wiring layer disposed on the substrate, and a first insulation layer disposed on the first wiring layer. The first wiring layer has a winding structure. The first wiring layer further includes a first end and a second end. The first insulation layer defines a through hole and a first notch. The first end is exposed from the through hole, and the second end is exposed from the first notch.

Abstract: Provided is a headphone that can readily adjust the frequency response characteristics corresponding to the shape of a housing. The headphone includes a first sound emission unit and a head band. The first sound emission unit includes a driver unit, a baffle plate, a housing cover, and an acoustic resistor disposed between the driver unit and the housing cover. The housing cover defines a space together with the driver unit, and the baffle plate. The driver unit includes a diaphragm and a communication hole. The space has a first region and a second region. The diaphragm includes a main dome and an auxiliary dome. The communication hole includes a first communication hole facing the main dome and introducing first sound waves from the main dome to the first region and a second communication hole facing the auxiliary dome and introducing second sound waves from the auxiliary dome to the second region.

Abstract: A condenser microphone comprising: a mic capsule in which a capacitor is composed of a diaphragm and a counter electrode, and which effects electroacoustic conversion; a FET for impedance-converting audio signals output from the mic capsule; and a CR circuit composed of a resistor and a capacitor, and connected to the FET to adjust a signal level in a low frequency range, and in the condenser microphone, an output terminal may be drawn out from a drain of the FET; and the CR circuit may be connected in between a source of the FET and the ground, furthermore, in the condenser microphone, there may be provided a changeover switch for switching a mode in which the CR circuit is connected in between the source of the FET and the ground into another mode in which the CR circuit is short-circuited to connect the source of the FET to the ground.

Abstract: A condenser microphone comprising: a mic capsule in which a capacitor is composed of a diaphragm and a counter electrode, and which effects electroacoustic conversion; a FET for impedance-converting audio signals output from the mic capsule; and a CR circuit composed of a resistor and a capacitor, and connected to the FET to adjust a signal level in a low frequency range, and in the condenser microphone, an output terminal may be drawn out from a drain of the FET; and the CR circuit may be connected in between a source of the FET and the ground, furthermore, in the condenser microphone, there may be provided a changeover switch for switching a mode in which the CR circuit is connected in between the source of the FET and the ground into another mode in which the CR circuit is short-circuited to connect the source of the FET to the ground.